Abstract: A power sub-frame is provided for a system unit. The power sub-frame has four walls defining first, second, third and fourth sides of a open, rectangular frame. A fifth side is open for receiving a plurality of power supply units for powering the system unit. A power distribution board located at a sixth side of the frame opposite to the open side, for making electrical contact to the power supply units. The power sub-frame can be manufactured as a sub-assembly for the system unit, facilitating manufacture, testing and maintenance. The power sub-frame can be pre-assembled with power distribution logic and cabling ready to be mounted in a system unit. The system unit can, for example, be a computer system unit for rack mounting in a telecommunications application.

Abstract: A computer is disclosed having a power supply assembly that may be rotated into a first position for operating the computer, rotated into a second position for servicing components within the computer, or removed from the computer quickly and easily. The power supply assembly is mounted to a chassis via first and second pivot pins that define an axis of rotation and engage first and second bearing surfaces. The first pivot pin may be disengaged from the first bearing surface without removing a fastener. In one embodinent, the first pivot pin is disengaged from the first bearing surface by relative movement between the first pivot pin and the first bearing surface along the axis of rotation. In another embodiment, the first pivot pin is disengaged from the first bearing surface by passing it through a slot in the bearing surface orthogonal to the axis of rotation.

Abstract: A bracket is provided for mounting daughter cards to a computer motherboard. The bracket is connectable to the chassis of the computer and has support slots that cooperate with connectors on the motherboard to secure the daughter cards. The bracket supports a fan for cooling the daughter cards. The fan gathers the cooling air from a plenum incorporated in the bracket. A grill incorporated in the bracket directs the cooling air over the daughter cards.

Abstract: In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.

Abstract: This invention relates to an apparatus or device for exchanging heat from electronic components or heat sinks, and method thereof. More particularly, this invention is directed to heat sinks which incorporates an innovative thermo-mechanically actuated device which modulates the capability of the heat sink to dissipate heat, and method thereof.

Abstract: A semiconductor package includes a semiconductor die, a lead frame wire bonded to the die, and a plastic body encapsulating the die. The package also includes a first heat sink attached to a face of the die, and a second heat sink attached to a back side of the die. Thermally conductive adhesive layers attach the heat sinks to the die, and provide a thermal path therebetween. In addition, the heat sinks project from the plastic body, and have end portions that are sized and shaped to interlock with heat sinks on an adjacent package to form an electronic assembly. In the electronic assembly, the interlocking heat sinks maintain contact surfaces on the heat sinks in physical contact and improve heat dissipation from the packages. An alternate embodiment package includes a thermally conductive encapsulant which attaches a pair of heat sinks, and encapsulates the die.

Abstract: A system and method of mounting components to a frame, such as a disk drive in the mounting frame of a personal computer shaped to receive the disk drive in a releasable fashion within the frame. A tubular spring member with a z-shaped base and outwardly-extending legs is made of a spring steel and formed with flattened leg ends fits within holes in the component to secure the component to a guide member, with the guide member mounted within the mounting frame. The disk drive component with the guide member secured by the Z-spring slides into a slot on the frame of the personal computer and is secured in place to provide a releasable assembly for replacement of the disk drive as desired.

Abstract: Disclosed is a portable computer which includes a display panel having a front surface, a plurality of side surfaces and a bottom surface, the front surface including a display area; an upper supporting frame covering an edge or peripheral region of the display area of the display panel; a lower supporting frame supporting the bottom of the display panel and contacting the bottom surface; and a fastening unit having a main portion and a bent portion vertical to the main frame, the main portion secured to the lower supporting frame, the bent portion contacting the side surface, and having a screw hole. Using the fastening unit according to the invention, there are described advantages that the lower supporting frame is firmly supported and the side mounting method can be applied to a thin liquid crystal display device regardless of a thickness of the lower supporting frame.

Abstract: A computing device has a housing supporting multiple electronic components. The device housing has peripheral openings to facilitate the operation of internal components (cooling fan, audio speaker, etc.) and to facilitate coupling to external devices (second display, mouse pointing device, printer unit, etc.). To prevent liquids from entering into the housing, the openings are covered with a liquid-resistant, heat-permeable material, thereby creating a liquid-resistant barrier to prevent liquids from penetrating into the device's housing. Further, the liquid-resistant, heat-permeable material is breathable to allow heat dissipation from the electronic components.

Abstract: A multi-layer circuit board with a thermoelectric or “Peltier” cooler and a method forming a multi-layer circuit board with a thermoelectric or “Peltier” cooler is disclosed. The circuit board includes a thermoelectric cooler which is integrally formed within the circuit board and which is effective to efficiently absorb and dissipate heat from the circuit board.

Abstract: A locking device is adapted for locking a disk drive module inside a computer housing. The computer housing confines an open-ended receiving space that receives slidably and removably the disk drive module therein. The computer housing has a bottom wall and an upright side wall that extends upwardly from the bottom wall and that borders the receiving space. The side wall is formed with a latch hole for access to the receiving space. The disk drive module has a casing that is formed a latch groove. The locking device includes a latch member, a resilient metal wire strip and a positioning unit. The latch member has a locking end portion and a connecting end portion, is adapted to be disposed on top of the bottom wall, and is movable between a locking position, where the locking end portion is adapted to extend through the latch hole and into the latch groove, and a releasing position, where the locking end portion is extracted from the latch groove.

Abstract: A wireform bracket provides a simple, elegant, low-cost solution for managing a large number of cables, while also allowing ample airflow at the back of a computer system. A wireform bracket in accordance with the present invention includes a plurality of bends, with each bend proximate a connector on the backplane of a computer system when the wireform bracket is attached to the back of the computer system. As cables are connected to the back of the computer system, each cable is fastened to the nearest bend using a tie-wrap, or some other cable fastening method known in the art. The present invention minimizes potential strain at the connectors by shifting any strain to the point at which the cable is attached to the wireform bracket, while also minimizing the disruption of airflow in the area immediately behind a computer system. In one embodiment, a wireform cable is formed from a ⅛ inch thick piece of steel wire, though other materials and thicknesses may be Mused.

Abstract: A power-supply breaker apparatus of the present invention includes a fuse provided between a power supply and a load in an electric circuit, an apparatus main body for housing the fuse, a pair of main body side terminals, a plug housing chamber for housing the plug in the apparatus main body movably in a fitting/detaching direction, and a pair of plug side terminals which become conductive with each other in the plug. The electric circuit is electrically conductive via the fuse, and the pair of main body side terminals are supported to the apparatus main body movably in a direction crossing substantially perpendicularly to the fitting/detaching direction, and one of the pair of the main body side terminals is connected with the power supply, and the other terminal is connected with the load. Moreover, when the plug is moved in the fitting/detaching direction, the pair of plug side terminals are freely fitted into and detached from the pair of main body side terminals.

Abstract: A thermal switch arrangement for electromagnetic coils of electric motors, including at least one coil, which has a winding (52, 54) and a coil former (30, 48) in the form of a winding core (32), which is enclosed by two end flanges (36, 38; 56, 58, 60, 62), and flat plugs (26, 28; 74, 76, 78), which are connected with the two ends of the winding and/or the connections of a thermal switch (80), assigned to the winding, and are inserted and locked in pockets (40, 42; 64, 66) in or at at least one end flange (36, 38; 56, 58, 60, 62) from the peripheral edge of the latter and locked. Two tags (82, 84) of the thermal switch (80) enter the pockets (40, 42; 64, 66) of the flat plug (74, 78) from the inner surface of the one end flange (36, 60).

Abstract: A heat dissipation mechanism for high power devices allows an automatic pick-and-place and solder assembly of electrical components including the high power devices onto a circuit board in a same pick-and-place and solder process. In the heat dissipation mechanism, a device portion and a flange portion of the high power devices are placed upside down such that the flange portion dissipates heat in the device to mechanics through the circuit board.

Abstract: Portable computing devices, such as notebook and palm top computers are provided which include top and bottom housing portions connected by a hinge in which a set of keys is disposed in the bottom portion and a display screen is disposed in the upper portion. These devices further include a leather grain layer disposed on an exterior facing side of the top portion.

Abstract: A heatsink for use with an actively cooled daughterboard system. Plural transverse fins are integrally formed with a base portion. The fins are parallel to one another and orthogonal to the bottom of the base portion. The fins have a constant profile relative to the bottom of the base portion, but the base portion has a central portion that is thicker than its end portions. The thickness of the central portion varies according to a radius. The radius is approximated by step differences in the depths of the fins.

Abstract: A portable computer with infrared data communication capabilities is disclosed. The computer has an infrared transceiver capable of enlarging the data sending/receiving angle and reliably performing radio data communication with another electronic appliance. The computer also has a selection circuit capable of activating all light elements during a data sending operation or selecting one active light receiving element from a plurality of light receiving elements during a data receiving operation, thus performing a reliable infrared data communication. In the computer, an opening is formed on an outside edge of the display body. Both an infrared data sending unit, consisting of at least one light element, and an infrared data receiving unit, consisting of at least one light receiving element, are commonly carried on a circuit board set in the opening of the display body.

Abstract: A flexible circuit board which can be assembled into a head gimbal assembly of a hard disk drive. The flexible circuit board may have a conductive tab that is electrically connected to a pre-amp pad and a head pad of the circuit board. The head pad may be connected to a head. The conductive tab may be grounded during handling of the flexible circuit board. Any electrostatic discharge on the head may be grounded through the conductive tab.

Abstract: A fuse holder includes a base panel, a plurality of conducting blocks mounted on the base panel, a plurality of electric wires respectively connected to the conducting blocks, and a plurality of cartridge fuses respectively connected in parallel between the conducting blocks, wherein each conducting block has at least one smoothly arched clamping strip, each clamping strip having two clamping flanges extending from two opposite sides and curved radially toward each other and defining a smoothly arched clamping mouth for holding one conducting blade of one cartridge fuse, and two notches respectively disposed between the clamping flanges and the respective conducting block, the clamping flanges each having a plurality of radially extended splits, which separate the corresponding clamping flange into a plurality of fingers.