Patents Examined by Leo P. Picard
  • Patent number: 6343010
    Abstract: Provided is a system for cooling a portable comprising: the portable and an apparatus for cooling the portable; wherein the portable comprises: a substrate; a heat source mounted on the substrate; a heat dissipation plate which is disposed beneath the substrate; a sheet which is thermally conductive, not electrically conductive, and sandwiched between the substrate and the heat dissipation plate; and an aperture which exposes the heat dissipation plate to external; and wherein the apparatus comprises: a thermally conductive material which is exposed to outside through a surface of the apparatus to contact with the heat dissipation plate when the portable is mounted on the apparatus; and a fan which contacts with the conductive material and dissipates heat from the thermally conductive material to ambience.
    Type: Grant
    Filed: November 2, 1999
    Date of Patent: January 29, 2002
    Assignee: NEC Corporation
    Inventor: Hironori Tanaka
  • Patent number: 6341070
    Abstract: This invention discloses a wafer level packaging method and configuration. This improved wafer level package includes a processed wafer mounted on a first printed circuit board (PCB) carrier. The processed wafer mounted on the PCB carrier board includes a plurality of separated integrated circuit (IC) chips divided by scribe-line gaps wherein each of these scribe-line gaps is filled with flexible gap-filling insulation material. In another preferred embodiment, the wafer-level package further includes a second PCB carried board composed of same material as the first PCB carrier board mounted on top of the wafer. In another preferred embodiment, the wafer-level package, which having the first and the second PCB carrier boards further includes a plurality of connection via penetrating through the first and the second PCB carried board for forming electric connection to the IC chips separated by the scribe-line gaps.
    Type: Grant
    Filed: July 28, 1999
    Date of Patent: January 22, 2002
    Inventor: Ho-Yuan Yu
  • Patent number: 6341062
    Abstract: A thermal hinge (20) designed for use in a hinged mobile computing device (22) having a base (24) and a display unit (26). The thermal hinge includes a first block (120) and a second block (122), both made from copper or other metal of equal or higher thermal conductivity. The blocks are mounted in the base and display unit, respectively, adjacent the rotational axis (30) of the hinge assembly (28) that permits the display unit to move between open and closed positions relative to the base. The first block is connected to a first heat pipe (102) which is attached to a heat-generating device (32), and the second block is connected to a second heat pipe (104) which is connected to a heat dissipating device (34). At least one, and preferably a plurality of, braided wire(s) (160) are connected to the first and second blocks and conduct heat therebetween.
    Type: Grant
    Filed: March 6, 2000
    Date of Patent: January 22, 2002
    Assignee: International Business Machines Corp.
    Inventor: Janak G. Patel
  • Patent number: 6341061
    Abstract: A notebook computer operable in the normal clamshell-type arrangement and also capable of being physically reconfigured to enhance heat dissipation and to improve user ergonomics by placing the main body and a pivotably attached display into a substantially vertical orientation, thereby raising the display to a higher and more convenient position. The keyboard may be lowered and pivoted downward to a horizontal support surface to further enhance user comfort. The depth of the notebook computer is minimized to facilitate use in situations where user space is limited. The main body may be used as an easel to hold reference materials for easy viewing. Means for mechanically supporting the main body and attached display in the substantially vertical orientation are also disclosed. The main body may also include a second display facing the user.
    Type: Grant
    Filed: December 28, 1999
    Date of Patent: January 22, 2002
    Assignee: International Business Machines Corporation
    Inventors: Christopher Eisbach, Eric Andrew Knopf, Derek Solomon Pai, Ramiro Ramirez, Edwin Joseph Selker, Todd C. Wyant
  • Patent number: 6341060
    Abstract: An optical disk drive assembly includes a hollow housing, an optical disk drive, and a control panel. The hollow housing has a bottom wall, two opposite side walls extending upwardly from two opposite sides of the bottom wall, a rear wall extending upwardly from a rear end of the bottom wall, and a front opening formed at a front end of the bottom wall and opposed to the rear wall. The optical disk drive is mounted inside the hollow housing. The optical disk drive is spaced apart from and is disposed above the bottom wall to define a clearance therebetween. The control panel is movably received in the clearance. The control panel has a front end, and a plurality of control keys disposed adjacent to the front end of the control panel and connected electrically to the optical disk drive for manipulation of the optical disk drive.
    Type: Grant
    Filed: March 13, 2000
    Date of Patent: January 22, 2002
    Assignee: Compal Electronics, Inc.
    Inventor: Kuei-Chu Chuang
  • Patent number: 6340926
    Abstract: A power plug includes a plug body having opposite sides and an end, terminal prongs extending from the end of the plug body, and a built-in circuit breaker. The circuit breaker is operable between a normal condition enabling the power plug to connect a load to a power source and a tripped condition disconnecting the load upon the detection of a circuit fault. The circuit breaker includes at least two members at respective opposite sides of the plug body which are simultaneously movable between a first position corresponding to the normal condition and a second position corresponding to the tripped condition. The members provide an indication of the operating condition of the circuit breaker viewable on both sides of the plug body.
    Type: Grant
    Filed: December 22, 1999
    Date of Patent: January 22, 2002
    Assignee: Defond Manufacturing Limited
    Inventor: Raymond Wai Hang Chu
  • Patent number: 6339530
    Abstract: The present invention provides an attachment structure of a display device which enables the outer dimensions to be reduced while maintaining the display area and makes assembling simple. More specifically, the present invention is directed to an attachment structure for a display device for attaching a display device comprising a display part 102 of a shape of a rectangular plate and a frame part 104 arranged in the outer periphery thereof to an external casing 200 having a rectangular opening part 204 formed of a side wall, in which an aperture 106 is formed in at least one of two opposing edges of the frame 104 in the direction parallel to the plane of the display part 102 and the external casing 200 is provided with a pin 218 which is engageable with said aperture 106 and is or is not moveable in the direction parallel to the plane of the display part 102.
    Type: Grant
    Filed: July 28, 2000
    Date of Patent: January 15, 2002
    Assignee: International Business Machines Corporation
    Inventors: Yoshiharu Uchiyama, Mikio Kurihara, Hiroyuki Noguchi
  • Patent number: 6339532
    Abstract: A hard disk drive is damped in order to reduce tracking errors by isolating the drive from the enclosure it is mounted in using one or more pieces of adhesive viscoelastic material. The hard disk drive is mounted by means of a secondary mounting plate having ventilation holes. Vibrations introduced into the drive from the enclosure, as well as rotational vibrations introduced by the rotation of the drive itself, are substantially damped by the viscoelastic material. As a result, tracking errors are substantially reduced.
    Type: Grant
    Filed: June 8, 2000
    Date of Patent: January 15, 2002
    Assignee: Compaq Computer Corporation
    Inventors: Steven G. Boulay, Stanley Walter Stefanick, Richard Ellis Mills
  • Patent number: 6337794
    Abstract: Apparatus for cooling an electronic device, and a resultant fluid-cooled electronic apparatus are provided. In one embodiment, the apparatus includes a heat sink member with a surface for making thermal contact with the electronic device. The heat sink member has a first plurality of channels for carrying coolant fluid. The first plurality of channels are positioned in a first group and a second group such that coolant flow alternates across the member. The heat sink member further includes a second plurality of channels disposed above the first plurality of channels such that the first and second pluralities of channels comprise tiered channels. The second plurality of channels further includes a third group of channels and a fourth group of channels, wherein the third group of channels and fourth group of channels are positioned generally alternately across the member so that coolant flow also alternates direction therebetween.
    Type: Grant
    Filed: February 11, 2000
    Date of Patent: January 8, 2002
    Assignee: International Business Machines Corporation
    Inventors: Dereje Agonafer, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons
  • Patent number: 6337793
    Abstract: A computer system including a chassis having two spaced apart walls, a transverse wall attached between the two spaced apart walls and a door pivotally attached to a first one of the two spaced apart walls. The door is movable between an open position and a closed position with respect to a second one of the two spaced apart walls. A first retaining pin is attached to the transverse wall. A second retaining pin is attached to the door. A mechanism is attached to the chassis for securing the door in the closed position. A peripheral device is mounted in the chassis. The first retaining pin is engaged with a first mounting hole in a first face of the peripheral device and the second mounting pin is engaged with a second hole in the second face of the peripheral device. The hinged or removable door allows the peripheral device to be cabled to the other components inside the computer before they are installed in the chassis.
    Type: Grant
    Filed: November 23, 1999
    Date of Patent: January 8, 2002
    Assignee: Dell USA, L.P.
    Inventors: Bradford E. Vier, Roger A. Siedow
  • Patent number: 6337792
    Abstract: A new and improved outdoor luminaire and a method which provides for quick and easy installation of electrical components. The outdoor luminaire includes a housing; a terminal block; a unitized electrical components subassembly which is removably affixable to the housing; a seat area formed in the housing's interior; a stud affixed to the unitized components subassembly; and a cover for the housing. The cover requires no fasteners and thus, further eases the installation or replacement of electrical components. The method of securing electrical components includes: opening the housing's cover at the pry point; inserting the lower end of the electrical components subassembly in the housing; pivoting the top end of the electrical components subassembly into the housing; rotating the quarter turn fastener to secure the electrical components subassembly in the housing and snapping the cover onto the housing.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: January 8, 2002
    Inventor: Mark San George
  • Patent number: 6335861
    Abstract: An instrument comprises first and second modules. The modules each comprise computer electronics hardware including a display screen typically carried by the first module. The modules are separable from each other. One of the modules has a projecting bus for connection with the interior of the other module. The bus defines a plurality of sockets for removably receiving circuit boards of desired variable types for direct connection with electronics within the other module and for connection with electronics of the one module through the bus. Thus, the instrument is easily modified in its functioning by addition, subtraction, or replacement of circuit boards from the bus.
    Type: Grant
    Filed: March 1, 1999
    Date of Patent: January 1, 2002
    Assignee: CardioCommand, Inc.
    Inventors: Maynard Ramsey, III, Darryl Parmet
  • Patent number: 6335863
    Abstract: A low-cost package for semiconductors that is superior in heat dissipation and capable of preventing the cracking of semiconductor elements at the time of mounting, and a semiconductor module employing the package. The package for semiconductors comprises a CVD diamond substrate 22 made of an independent diamond lamina, and a highly heat-conductive metallic member 21 bonded with the substrate. Semiconductor elements such as MMICs are mounted on an area 25 for mounting semiconductor elements. The CVD diamond substrate 22 may be replaced by a composite in which a CVD diamond layer is formed on a base material having thermal conductivity of 100 W/m·K or more. The provision of protuberances 26 of the metallic member 21 around the CVD diamond substrate 22 prevents the leakage of microwaves and millimeter waves.
    Type: Grant
    Filed: January 12, 1999
    Date of Patent: January 1, 2002
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yoshiyuki Yamamoto, Hirohisa Saito, Takahiro Imai
  • Patent number: 6335867
    Abstract: Apparatus for interconnecting logic boards is provided with a backplane, a plurality of logic boards connected to the backplane, and a plurality of interconnecting boards, connected to the backplane, for interconnecting the plurality of logic boards. In the apparatus, the plurality of logic boards are connected to the backplane with the logic boards in vertical position at right angles with the interconnecting boards and a specified distance away from the interconnecting boards.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: January 1, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Kenichi Ishibashi, Takehisa Hayashi, Tsutomu Goto, Akira Yamagiwa, Tsuyoshi Watanabe
  • Patent number: 6333853
    Abstract: An efficient configuration for a power system is provided, e.g. for high-speed source transfer, utilizing power electronic assemblies and a directed ventilation arrangement. Each power electronic assembly includes a plurality of stacked power electronic device modules that are electrically series connected and energized at various voltages. Each power electronic device module includes two heat sinks, a power electronic component assembly interposed between the two heat sinks, and an arrangement for clamping the heat sinks and the power electronic component assembly. In a preferred embodiment, the power electronic component assembly includes two stacked, series connected power electronic components such that single-sided cooling is provided. In one application, the power-electronic components are thyristors that have a high short-term, fault-current rating and a relatively low average current requirement.
    Type: Grant
    Filed: December 22, 1998
    Date of Patent: December 25, 2001
    Assignee: S&C Electric Company
    Inventors: Raymond P. O'Leary, Ronald D. Atanus, Richard P. Mikosz
  • Patent number: 6333845
    Abstract: A power-supply breaker apparatus of the present invention includes a fuse provided between a power supply and a load in an electric circuit, an apparatus main body for housing the fuse, a first bus bar whose one end is fixed to one fuse terminal of the fuse, a second bus bar having one end fixed to one of the power supply and the load, a plug housing chamber for housing the plug in the apparatus main body movably in a fitting/detaching direction, and a pair of plug side terminals which become conductive with each other in the plug. The other end of the first bus bar is extended so as to be composed as one terminal of the pair of main body side terminals, and the other end of the second bus bar is extended parallel with the first bus bar so as to be composed as the other terminal of the pair of main body side terminals. Respective terminal insertion widths of the pair of plug side terminals are wider than corresponding widths of the pair of main body side terminals.
    Type: Grant
    Filed: January 19, 2000
    Date of Patent: December 25, 2001
    Assignee: Yazaki Corporation
    Inventors: Shigemi Hashizawa, Hidehiko Kuboshima, Masayuki Karamatsu
  • Patent number: 6333848
    Abstract: The storage device reduces vibration accompanied by high-speed rotation of a storage media, and raises reliability as well. In a stationary position of amass object, each magnetic pole of the movable portion magnet is disposed so that their position is provided in opposite relation to each magnetic pole of a fixed portion magnet, and each magnetic pole of a movable portion magnet and the fixed portion magnet is opposite a different magnetic pole with respect to each other. An attraction force:F1 and a repulsion force:F2 between facing (or confronting) magnetic pole can be used efficiently, and a large vibration energy or inertia force can be obtained by a small-sized magnet.
    Type: Grant
    Filed: September 9, 1999
    Date of Patent: December 25, 2001
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yasuhiko Aida, Yuuji Maeda, Hiroshi Niwa, Akimitsu Omori
  • Patent number: 6333851
    Abstract: A power supply is installed in an industrial computer. The power supply has a housing. The housing is installed with a first fan set for dissipating heat from the components in the power supply. A spacer is installed in the housing for spacing the fan set. An air channel is in communication with the computer and is defined by the spacer, and a second fan set is installed in the air channel for dissipating heat from the computer.
    Type: Grant
    Filed: May 25, 2000
    Date of Patent: December 25, 2001
    Inventor: Shoei-Yuan Shih
  • Patent number: 6331937
    Abstract: A retaining clip including a hollow shaft having a first end and a second end. A flange is fixedly attached at the first end of the shaft. The shaft and the flange are integrally formed. A plurality of retention members are resiliently attached to the shaft adjacent to the second end of the shaft. A helically wound spring is carried by the shaft and extends from adjacent to the flange towards the retention member. The retention clip may be used to attach a heat sink assembly to a printed circuit module. Each spring is capable of providing a force to engage the heat sink against the heat generating component with a constant force.
    Type: Grant
    Filed: July 28, 1999
    Date of Patent: December 18, 2001
    Assignee: Dell USA, L.P.
    Inventor: Bernd Bartyzel
  • Patent number: 6331934
    Abstract: A computer docking station has an anti-theft locking mechanism that prevents theft of PC cards and other removable components (removable drives, batteries, etc.) mounted in the docking station and a portable computer docked therein. The locking mechanism is mechanically moveable between locked and unlocked positions. In the locked position, the locking mechanism at least partially covers the removable components to prevent their removal. In the unlocked position, the locking mechanism is withdrawn to allow removal of the components. The locking mechanism is preferably configured for use with an existing tether lock (e.g., a Kensington lock) used to secure the docking station and/or computer. The lock secures the locking mechanism in the locked position to protect the components.
    Type: Grant
    Filed: May 1, 1998
    Date of Patent: December 18, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Jacques H. Helot, Michael D. Derocher