Abstract: A force sensitive resistor includes first and second electrical contacts, and a layer of deformable material impregnated with carbon nanotubes. The layer of deformable material is arranged between the first and second electrical contacts. A difference in the conductivity of the impregnated material caused by deformation of the material is detectable across the contacts. A method of manufacturing a force sensitive resistor includes the steps of providing first and second electrical contacts, and arranging a deformable material impregnated with carbon nanotubes between the first and second electrical contacts. Again, a difference in the conductivity of the impregnated material caused by deformation of the material is detectable across the contacts.

Abstract: A chip resistor includes a substrate, a resistor layer, a first conductive layer, an insulating layer, a second conductive layer, a third conductive layer, and a fourth conductive layer. The first conductive layer is electrically connected to the resistor layer. The insulating layer covers the resistor layer and the first conductive layer. The second conductive layer covers the first conductive layer and the insulating layer. The third conductive layer covers the second conductive layer and the insulating layer. The fourth conductive layer covers the second conductive layer and the third conductive layer. Bonding strength between the third and fourth conductive layer is stronger than that between the second and fourth conductive layer.

Abstract: Methods and apparatus providing a vertically constructed, temperature sensing resistor are disclosed. An example apparatus includes a semiconductor substrate including a plurality of resistor unit cells arranged in an array, each resistor unit cell formed within the semiconductor substrate and including a top contact. A conductive layer located over the semiconductor substrate electrically connects to a subset of the top contacts.

Abstract: A method for efficiently manufacturing chip resistors is provided. A method for efficiently manufacturing chip resistors includes the steps of preparing at least three conductive elongated boards made of an electrically conductive material and a resistive member made of a resistive material, arranging the at least three conductive elongated boards apart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boards is elongated, forming a resistor aggregate by bonding the resistive member to the at least three conductive elongated boards, and collectively dividing the resistor aggregate into a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.

Abstract: A strain gauge includes a flexible substrate, and resistors each formed of a Cr composite film. The resistors include a first resistor formed on one side of the substrate and includes a second resistor formed on another side of the substrate. The first resistor and the second resistor are arranged such that grid directions of the first resistor and the second resistor intersect in a plan view.

Abstract: A pressure sensor, a method for manufacturing the pressure sensor, and an electronic device are provided. The pressure sensor includes an electroluminescent device and a resistor layer. The resistor layer and one electrode of the electroluminescent device are connected to two electrodes of a power source respectively to form a loop. The pressure sensor is capable of converting a deformation amount caused by a pressure into a brightness change of the electroluminescent device, and determining a size of the pressure in accordance with the brightness change.

Abstract: A resistor component includes a support substrate, a resistive layer disposed on one surface of the support substrate, and a plurality of slits disposed in the resistive layer, each extending from one end or another end of the resistive layer opposing each other in a first direction, and spaced apart from each other in a second direction traversing the first direction. First and second internal electrodes are disposed on the support substrate and are respectively disposed on one end and another end of the resistive layer opposing each other in the second direction to be spaced apart from each other. A first protective layer is disposed on the resistive layer. The plurality of slits include a primary slit covered by the first protective layer, and a secondary slit extending in the first protective layer.

Abstract: An electrical disconnect switch including an over-rotation protective feature to protect the load switch from damage is disclosed. The electrical disconnect switch may include an enclosure, a load switch, and a handle assembly coupled to the load switch. The disconnect switch may include a detent between the handle assembly and the load switch so that during excessive rotation or torqueing the handle assembly is permitted to decouple or break-away from the load switch to prevent excessive stress from being transferred to the load switch and thus prevent any damage to the load switch.

Abstract: An over-current protection device comprises first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer comprises a polymer, an electrically conductive filler and a metal compound filler. The PTC material layer comprises the polymer of 50-70% by volume, and the electrically conductive filler and the metal compound filler are distributed in the polymer. The metal compound filler has a particle size D50 of 2-15 ?m and 5-20% by volume and is selected from the group consisting of aluminum nitride, aluminum hydroxide, aluminum oxide, titanium oxide and zirconium oxide. The over-current protection device has a resistivity of 0.7-1.2 ?·cm.

Abstract: The invention concerns a current measuring device for measuring an electric current (Ip, In) according to the four-wire technology with a low resistance current measuring resistor (RCu1, RCu, R0). The invention also provides for a compensating resistor (Rp) consisting of a fixed resistor connected in parallel with the resistor element (R0) of the low-resistance current measuring resistor (RCu1, RCu, R0) in order to at least partially compensate for the temperature dependence of the resistance value, so that the current measuring device has two current paths, namely a main current path through the resistor element (R0) on the one hand and a secondary current path through the compensating resistor (Rp) on the other hand.

Abstract: A method for determining an operating state of a PTC thermistor element may include pre-setting a released electric output available to the PTC thermistor element via a control signal and superimposing the control signal, at least for a pre-set period of time, with an additional signal which has a pre-set time profile. The method may also include, during the pre-set period of time, determining one of a time profile of a consumed electric output of the PTC thermistor element and a time profile of a consumed operating current of the PTC thermistor element. The method may also include comparing the pre-set time profile of the additional signal and the one of the time profile of the consumed electric output of the PTC thermistor element and the time profile of the consumed operating current of the PTC thermistor element.

Abstract: A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material.

Abstract: A resistor has a structure including a resistor substrate that has paired electrodes and a resistive element formed on an insulating substrate, an insulating exterior material that covers at least the upper and the side surface of the resistor substrate, and harness electric wires that have one end parts connected to the respective electrodes, pass through the exterior material, and extend outside. The paired electrodes are formed on areas other than the end parts of the insulating substrate, and junctions of the end parts of the harness electric wires and the paired electrodes are at positions where creepage distance of insulation from the junctions to the bottom ends of the insulating substrate is a predetermined distance or longer. Such structure provides the resistor having a secured creepage distance of insulation between the conductor parts of the resistor and the metal case in which the resistor is installed.

Abstract: A force sensing resistor (FSR) that is constructed with a first substrate made of polyimide disposed underneath a second substrate that is resistive and flexible. A handheld controller for an electronic system may include the FSR having a first substrate made of polyimide. The FSR may be mounted on a planar surface of a structure within the controller body, such as a structure mounted within a handle of the controller body, and/or a structure that is mounted underneath at least one thumb-operated control that is included on a head of the controller body. The FSR may be configured to measure a resistance value that corresponds to an amount of force applied to an outer surface of the handle and/or an amount of force applied to the at least one thumb-operated control.

Abstract: A thin film resistor element is provided with a tantalum nitride (TaN) layer on an upper surface of a substrate, a tantalum pentoxide (Ta2O5) layer disposed on the tantalum nitride layer, and two electrode layers separately disposed on the tantalum pentoxide layer or on both ends of the tantalum nitride layer and the tantalum pentoxide layer. The thin film resistor element of the present invention can reduce the oxidation rate of the resistor layer to maintain a constant resistance value at high temperatures generated during use.

Abstract: An object is to provide a method for manufacturing a resistor capable of suppressing variations in the thickness of a thermally conductive layer interposed between a resistive body and electrode plates. The method for manufacturing a resistor according to the present invention includes a step of forming an unhardened thermally conductive layer on a surface of a resistive body, a step of bringing the thermally conductive layer into a semi-hardened state, and a step of bending electrode plates respectively disposed at both sides of the resistive body, further hardening the thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the thermally conductive layer.

Abstract: A PTC device comprises a laminated substrate, a first PTC material layer, a second PTC material layer, a first metal layer and a second metal layer. The laminated substrate comprises a first conductive layer, a second conductive layer and an insulating layer laminated between the first and second conductive layers. The first PTC material layer is disposed on the first conductive layer, and the second PTC material layer is disposed on the second conductive layer. The first metal layer is disposed on the first PTC material layer, and the second metal layer is disposed on the second PTC material layer. The insulating layer has a through hole filled with PTC material to form a PTC connecting member of which one end connects to the first PTC material layer and another end connects to the second PTC material layer.

Abstract: A ceramic member comprising a compound oxide of La, E and Mn, wherein AE is (i) Ca, or (ii) contains Ca and at least one of Sr and Ba with a total amount of Sr and Ba to a total of Ca, Sr and Ba of not more than 5 mol %, and a crystal system in a surface of the ceramic member is a monoclinic system.

Abstract: Disclosed is a sensor for detecting temperature of an aircraft. The sensor comprises a temperature sensor elongated with respect to an axis. The temperature sensor comprises a sheath elongated with respect to the axis. The temperature sensor comprises a central conductor disposed within the sheath and elongated with respect to the axis having a conductor material defining a conductor temperature coefficient having a conductor coefficient magnitude. The temperature sensor comprises an optical fiber disposed within the sheath. The temperature sensor comprises a thermistor disposed within the sheath and surrounding the central conductor, the thermistor having thermistor material defining a thermistor temperature coefficient defining a thermistor coefficient magnitude greater than the conductor coefficient magnitude.

Abstract: A thermistor element includes an element body made of ceramic and including first and second end surfaces opposite to each other and a peripheral surface located between the first end surface and the second end surface, first and second external electrodes respectively covering the first and second end surfaces and portion of the peripheral surface adjacent to the respective first and second end surfaces. The first and second external electrodes include electrode layers including an underlayer and a metal plating layer, the underlayer of the first external electrode includes, adjacent to or in a vicinity of the second external electrode, two second external electrode side corner portions that are thin and adjacent to each other, and the underlayer of the second external electrode includes, adjacent to or in a vicinity of the first external electrode, two first external electrode side corner portions that are thin and adjacent to each other.