Abstract: A surface treatment for metal surfaces can be used to create one or more desired effects, such as functional, tactile, or cosmetic effects. In one embodiment, the treatment involves selectively masking a portion of the surface using a photolithographic process. The mask can protect the masked portion of the surface during subsequent treatment processes such as texturizing and anodization. The mask can result in the creation of a surface having contrasting effects. A pattern can be formed by the contrasting effects in the shape of a distinct graphic, such as a logo or text.

Abstract: A partial plating device includes a drum jig which has a plurality of positioning pins provided on the outer peripheral surface thereof, and which feeds a metal member around the outer periphery thereof by engaging the metal member with the positioning pins; a rotating shaft which rotatably supports the drum jig, a jet unit that supplies plating liquid to the metal member, and a brake unit that reduces the circumferential speed of the drum jig, and which is fitted to the rotating shaft. A plating device and a partial plating method in which plating is not carried out on the first region of a metal member on the carrying-in side of the drum jig, but in which plating is carried out on the second region of a metal member on the carrying-out side.

Abstract: A biochip including a plate-like diaphragm part provided with a through-hole, a wall part provided at an outer periphery of the diaphragm part, and a reinforcing part formed in a portion other than the through-hole in the diaphragm part.

Abstract: A semiconductor substrate carrier for use during wet chemical processing may comprise a conductive flange to couple the carrier with processing equipment, a frame coupled with the conductive flange, where the frame is configured to hold a semiconductor substrate, and an integrated shield coupled with the frame. The integrated shield is configured to alter an electric field near at least a portion of a surface of the semiconductor substrate during the wet chemical processing.

Abstract: A method of preparing a metal composite, comprising the steps of: forming an anodic oxidation layer on a surface of a metal substrate; forming a dye layer comprising a dye and a water soluble ink on the anodic oxidation layer, wherein the dye layer has a graduated thickness; and removing the water soluble ink.

Abstract: Controlling dimensions of nanowires includes lithographically forming a trench in a layer of a polymer resin with a width less than one micrometer where the polymer resin has a thickness less than one micrometer and is deposited over an electrically conductive substrate, depositing a nanowire material within the trench to form a nanowire, and obtaining the nanowire from the trench with a removal mechanism.

Abstract: A composition comprising a source of metal ions and at least one polyaminoamide, said polyaminoamide comprising amide and amine functional groups in the polymeric backbone and aromatic moieties attached to or located within said polymeric backbone.

Abstract: A solid electrolyte is made of zirconia grains containing yttria and alumina grains dispersed in the zirconia grains. In the solid electrolyte, the yttria content per zirconia content is within a range of 2 to 10 mol. %, the relative density is not less than 93%, and the average particle size Rz of the zirconia grains is not more than 2 ?m, an average particle size Ra of the alumina grains is not more than 1 ?m. The average particle size Ra of the alumina grains is smaller than the average particle size Rz of the zirconia grains. An average distance value ALa between the alumina grains is not more than 2 ?m, and a standard deviation SLa thereof is not more than 0.8. The solid electrolyte satisfies a relationship of (SLa/ALa)×Rz?0.9.

Abstract: An article is provided, the article including a substrate having a surface with a first wettability characteristic. A nano-structure array is formed on the surface of the substrate to provide a nano-structured surface having a second wettability characteristic. A thin-layer surface coating is formed on the nano-structured surface, the thin-layer surface coating being configured to tune the nano-structured surface to a target wettability characteristic.

Abstract: Techniques for forming a nanopore in a lipid bilayer are described herein. In one example, an agitation stimulus level such as an electrical agitation stimulus is applied to a lipid bilayer wherein the agitation stimulus level tends to facilitate the formation of nanopores in the lipid bilayer. In some embodiments, a change in an electrical property of the lipid bilayer resulting from the formation of the nanopore in the lipid bilayer is detected, and a nanopore has formed in the lipid bilayer is determined based on the detected change in the lipid bilayer electrical property.

Abstract: A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide represented by formula (I) or derivatives of a polyaminoamide of formula (I) obtainable by complete or partial protonation, N-quarternisation or acylation.

Abstract: Electroplating systems that include a plurality of electrodes, a power supply operably coupled to the plurality of electrodes, a platen for bearing a substrate on which metal features are to be formed, and an electrode support are disclosed. The electrode support may be configured for suspending the electrode assembly over an upper surface of the substrate disposed on the platen in spaced relation to and in alignment with the substrate or for supporting the electrode assembly in a stationary position over the substrate when the voltage is applied across the plurality of electrodes. The electrodes may be adjacent, mutually spaced and electrically isolated and connected in series so as to be oppositely polarized when the voltage is applied thereacross or may be connected so as to have alternating polarities when the voltage is applied thereacross.

Abstract: Provided are an apparatus for continuous electrolytic treatment of a steel sheet that is suitable for producing a surface-treated steel sheet and a method for producing the surface-treated steel sheet using the apparatus for continuous electrolytic treatment of a steel sheet. The apparatus includes N pairs of tabular electrodes having a length L and being arranged to respectively face two surfaces of a steel sheet. Each electrode includes n sections arranged in the longitudinal direction of the electrode and disposed on the surface of the electrode facing the steel sheet surface. Each section is constituted by a conductive portion including an electrode portion having a length T1 and a nonconductive portion made by making an electrode portion having a length T2 nonconductive, where n×N?10, 0.96?T2/(T1+T2)?0.05, and 0.9?T1/L?0.1.

Abstract: A method of forming interconnects for three dimensional integrated circuits comprises attaching a metal layer on a first carrier, attaching a first side of a packaging component on the metal layer, wherein the packaging component comprises a plurality of through vias. The method further comprises filling the plurality of through vias with a metal material using an electrochemical plating process, wherein the metal layer functions as an electrode for the electrochemical plating process, attaching a second carrier on a second side of the packaging component, detaching the first carrier from the packaging component, forming a photoresist layer on the metal layer, patterning the photoresist layer and detaching exposed portions of the metal layer.

Abstract: Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.

Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Abstract: An electrochemical test sensor is adapted to measure glucose and correct for the oxygen effect in a fluid sample. The test sensor comprises a base, first and second working electrodes, and a counter electrode. The first working electrode includes glucose oxidase, a mediator and peroxidase. The second working electrode includes glucose oxidase and the mediator. The first working electrode, the second working electrode and the counter electrode are located on the base. In other embodiments, an electrochemical test sensor is adapted to measure cholesterol, lactate, pyruvate or xanthine and correct for the oxygen effect in a fluid sample.

Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations.

Abstract: An electrochemical test sensor is adapted to measure glucose and correct for the oxygen effect in a fluid sample. The test sensor comprises a base, first and second working electrodes, and a counter electrode. The first working electrode includes glucose oxidase, a mediator and peroxidase. The second working electrode includes glucose oxidase and the mediator. The first working electrode, the second working electrode and the counter electrode are located on the base. In other embodiments, an electrochemical test sensor is adapted to measure cholesterol, lactate, pyruvate or xanthine and correct for the oxygen effect in a fluid sample.

Abstract: Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.