Abstract: A composite comprising the reaction product of a filler having a reactive hydroxylated surface, a monomer or polymer containing carboxyl groups, and an organoaluminum compound, the organoaluminum compound being reacted with said hydroxylated surface and with said monomer or polymer. A preferred composite is made by reacting aluminum sec-butoxide with fiberglass and acrylic acid and methyl methacrylate under polymerization conditions.
Abstract: Thermally stable block copolymers, well adapted for the production of coating films, include recurring imide/amide blocks of the formula: ##STR1## and recurring urea/siloxane blocks of the formula:--NH--CO--NH--A--NH--CO--NH-- (II)wherein A is a divalent diorganosiloxane radical of the formula ##STR2##
Type:
Grant
Filed:
June 6, 1988
Date of Patent:
August 21, 1990
Assignee:
Rhone-Poulenc Chimie
Inventors:
Pascal Barthelemy, Yves Camberlin, Philippe Michaud
Abstract: A spider for a gassing current limiting fuse made of an asbestos free material is disclosed. The spider material produces an arc quenching gas and water upon erosion by an arc. The material includes the following proportions of ingredients: 50-80% Al.sub.2 O.sub.3.3H.sub.2 O; 8-22% Wollastonite (CaSiO.sub.3); and 10-25% melamine formaldehyde resin.
Abstract: The invention relates to a thermosetting composition comprisingA: 30-65 parts by weight of unsaturated polyester with a molar mass per double bond of 142-500B: 25-55 parts by weight of ethylenically unsaturated monomerC: 3-35 parts by weight of slightly ethylenically unsaturated polyesterD: 0-750 parts by weight of filler, fibrous material and, if so desired, other usual additives, characterized in that as as slight ethylenically unsaturated polyester an unsaturated polyester is used which has a molar mass per double bond of 1200-20,000 and an acid number of 5-50, and in which between 50 and 90% of the unsaturation consists of a terminal monoester of a .alpha., .beta.-unsaturated dicarboxylic acid. The composition presents little or no shrinkage in setting.
Type:
Grant
Filed:
August 18, 1988
Date of Patent:
August 14, 1990
Assignee:
Stamicarbon B.V.
Inventors:
Adrianus J. De Koning, Arnold J. Voskamp
Abstract: Coloring materials used in a process of dyeing concrete consist of pigment granules other than compacted or briquetted granules. The granules consist of one or more pigments, one or more binders for promoting the dispersing of the pigments in the concrete, and optional other additives. Such pigment granules, particularly bead granules, will easily dissolve in the concrete mixer and will be homogeneously dispersed in the concrete.
Abstract: A process for producing a polyoxymethylene-polyurethane type alloy, which comprises allowing a polyisocyanate compound, a short chain polyol with a molecular weight of 62 to 350, a long chain polyol with a number-average molecular weight of 400 to 5,000, and optionally additives to react with each other in the presence of at least one or polyoxymethylene polymers.
Abstract: Described are novel thermosetting maleimide compositions suitable for making cured resins, prepregs and tough thermoset composites. The thermosetting compositions comprise a multifunctional maleimide and terminally unsaturated polyamide, polyimide, or polyamideimide oligomer which is soluble in the composition. The cured resins have a fracture toughness, K.sub.ic, of at least 1.0 MPam.sup.1/2 and a glass transition temperature of at least 200.degree. C.
Type:
Grant
Filed:
July 15, 1987
Date of Patent:
August 7, 1990
Assignee:
Hercules Incorporated
Inventors:
Sung G. Chu, Harold Jabloner, Tuyen T. Nguyen
Abstract: A block copolymer composed of polyphenylene sulfide segments and aromatic sulfide sulfone polymer segments and having a logarithmic viscosity [.xi.], determined at 206.degree. C. for its solution in alpha-chloronaphthalene in a polymer concentration of 0.4 g/100 ml of solution and calculated in accordance with the equation [.xi.]=ln (relative viscosity)/polymer concentration, of 0.03 to 1.0. A resin composition comprising the block copolymer and polyphenylene sulfide and/or an aromatic sulfide sulfone polymer and optionally a filler. The block copolymer and the resin composition have improved mechanical strength and are suitable, for example, for encapsulation of electronic component parts.
Abstract: A surface covering product having static dissipative electrical properties comprises a consolidated agglomeration of individual chips of polymeric material and wherein at least a portion of said individual chips contain an antistatic agent. A second portion of individual chips contain no antistatic agent or a reduced amount of antistatic agent.
Type:
Grant
Filed:
January 26, 1989
Date of Patent:
July 31, 1990
Assignee:
Armstrong World Industries, Inc.
Inventors:
Kenneth K. Ko, Jesse D. Miller, Jr., Wayne R. Shelly, Susan M. Von Stetten
Abstract: An end dam nosing material useful for expansion joints and having high levels of bonding strength, tensile strength, compressive strength, flexural capabilities, resiliency, and resistance to chemical action is disclosed. The end dam nosing material of the present invention does not require the addition of external heat for curing. The end dam nosing material of the present invention comprises a mixture of a dipolymerized elastomer, an epoxy resin, a filler material and an amount of a curing agent effective to cure the epoxy resin and generate sufficient heat to cure the dipolymerized elastomer.
Abstract: A structural adhesive having excellent anti-corrosion properties which comprises: (A) a rubber modified epoxy resin prepared by reaction of a bisphenol epoxy resin and a butadiene-acrylonitrile-(meth)acrylic acid copolymer, (B) an urethane modified epoxy resin, (C) a latent curing agent, and (D) a rust inhibiting pigment selected from the group consisting of: (i) a rust inhibiting pigment comprising aluminum orthophosphate and a zinc compound, (ii) a rust inhibiting pigment comprising aluminum metaphosphate, a zinc compound and/or an alkaline earth metal compound, and (iii) a rust inhibiting pigment comprising aluminum metaphosphate and a zinc compound and optionally an alkaline earth metal compound, wherein the adhesive contains said rubber modified epoxy resin (A) and said urethane modified epoxy resin (B) in a weight ratio of 1:9 to 3:1, and said latent curing agent (C) and said rust inhibiting pigment (D) at 0.
Abstract: The invention relates to fiber-reinforced unsaturated polyester resin compositions comprising an unsaturated polyester (A) obtained from a dicarboxylic acid containing unsaturated dicarboxylic acid or its anhydride, or an anhydride of the dicarboxylic acid and a polyhydric alcohol, a polyisocyanate (B), a polymerizable vinyl monomer (C), and a fiber (D), which produce molded articles having excellent impact resistance and improved moldability.
Abstract: Molded polyurethanes are filled with a particular filler mixture, including a certain wollastonite or talc as a supplementary filler, to provide a polymer composition having surprising good physical properties and excellent surface quality.
Abstract: A photocurable ethylenically unsaturated liquid coating composition consisting essentially of: 1- polyethylenically unsaturated material in which the ethylenically unsaturated groups are polymerizable groups which are not (meth)acrylate groups; 2- a polyamine resin; and 3- an hydroxyalkyl phenone photoinitiator to speed the cure. The photocure rate is also speeded by combining a tertiary amine-functional acrylic copolymer, an allyl-functional resin, and a maleate-functional resin in a weight ratio of about 15-65/5-45/30-70. In preferred practice both expedients are used to maximize the cure speed.
Abstract: A thermosetting insulating resin paste including 100 parts by weight of an epoxy resin containing a diglycidyl type liquid epoxy resin as a main component and based on the parts by weight of the epoxy resin, 0.5 to 10 parts by weight of dicyandiamide as a setting agent. It further contains 1 to 15 parts by weight of a phenoxy resin, 0.1 to 8 parts by weight of 2-phenyl-4-methyl-5-hydroxymethylimidazole and/or 2-phenyl-4,5-dihydroxymethylimidazole as a setting accelerator as well as 50 to 200 parts by weight of a thermally conductive filler. This insulating resin paste exhibits a long pot life and can be set in a short time at a low temperature without generating any voids during the setting, so that it enables the die bonding process in the production of semiconductor devices to be performed as part of the production line. It also allows a smaller device to be used in this process.
Abstract: Leguminous flours such as pea flours can be substituted for at least a portion of extenders (such as wheat flour) and/or fillers in glue compositions comprising aldehyde condensation resins such as urea-formaldehyde and/or phenol-formaldehyde resins without loss of bond strength. Such glue compositions provide lower storage viscosity and are often less expensive than conventional compositions. The glue compositions can be used in cured laminates of lignocellulosic materials such as plywood.
Abstract: Thermoplastic molding composition based on thermoplastic polyesters (a.sub.1), graft polymers incorporating acrylate rubbers as grafting base (a.sub.2), copolymers of aromatic vinyl monomers and acrylonitrile or methacrylonitrile (a.sub.3) and glass fibers (B) have particularly good mechanical properties if the (meth)acrylonitrile content in component (a.sub.3), based on the total weight of (a.sub.3), is less than the (meth)acrylonitrile content of component (a.sub.22).
Type:
Grant
Filed:
October 7, 1988
Date of Patent:
July 10, 1990
Assignee:
BASF Aktiengesellschaft
Inventors:
Dietrich Lausberg, Wolfgang Seydl, Manfred Knoll, Erhard Seiler, Herbert Gutsche, Peter Kolm
Abstract: The flameproofing agent content of molding compositions containing polyesters (a.sub.1), acrylate graft polymers (a.sub.2), styrene/acrylonitrile copolymers (a.sub.3) and glass fibers can be reduced without affecting the flame resistance by adding finely divided PTFE.
Type:
Grant
Filed:
October 7, 1988
Date of Patent:
July 10, 1990
Assignee:
BASF Aktiengesellschaft
Inventors:
Dietrich Lausberg, Peter Ittemann, Graham E. McKee, Karl Schlichting, Manfred Knoll, Erhard Seiler
Abstract: A process for preparing a copoly(arylene sulfide) corresponding to the structure[(--A--S--).sub.1-x (--A--S--S--).sub.x ].sbsb.nwherein x is in the range of 0.5 to 0.001 by reacting a mixture of a diiodoaromatic compound and elemental sulfur which contains less than 0.05 weight percent carbon.
Type:
Grant
Filed:
September 8, 1989
Date of Patent:
July 3, 1990
Assignee:
Eastman Kodak Company
Inventors:
David R. Fagerburg, Joseph J. Watkins, Paul B. Lawrence, Mark Rule