Abstract: The heat generating apparatus according to the present invention includes: a positive temperature coefficient thermistor heat generating element including an electrode layer; a first electrode terminal; a second electrode terminal; a holder configured to house the positive temperature coefficient thermistor heat generating element; and a heat conductive sheet, in which the heat conductive sheet includes a graphite particle and a polymer compound, a major axis direction of the graphite particle is substantially orthogonal to the surface of the positive temperature coefficient thermistor heat generating element, and the positive temperature coefficient thermistor heat generating element and the holder are assembled in a state in which they are biased so as to apply pressure to the heat conductive sheet.

Abstract: A power resistor comprises a tubular housing composed of metal and a resistor element received therein, wherein the housing has four side walls that extend along a longitudinal axis of the housing between two ends and define a rectangular cross-section. The housing comprises four edges of the four side walls at at least one of the two ends. Two of the four side walls have a respective incision at their edges for introducing a fastening element and the two other side walls have a respective clearance in alignment with the oppositely disposed incision to facilitate a placement of a tool at a fastening element introduced into the respective incision.

Abstract: A magnetoresistor device includes a magnetoresistor, a protection layer, a first conductive structure, and a second conductive structure. The magnetoresistor is disposed over a substrate. The protection layer is formed over a portion of the magnetoresistor. The first conductive structure is disposed over the protection layer and includes a lower barrier layer and a metal layer disposed over the lower barrier layer. The second conductive structure is disposed over the substrate and partially covers the magnetoresistor. The second conductive structure includes the lower barrier layer and the metal layer disposed over the lower barrier layer.

Abstract: A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.

Abstract: A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250° C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. An amount of the dielectric material blended with the carbon-based ink does not exceed about 15% by weight of the modified carbon-based ink. The modified carbon-based ink has a resistivity that is at least double a resistivity of the carbon-based ink. The thick film resistor may be configured to handle up to about 200 mA of current without fusing and/or handle up to about 1.0 W of power without fusing.

Abstract: An object of the present disclosure is to provide a chip resistor that reduces a possibility of occurrence of a mounting failure. The chip resistor of the present disclosure includes: insulating substrate; a pair of first upper-face electrodes that is provided at both end portions of an upper face of insulating substrate; and resistor that is provided on the upper face of insulating substrate and is formed between the pair of first upper-face electrodes. The chip resistor also includes: a pair of second upper-face electrodes that is formed on upper faces of the pair of first upper-face electrodes and is connected to resistor; and protective film that is provided to cover exposed resistor and part of the pair of second upper-face electrodes.

Abstract: A varistor includes a substrate; first and second electrodes disposed on an upper side and a lower side of the substrate, respectively; a core varistor body surrounded by the substrate and disposed between the first and second electrodes; first and second terminals having at least portions disposed on one side and the other side of the substrate, respectively, and electrically connected to the first and second electrodes, respectively; and a cover varistor body covering the core varistor body and disposed in a level higher than an upper surface of the substrate or disposed in a level lower than a lower surface of the substrate.

Abstract: Device structures and fabrication methods for an on-chip resistor. A dielectric layer includes a trench with a bottom and a sidewall arranged to surround the bottom. A metal layer is disposed on the dielectric layer at the sidewall of the trench. The metal layer includes a surface that terminates the metal layer at the bottom of the trench to define a discontinuity that extends along a length of the trench.

Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

Abstract: A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.

Abstract: A ruthenium oxide powder having a rutile crystal structure is provided, wherein a crystallite diameter D1, calculated from a peak of a (110) plane measured by an X-ray diffraction method, is 25 nm or more and 80 nm or less, a specific surface area diameter D2, calculated from a specific surface area, is 25 nm or more and 114 nm or less, and a ratio of the crystallite diameter D1 (nm) to the specific surface area diameter D2 (nm) satisfies a following formula (1). 0.70?D1/D2?1.

Abstract: Herein disclosed is a voltage dividing resistor comprising a resistance bar and a plurality of dividing connectors. The resistance bar has a first end and a second end and provides a first current path, which stretches from the first end to the second end along the resistance bar. The distance between the first end and the second end is less than the length of the first current path. The first and second ends are configured to be electrically connected to a power source. The dividing connectors are electrically connected to different locations on the first current path. Each of the dividing connectors has a contact pad. The resistance bar is not coplanar with the contact pads. A divided voltage is obtained from a pair of dividing connectors chosen from the plurality of dividing connectors.

Abstract: A PTC thermistor element for a tempering device may include a main body, which may have a positive temperature coefficient. The main body may have PTC thermistor components, a core, and ceramics components at least in the core. The PTC thermistor components may have a positive temperature coefficient, and the ceramics components may have a thermal conductivity of at least 2.5 W/mK. The ceramics components may be disposed in a distributed manner.

Abstract: One aspect of the present disclosure provides a chip resistor. In the chip resistor, a top electrode is disposed on a front surface of a substrate. A resistor is disposed on the front surface and electrically connected to the top electrode. A protective layer covers the resistor. A protective electrode is electrically connected to the top electrode. A side electrode is electrically connected to the top electrode. The side electrode has a side portion disposed on the side surface, and a top portion and a bottom portion respectively overlapping the front surface and the back surface in plan view. An intermediate electrode covers the protective electrode and the side electrode. An outer electrode covers the intermediate electrode. The protective electrode is in contact with both the top electrode and the protective layer and covers a portion of the top electrode and a portion of the protective layer.

Abstract: The present invention provides a multifunctional push knob, comprising a base; a rotating output element, rotated in clockwise or counterclockwise direction and outputting signals; a connecting socket, fixed on the base and having a pressing signal generating unit and a plurality of infrared shielding induction signal generating units; a fixing frame, fixed on the base; a pressing socket, disposed on the fixing frame so as to be able to move up and down and pushed against the pressing signal generating unit; a display unit, fixed on the pressing socket; a keycap, correspondingly placed on the pressing socket and rotated; and a controlling knob element, fixed on the keycap and having a signal shielding member inserted into infrared shielding induction signal generating units; wherein when controlling knob element is rotated, an infrared signal of the infrared shielding induction signal generating units is intermittently transmitted.

Abstract: For replacing position detecting switches in a breaker, a mechanical breaker switch is moved to permit removal of first and second position detecting switches, the first indicating whether the mechanical breaker switch is in a first position by transitioning between first and second states when disposed at or greater than a first threshold angle, the second indicating whether the mechanical breaker switch is in the second position by transitioning between first and second states when disposed at or less than a second threshold angle. The position detecting switches are removed and replaced with replacement position detecting switches. The first replacement switch is adjusted to transition between the first and second states at when disposed at or greater than the first threshold angle, and the second replacement switch is adjusted to transition between the first and second states at when disposed at or less than the second threshold angle.

Abstract: A composite circuit protection device includes a positive temperature coefficient (PTC) component, a voltage-dependent resistor, a first conductive lead and a second conductive lead. The PTC component includes a PTC polymeric layer, and first and second electrode layers respectively disposed on two opposite surfaces of the PTC polymeric layer. The voltage-dependent resistor is connected to the second electrode layer of the PTC component. The first and second conductive leads are respectively bonded to the first electrode layer of the PTC component and the voltage-dependent resistor. The PTC component has a rated voltage ranging between 40% and 200% of a varistor voltage of the voltage-dependent resistor.

Abstract: A magnetic tunnel junction (MTJ) based sensor device includes a MTJ element and processing circuitry. The MTJ element includes a free layer, a pinned layer, and a tunnel barrier, the tunnel barrier being arranged between the free layer and the pinned layer. The free layer is adapted to flex away from the tunnel barrier during acceleration. The processing circuitry is configured to measure a resistance at the MTJ element and determine acceleration based on the resistance at the MTJ element.

Abstract: An over-current protection device is a hexahedron comprising an upper surface, a lower surface and four lateral surfaces. The over-current protection device comprises a PTC device, a first insulating layer, a first electrode layer and a second electrode layer. The PTC device comprises a first conductive layer, a second conductive layer and a PTC material layer laminated therebetween. The first conductive layer comprises a first conductive section and a second conductive section separated by at least one trench. The first insulating layer is disposed on the first conductive layer. The first electrode layer is disposed on the first insulating layer and electrically coupled to the first conductive section. The second electrode layer is disposed on the first insulating layer and electrically coupled to the second conductive section. The trench comprises a primary portion not parallel to a longitudinal direction of the first and second electrode layers.

Abstract: A fob key for a vehicle. The fob key for a vehicle includes a housing accommodating a printed circuit board mounted with touch switches and electrical parts, buttons arranged on the housing and able to move toward touch switches, and a button-supporting structure elastically supporting buttons in a direction far away from touch switches.