Patents Examined by Kyung S. Lee
  • Patent number: 11037709
    Abstract: A chromaticity of zinc oxide is measured. The durability of a zinc oxide varistor is evaluated based on the chromaticity. This provides a varistor with a high durability stably.
    Type: Grant
    Filed: February 18, 2019
    Date of Patent: June 15, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yoshiko Higashi, Eiichi Koga
  • Patent number: 11037742
    Abstract: A keyboard device includes a substrate, keycaps, and a frame. The substrate has a top surface and a bottom surface and includes a welding-fixing portion. The welding-fixing portion includes a through hole and an arch-shaped bridge member. The arch-shaped bridge member is connected in the through hole and divides the through hole into partition holes. The arch-shaped bridge member has an arch portion and bridge bases. The arch portion protrudes from the top surface to form a recessed portion. The frame is disposed on the top surface and includes hollow holes respectively corresponding to the keycaps. The frame includes a welding member, and the welding member includes welding posts and a welding-fixing base. The welding posts respectively pass through spaces between the edge portion of the through hole and the arch-shaped bridge member. The welding-fixing base is received and fixed in the through hole and the recessed portion.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: June 15, 2021
    Assignee: Chicony Electronics Co., Ltd.
    Inventors: Mitsuo Horiuchi, Chia-Hsin Chen, Po-Hsin Li
  • Patent number: 11017924
    Abstract: In a thermistor element, a thermistor body formed of a thermistor material, a conductive interlayer formed on the thermistor body, and an electrode layer formed on the conductive interlayer are provided, the conductive interlayer is formed along protrusions and recesses on a surface of the thermistor body, the conductive interlayer is a layer in which RuO2 grains in contact with each other are uniformly distributed and SiO2 interposes in gaps between the RuO2 grains, and the conductive interlayer is formed in a state of adhering to the thermistor body along the protrusions and the recesses on the surface of the thermistor body.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: May 25, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Takehiro Yonezawa, Kazutaka Fujiwara
  • Patent number: 11017922
    Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: May 25, 2021
    Assignee: ROHM CO., LTD.
    Inventor: Masaki Yoneda
  • Patent number: 11017923
    Abstract: A resistor component includes an insulating substrate having one surface and the other surface and one end surface and the other end surface, a slit portion disposed on the one end surface and the other end surface and extending to the one surface and the other surface, a resistor layer disposed on the one surface, and a first terminal and a second terminal connected to the resistor layer. The first and second terminals include: an internal electrode layer including an upper electrode disposed on the one surface, a lower electrode disposed on the other surface, and a slit electrode disposed on an internal wall of the slit portion, and an external electrode layer disposed on the one end surface, the other end surface, and the internal wall of the slit portion, being in contact with the slit electrode, having a thickness less than a thickness of the internal electrode layer.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: May 25, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Bok Ryu, Yeon Hee Shin, Ji Sook Yoon, Dong Woo Kim
  • Patent number: 11011290
    Abstract: The present disclosure provides a method for manufacturing a resistor. The method may include providing a resistor structure having a layer of first thermally conductive material covering at least a surface of the resistive body, the first thermally conductive material being semi-cured, semi-hardened and substantially non-fluid, and the layer of first thermally conductive material having a first thickness; bending a pair of electrodes at the opposite ends of the resistive body toward a surface of the layer of first thermally conductive material; and pressing the pair of electrodes against the surface of the layer of first thermally conductive material, while maintaining in a heated state the first thermally conductive material to cause further curing and hardening of the first thermally conductive material and a reduction in the first thickness, so as to obtain a cured and hardened thermally conductive layer having a desired second thickness.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: May 18, 2021
    Assignee: KOA CORPORATION
    Inventors: Yuichi Abe, Seiji Karasawa, Michio Kubota, Yoji Gomi, Koichi Minowa
  • Patent number: 10998114
    Abstract: The present invention is directed to a varistor comprising a dielectric material comprising a sintered ceramic composed of zinc oxide grains and a grain boundary layer between the zinc oxide grains. The grain boundary layer contains a positive temperature coefficient thermistor material in an amount of less than 10 mol % based on the grain boundary layer.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: May 4, 2021
    Assignee: AVX Corporation
    Inventors: Palaniappan Ravindranathan, Marianne Berolini
  • Patent number: 10998149
    Abstract: The key switch includes, a base, a button attached to the base so as to be capable of coming into contact with the base and separating from the base, and a coil spring disposed between the base and the button for urging the button in a direction separating from the base. The coil spring has at least an end turn portion formed at one end, a densely wound portion that is continuous with the end turn portion and compressed in an initial state in which the button is attached to the base so that adjacent windings come into contact with each other, and a coarsely wound portion which is continuous with the densely wound portion and in which a winding pitch is larger than that of the densely wound portion, and in the initial state, adjacent windings are separated from each other.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: May 4, 2021
    Assignee: Omron Corporation
    Inventors: Hiroaki Fujino, Kazuhira Izawa, Junichi Seto, Mamiko Naka
  • Patent number: 10991522
    Abstract: A movable contact includes a conductive member having an outer end having substantially a rectangular shape when viewed from above the conductive member. The conductive member includes a dome portion, a flange extending in a direction away from the dome portion, a connection portions provided at each of four corners of the rectangular shape, and a contact portion extending away from the flange. The connection portion, a first boundary portion where the connection portion is connected to the flange, and a second boundary portion where the connection portion is connected to the contact portion may constitute a drawn portion. Alternatively, the first and second boundary portions may be curved to be concave toward the dome portion.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: April 27, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryosuke Nakao, Koji Nishikawa
  • Patent number: 10989609
    Abstract: Under predetermined film depositing conditions, the raw material solution of the thermistor film is atomized or dropletized, the carrier gas is supplied to the obtained mist or droplet, the mist or droplet is conveyed to the substrate, and then the mist or droplet is thermally reacted on the substrate to deposit a film. A resultant thermistor thin film has a film thickness of 1 ?m or less, a film width of 5 mm or more, a thickness of 50 nm or more and 5 ?m or less, a thickness in the range of less than ±50 nm, a thickness of 5 mm or less, and/or a thickness of 50 nm or more and 5 ?m or less, and has a film surface roughness (Ra) of 0.1 ?m or less.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: April 27, 2021
    Assignee: FLOSFIA INC.
    Inventors: Shingo Yagyu, Takahiro Sasaki, Toshimi Hitora
  • Patent number: 10984927
    Abstract: A PTC thermistor switch for electric motors includes an insulating casing and a PTC thermistor housed in a housing seat made in the insulating casing. The PTC thermistor has a first face and a second face opposite the first face. A first electric terminal is housed in the insulating casing and has two protrusions in direct contact with the first face of the PTC thermistor in two opposite contact points with respect to the center of the first face. The switch also includes a second electric terminal housed in the insulating casing and an elastic arm portion in direct contact with the second face of the PTC thermistor in an intermediate contact point between the contact points of the protrusions. The second electric terminal is arranged so that the elastic arm portion presses against the second face of the PTC thermistor.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: April 20, 2021
    Assignee: ELECTRICA S.R.L.
    Inventors: Fabrizio Rotulo, Pietro Cecconi
  • Patent number: 10980122
    Abstract: A resistor assembly is disclosed and comprises a first conductive trace, a second conductive trace, and a plurality of trimming bridges that electrically couple the first conductive trace to the second conductive trace. The resistor assembly also comprises a thin film resistor electrically coupled to the first conductive trace. The first conductive trace, the second conductive trace, the plurality of trimming bridges, and the thin film resistor are all part of a surface mounted layer of the resistor assembly. The plurality of trimming bridges are each removable to increase a resistance of the thin film resistor.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: April 13, 2021
    Assignee: The Boeing Company
    Inventors: Kyu-Pyung Hwang, Young Kyu Song
  • Patent number: 10971287
    Abstract: A composite circuit protection device includes a positive temperature coefficient (PTC) component, a voltage-dependent resistor (VDR), and first and second conductive leads respectively bonded to the PTC component and the VDR. The PTC component includes a PTC layer having two opposite PTC surfaces, and first and second electrode layers each having an electrode surface which connects to and has an area smaller than that of a respective one of the PTC surfaces. The VDR includes a VDR layer having two opposite resistor surfaces, and third and fourth electrode layers each having an electrode surface which connects to and has an area smaller than that of a respective one of the resistor surfaces.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: April 6, 2021
    Assignee: FUZETEC TECHNOLOGY CO., LTD.
    Inventors: Jack Jih-Sang Chen, Chang-Hung Jiang
  • Patent number: 10964458
    Abstract: A resistor unit has a case with an opening face, a resistor housed in the case, cement that is filled inside the case to bury the resistor, and a lead-out terminal that is connected to the resistor in the cement and is led out of the cement through the opening face of the case. A lead-out terminal has a protrusion portion that protrudes in an opening direction that is across the opening face, and an extension portion that extends parallel to the opening face from the protrusion portion.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: March 30, 2021
    Assignee: DENSO CORPORATION
    Inventor: Yuya Kiuchi
  • Patent number: 10964457
    Abstract: The chip resistor according to the present disclosure includes insulating substrate, a pair of upper face electrodes provided on both ends of one face of insulating substrate, and resistor provided on the one face of insulating substrate and connected between the pair of upper face electrodes. The chip resistor includes a pair of end-face electrodes provided on both end faces of insulating substrate to be electrically connected to the pair of upper face electrodes, and plating layer formed on portions of the pair of upper face electrodes and faces of the pair of end-face electrodes. Insulating film formed of a resin is provided on another face opposite to the one face of insulating substrate. Insulating film has a thickness of more than or equal to 30 ?m.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: March 30, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takahiko Izawa, Kazuhiro Kanda, Hiroshi Saito, Takashi Morino
  • Patent number: 10964460
    Abstract: A PTC thermistor module for a temperature control device may include at least one PTC thermistor element. The PTC thermistor element may include an upper side and an underside facing away from the upper side. The upper side and on the underside may be respectively applied in a heat-exchanging manner with a heat-conducting plate. An edge side, connecting the upper side and the underside with one another in an edge-side manner, of at least one of the PTC thermistor elements, may be applied to a heat-conducting element, which has a thermal conductivity of at least 5 W/mK. A temperature control device may include at least one such PTC thermistor module.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: March 30, 2021
    Inventors: Michael Kohl, Falk Viehrig, Denis Wiedmann
  • Patent number: 10964461
    Abstract: A resistor element includes a base substrate having a first surface and a second surface, a resistive layer having a first surface disposed on the second surface of the base substrate, a second surface opposing the first surface of the resistive layer, and first to fourth sides connecting the first surface of the resistive layer to the second surface of the resistive layer, and internal electrodes spaced apart from each other on the second surface of the base substrate. The first and second sides of the resistive layer face each other in a direction in which the internal electrodes are spaced apart, and the third and fourth sides of the resistive layer connect the first and second sides. With the second surface of the base substrate, an angle between each of the third and fourth sides is greater than an angle between each of the first and second sides.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: March 30, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yeon Hee Shin, Ji Sook Yoon, Kwang Hyun Park
  • Patent number: 10964459
    Abstract: An electrical resistor has a resistance conductor, which is applied to a carrier layer, and two connection elements, which are electrically conductively connected to the resistance conductor. The two connection elements are configured to each be welded or soldered to an electrical contact in order to electrically contact the resistor. The resistance conductor for each connection element has a region that overlaps the corresponding connection element. The overlap region is in electrical contact with the corresponding connection element.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: March 30, 2021
    Assignee: Biotronik SE & Co. KG
    Inventors: Marc Hauer, Birgit Neubauer, Jochen Held, Martin Henschel, Thomas Pfefferkorn, Alexander Dettmer
  • Patent number: 10955298
    Abstract: An electronic device is provided. The electronic device includes a housing configured to form an external shape thereof, a first board disposed in a first direction that is away from the housing, wherein at least one processor is mounted at the first board, a second board disposed between the housing and the first board and electrically connected with the first board, and a thermistor mounted on the second board, wherein the at least one processor measures a temperature of the housing based on an electrical signal received from the second board.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: March 23, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Wanjae Ju, Hyoseok Na, Chanho Park
  • Patent number: 10950396
    Abstract: A switch device which is capable of ensuring mounting strength of an additional member while ensuring ease of operation. The switch device has an operating knob that transmits an input operation to a switch unit with an electric contact, and a housing that houses a switch unit. The housing that houses the switch unit has an opening via which the switch unit and the operating knob face each other. The housing has a water prevention wall installed in a standing manner to surround the opening. The operating knob has a box-shaped base member with one end thereof opened. An additional member with at least one insertion portion which is inserted into a through hole of the base member is mounted on the base member. The insertion portion extends to cross a standing direction of the water prevention wall, and as seen in the standing direction, the insertion portion and the opening are located away from each other.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: March 16, 2021
    Assignee: TOYO DENSO KABUSHIKI KAISHA
    Inventors: Takuya Takano, Koji Yamazaki