Patents Examined by Leo P. Picard
  • Patent number: 6347036
    Abstract: An apparatus for mounting a heat generating computer component includes a base member having a frame mounted thereon. The frame includes a passage extending therethrough. A socket is mounted on the base member in the passage of the frame. The heat generating component is mounted on the socket. A heat extraction body is mounted on the heat generating component. A retaining member is movably attached to the base member. The retaining member is movable between an open position and a closed position with respect to the passage. A resilient member is resiliently engaged against the heat extraction body when the retaining member is in the closed position, urging the heat extraction body into contact with the heat generating component. Mechanical tolerances of the heat extraction body and the heat generating component are compensated for by captive, self-adjusting mounting hardware such that tolerance variability does not adversely affect heat transfer performance.
    Type: Grant
    Filed: March 29, 2000
    Date of Patent: February 12, 2002
    Assignee: Dell Products L.P.
    Inventors: Susan A. Yeager, Rakesh Bhatia
  • Patent number: 6347039
    Abstract: A memory module includes a plurality of semiconductor memory devices mounted on a printed wiring board (PWB); longitudinal contact terminals that are for connection to a computer mother board and are arranged along at least one longitudinal edge of the PWB; and transverse contact terminals that are for connection to the computer mother board and are arranged along at least one transverse edge of the PWB. A socket for the module includes at least one longitudinal part into which the longitudinal contact terminals are inserted and at least one transverse part into which the transverse contact terminals are inserted. Each transverse socket part can be mounted on a pivot attached to the longitudinal part and rotated to engage a PWB inserted in the longitudinal part. Alternatively, each transverse part can be a flexible circuit carrier.
    Type: Grant
    Filed: July 30, 1999
    Date of Patent: February 12, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jung Joon Lee
  • Patent number: 6344971
    Abstract: A retainer for a retaining seat of a radiator serves to combine a CPU radiator to a PC circuit board. The retainer primarily includes two retaining seats and two pressing strips which are symmetrically installed at two sides of the retainer. One end of the pressing strip is pivotally installed to one end of the retaining seat, while another free end thereof is movable to be fixed with a groove of the retaining seat; thereby, the middle folded portion of the pressing strip is exactly engaged into a trench of a base of the radiator and is then formed with a steady engagement. Thereby, the radiator can be combined to a PC circuit board and thus, the retainer for a retaining seat of a radiator can be assembled and detached easily and conveniently.
    Type: Grant
    Filed: December 18, 2000
    Date of Patent: February 5, 2002
    Inventor: Ted Ju
  • Patent number: 6344968
    Abstract: A controller for electronic goods having a control box capable of operating more smoothly when the control box is drawn out or inserted. The controller includes a housing mounted on a case of the electronic goods. The controller is provided with guiders on both sides and a control box. The control box includes a plurality of function keys on an upper side and is insertable into in the housing. The control box is guided by the guiders and includes a rack positioned between a pair of curved surfaces in the rear of the control box and a pressing member pressing the curved surfaces of the control box by an elastic force of an elastic member mounted on a rear of the housing. Also included in the control box is a device combined with the rack to reduce the speed of the control box when the control box is drawn out of or inserted into the housing. The control box further includes a heart cam constraint device to stop the control box when the control box is inserted into the housing.
    Type: Grant
    Filed: June 24, 1999
    Date of Patent: February 5, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-Seon Kim, Soon-Haeng Heo, Ki-Hyup Sung
  • Patent number: 6344973
    Abstract: The invention relates to a power module with a circuit arrangement provided with active semiconductor components and passive components and with a circuit substrate, whereby at least a portion of the active semiconductor components are soldered onto a DCB substrate and at least a portion of the passive components are printed in thick film technology on at least one ceramic substrate. The upper side of the DCB substrate is structured to form track conductors and connecting surfaces for receiving the active semiconductor components and passive components of the circuit arrangement. On the ceramic substrate, for each passive component, a first print layer is printed in thick film technology and at least one contact surface as additional print layer laterally adjoining the first print layer.
    Type: Grant
    Filed: July 13, 1999
    Date of Patent: February 5, 2002
    Assignee: Alcatel
    Inventors: Hans-Peter Feustel, Friedrich Loskarn, Reinhard Rückert
  • Patent number: 6344788
    Abstract: The present invention relates to electrical contactors used in electric motors comprising batteries. The present invention relates more specifically to an electrical contactor (1) for a battery, consisting of a hollow body (2) defining an upstream part (11) in which a pyrotechnic initiation device (3) is located and a downstream part in which a piston (4) is housed. Since the downstream part has three conducting studs (5, 6, 7), the main characteristic of the contactor (1) according to the invention is that it makes it possible, when the piston (4) moves due to the effect of the combustion gases, to pass instantaneously from a position corresponding to the electrical connection of the first two studs (5, 6) to a position corresponding to the electrical connection of the second stud (6) to the third stud (7).
    Type: Grant
    Filed: December 6, 1999
    Date of Patent: February 5, 2002
    Assignee: Pyroalliance
    Inventors: Christian J Forys, Bernard J Lallemant
  • Patent number: 6344969
    Abstract: A switched communications device includes a multi-port jack housing having portions defining a plurality of recesses extending inwardly from the front for receiving respective mating plugs. Signal connectors are preferably positioned within each of the recesses and define respective communications ports. A circuit board is positioned within the multi-port jack housing and preferably extends adjacent the back. The switched communications device preferably includes at least one switched communications processor mounted on the circuit board and connected to the plurality of communications ports for processing inbound and outbound communications signals so that the signals are switched among the communications ports. A switched communications processor preferably communicates with two or more of the communications ports. The signal connectors may be electrical and/or optical, and may be compatible with an RJ-45 jack. An internal EMI shield may be provided in the circuit board.
    Type: Grant
    Filed: June 15, 1999
    Date of Patent: February 5, 2002
    Assignee: Stratos Lightwave
    Inventors: Randal B. Lord, Robert M. Scharf
  • Patent number: 6344970
    Abstract: A podium which can operate as a free-standing, self-contained reception station housing any needed electronic equipment within its enclosure, defined by a plurality of upstanding sides and a top surface, having a ventilation system to dissipate from the enclosure any heat generated by the electronic equipment; a retractable, writing shelf for use by handicapped customers; a shelf to support a computer monitor below an opening in the top surface; a series of shelves designed to support a computer printer and its paper supply behind an access panel in one of the upstanding sides; and a trash receptacle housed within the enclosure and accessible through a moving panel in an adjacent upstanding side of the podium.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: February 5, 2002
    Assignee: John Q. Hammons Hotels, Inc.
    Inventor: Lynn Marie Geitz
  • Patent number: 6344976
    Abstract: An inventive Leads-Over-Chip (LOC) lead frame includes an assembly of interdigitated leads constructed to overlie double-sided adhesive tape on the front-side surface of an integrated circuit (IC) die. An attachment surface of each lead is adhesively attachable to the tape, and at least some of the leads are constructed to extend across the front-side surface of the die from one edge substantially to another edge, such as an adjacent or opposing edge. As a result, a substantial area of the front-side surface of the die is adhesively attachable to the leads through the tape, so the die is supportable in an IC package in an improved manner, and the heat may be conducted away from the die through the lead frame in an improved manner.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: February 5, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Aaron Schoenfeld, Jerry M. Brooks
  • Patent number: 6344967
    Abstract: A laptop computer has a base and a cover with a display monitor that are connected together by a hinge. The base and cover have congruent trapezoidal shapes that give the laptop a unique appearance. A pair of segregated right and left keyboards are mounted to the base. Each keyboard is rotated by a small angle from the center of the base to align with the natural position of the arms of the user. The keyboards are further articulated such that their front ends are elevated relative to their rearward ends. Alternate embodiments of the invention utilize various mechanisms for articulating the keyboards. In addition, the keys on each keyboard may be arranged in a curvilinear formation. The laptop has a wedge that is slidably mounted to the rearward end of the base for varying the angle of inclination of the keyboards. The wedge can raise or lower the angle of the keyboards to suit the preference of the user.
    Type: Grant
    Filed: April 2, 2001
    Date of Patent: February 5, 2002
    Assignee: International Business Machines Corporation
    Inventors: George G. Zamora, Daniel James Winarski
  • Patent number: 6343009
    Abstract: A mounting device for mounting a data storage device in a cage of a computer enclosure includes a rack and a securing plate. The rack has a base wall and a pair of opposite side walls upwardly extending from opposite sides of the base wall for receiving the data storage device therein. One side wall defines a pair of through holes. The other side wall provides a pair of first posts to insert into side holes of the data storage device. The securing plate comprises a body portion and a resilient portion. The body portion forms a pair of second posts for extending through corresponding through holes of the rack and filling within opposite side holes of the data storage device after the data storage device is received in the rack.
    Type: Grant
    Filed: December 29, 1999
    Date of Patent: January 29, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Alvin Liu, I-Fee Chen
  • Patent number: 6343008
    Abstract: A shelf configured for fitting snugly over the top end of a tower PC. The shelf is a frame formed by a top wall and two side walls, each attached at opposing ends of the top wall. Each side wall is perpendicular to the top wall to form a rectangular-shape open space between the two side walls for receiving the top end of a tower PC to fit flush between the side walls. A section of foam is attached to an inner surface of each side wall for pressing against the outer wall of a tower PC when the tower PC is placed in the open space between the side walls.
    Type: Grant
    Filed: July 25, 2000
    Date of Patent: January 29, 2002
    Inventors: Alan L. Herto, Joan T. Herto
  • Patent number: 6342827
    Abstract: In order to obtain a self-restoring fuse, it is proposed that a planar thermal bimetal snap element (1, 9) is provided that is secured on the circuit substrate (4) with refractory solder on the basis of at least one solder location and that is thermally coupled to the circuit substrate (4), whereby the solder location is fashioned as first contact location (5) for connection to a corresponding circuit contact of the circuit substrate, and that the snap element (1, 9) is mechanically pre-arched hump-like such that, when the fuse is not activated, it electrically conductively touches a second contact location of the circuit substrate (4) but does not touch it when the fuse has triggered and, thus, the hump curvature has reversed.
    Type: Grant
    Filed: January 3, 2000
    Date of Patent: January 29, 2002
    Assignee: Tyco Electronics Logistics AG
    Inventors: Matthias Bührend, Frank Templin
  • Patent number: 6342826
    Abstract: A switch having closed and open positions moves from one position to the other in response to either an elevated temperature or an excessive pressure. A switch member of bimetal material or shape memory alloy operates in response to an elevated temperature, and a foil diaphragm that cooperates with a bumper operates the switch member in response to elevated pressure. The diaphragm may rupture to vent excessive pressure in the event pressure continues to rise despite operation of the switch member or due to failure of the switch member to operate.
    Type: Grant
    Filed: August 11, 1999
    Date of Patent: January 29, 2002
    Assignee: Therm-O-Disc, Incorporated
    Inventors: William F. Quinn, James B. Kalapodis
  • Patent number: 6343019
    Abstract: An apparatus and method wherein an outer die is mounted on an inner die to form a stack which is mounted on a first surface of a substrate, such as a circuit board, the stack may be mounted filly or partially recessed in a recess which is formed in a first surface of the substrate which is dimensioned for receiving at least a portion of a die therein, and where an aperture may be formed in the recess extending through the substrate to a second side thereof for wire bonding the inner die to the substrate.
    Type: Grant
    Filed: April 7, 2000
    Date of Patent: January 29, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Tongbi Jiang, Chad A. Cobbley
  • Patent number: 6343007
    Abstract: A telecommunications shelf is disclosed that includes a back portion of a shelf, a bus control transition module, and a back plane. The back portion of the shelf is operable to receive a plurality of transition modules. The bus control transition module is received in the back portion of the shelf. The back plane is coupled to the bus control transition module. The bus control transition module is operable to provide system functions for a plurality of cards in the shelf over the back plane.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: January 29, 2002
    Assignee: Alcatel USA Sourcing, L.P.
    Inventors: Gerald R. Dubois, Serge F. Fourcand, Eddie R. Bradley
  • Patent number: 6343013
    Abstract: A heat sink assembly includes a heat sink (30), a fan (50), and a fixing device (10). The fixing device includes an engaging portion (12) for pressing the heat sink onto a CPU (40), and a fixing portion (14) for securing the fan to the heat sink. The engaging portion has a pressing section (122) and two spring sections (124) received in a slot (36) of the heat sink, and two legs (126). An aperture (130) is defined in each leg, for engaging with a corresponding catch (22) of a socket (20). The fixing portion has a frame (142), and four clamps (144) at four corners of the frame. Each clamp has a slit (148), and a pair of barbs (150) at a distal end of the clamp. Two integrating flanges (149) depend from opposite sides of the frame, each integrating flange integrally connecting with a corresponding leg.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: January 29, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Chun-Chi Chen
  • Patent number: 6343016
    Abstract: A heat sink includes a flat base panel adapted for attaching to a CPU (central processing unit), a plurality of upright fins integral wit the flat base panel at the top, parallel air passageways defined by the upright fins and extended in Y-axis direction, the upright fins including parallel radiating fins arranged in parallel lines in X-axis direction at two sides of each air passageway, and flow guide fins arranged in lines in each air passageway between each two adjacent lines of parallel radiating fins and biased at an angle relative to the parallel radiating fins.
    Type: Grant
    Filed: December 20, 2000
    Date of Patent: January 29, 2002
    Assignee: Enlight Corporation
    Inventor: Chi-Hsung Lin
  • Patent number: 6343006
    Abstract: A dual screen display system having, a base, a pair of electronic display screens, an arm assembly supporting the display screens and connected to the base, swingable mountings for swingably mounting the display screens, the mountings being adjustable as to the angular orientation of each of the display screens relative to the arm assembly between a first arrangement with the screens in a common plane, and a second arrangement in which the screens are inwardly swung positions thereby to permit each of the screens to be swung into desired operative angular orientation, and adjustable movement limiting devices, engaging the swinging mountings and limiting movement of the screens. Also disclosed are interchangeable mounting brackets for mounting screens of varying sizes, or for mounting screens in various configurations, and hingeable and rotatable support members for supporting the screens so the screens are swingable to face in opposite directions.
    Type: Grant
    Filed: November 19, 1999
    Date of Patent: January 29, 2002
    Inventors: Jerry Moscovitch, Mark D. Elchuk
  • Patent number: 6343012
    Abstract: A heat dissipation device for removing heat from an electronic device package includes a retaining clip having a central member and a first pair of legs depending downwardly therefrom. The retaining clip has a bore with female threading therein. Free ends of the legs are secured to the semiconductor device package. A fan module, having a threaded base portion with a lower edge; is threadably received in the bore of the retaining clip so that the lower edge of the fan module remains in communication with the upper surface of the semiconductor package. As a result, the fan module is secured to the semiconductor device for removing heat therefrom.
    Type: Grant
    Filed: November 13, 2000
    Date of Patent: January 29, 2002
    Assignee: Tyco Electronics Logistis AG
    Inventor: William B. Rife