Patents Examined by Louis Rufo
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Patent number: 8916038Abstract: A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The mandrel has an outer surface with a preformed pattern, wherein at least a portion of the metallic article is formed in the preformed pattern. The metallic article is separated from the electrically conductive mandrel, which forms a free-standing metallic article that may be coupled with the surface of a semiconductor material for a photovoltaic cell.Type: GrantFiled: March 13, 2013Date of Patent: December 23, 2014Assignee: GTAT CorporationInventors: Steve Babayan, Robert Brainard, Arvind Chari, Alejandro de la Fuente Vornbrock, Venkatesan Murali, Gopal Prabhu, Venkateswaran Subbaraman, Dong Xu, Arthur Rudin, David Tanner
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Patent number: 8900666Abstract: Stable tin-free palladium catalysts are used to metalize through-holes of printed circuit boards. A stabilizer is included in the catalyst formulation which prevents precipitation and agglomeration of the palladium.Type: GrantFiled: October 21, 2011Date of Patent: December 2, 2014Assignee: Rohm and Haas Electronic Materials LLCInventors: Feng Liu, Maria Anna Rzeznik
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Patent number: 8894836Abstract: A highly reliable electronic device that prevents entry of a plating solution via an external electrode and entry of moisture of external environment inside thereof, and generates no soldering defects or solder popping defects which are caused by precipitation of a glass component on a surface of the external electrode. The electrode structure of the electronic device is formed of Cu-baked electrode layers primarily composed of Cu, Cu plating layers formed on the Cu-baked electrode layers and which are processed by a recrystallization treatment, and upper-side plating layers formed on the Cu plating layers. After the Cu plating layers are formed, a heat treatment is performed at a temperature in the range of a temperature at which the Cu plating layers are recrystallized to a temperature at which glass contained in a conductive paste is not softened, so that the Cu plating layers are recrystallized.Type: GrantFiled: April 11, 2012Date of Patent: November 25, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Hiroshi Katsube, Jun Nishikawa
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Patent number: 8852421Abstract: A system and method are disclosed for utilizing sensors with existing devices. An interface module is used in combination with a newer sensor, such as a fluorescence oxygen sensor, and an older legacy device. The older legacy device supplies a polarizing voltage, and anticipates a measured current of between 0 and 100 nA. The newer sensor requires no polarizing voltage and delivers an output of 0-10 volts in one embodiment, and 4-20 mA in another embodiment. The interface module receives the output from the sensor, and converts it into a useable signal to the legacy device. In another embodiment, the interface module comprises a number of outputs, such that both legacy devices and newer devices can be in communication with the sensor simultaneously. The interface module can be used in conjunction with a reactor chamber or other pharmaceutical process.Type: GrantFiled: December 22, 2011Date of Patent: October 7, 2014Assignee: EMD Millipore CorporationInventors: Michael Joens, Ricky F. Baggio
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Patent number: 8852414Abstract: A system and method are disclosed for utilizing sensors with existing devices. An interface module is used in combination with a newer sensor, such as a fluorescence oxygen sensor, and an older legacy device. The older legacy device supplies a polarizing voltage, and anticipates a measured current of between 0 and 100 nA. The newer sensor requires no polarizing voltage and delivers an output of 0-10 volts in one embodiment, and 4-20 mA in another embodiment. The interface module receives the output from the sensor, and converts it into a useable signal to the legacy device. In another embodiment, the interface module comprises a number of outputs, such that both legacy devices and newer devices can be in communication with the sensor simultaneously. The interface module can be used in conjunction with a reactor chamber or other pharmaceutical process.Type: GrantFiled: March 24, 2010Date of Patent: October 7, 2014Assignee: EMD Millipore CorporationInventors: Michael Joens, Ricky F. Baggio
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Patent number: 8828213Abstract: The process of forming a partial gold-plating pattern on a stainless substrate includes a first plating step, a second plating step, and a stripping step. In the first plating step, pretreatment is applied to a stainless substrate including opposite main planes and a processing site formed of a plane different from the main planes, after which a first gold-plating layer is formed all over the surface of the stainless substrate using a hydrochloric acid plating solution. In the second plating step, mask plating is used to form a second gold-plating layer on the first gold-plating layer that covers the processing site in a desired pattern, and in the stripping step, a portion of the first gold-plating layer in an area where there is none of the second gold-plating layer is stripped off using an alkaline stripping solution.Type: GrantFiled: February 8, 2012Date of Patent: September 9, 2014Assignee: Dai Nippon Printing Co., Ltd.Inventor: Masahiro Nagata
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Patent number: 8801914Abstract: A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member; e) electrolytically depositing a hard gold layer on the nickel coating; and f) depositing palladium on a surface of the hard gold layer to improve bondability of the contact pads while preserving wear resistance of the connector pads.Type: GrantFiled: May 26, 2011Date of Patent: August 12, 2014Assignee: Eastman Kodak CompanyInventors: Samuel Chen, Allan F. Camp, Charles I. Levey, Vincent J. Andrews
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Patent number: 8795501Abstract: A dielectrophoretic particle concentrator includes first substrate, detection electrodes, second substrate, protrudent structure and edge wall structures. The first substrate extends along first direction. The detection electrodes are disposed on the first substrate and extend along second direction. The second direction crosses the first direction. The second substrate is disposed over the first substrate and extends along the first direction. The protrudent structure is disposed on the second substrate and protruded towards the first substrate. A top portion of the protrudent structure includes a line-like structure extending along the second direction and adjacent to the detection electrodes. The edge wall structures are integrated with the first substrate and the second substrate, to form pipe-like structure to enable a fluid flowing through the protrudent structure from an end to another end.Type: GrantFiled: April 19, 2010Date of Patent: August 5, 2014Assignee: Industrial Technology Research InstituteInventors: Liang-Ju Chien, Chi-Han Chiou
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Patent number: 8702929Abstract: A system that incorporates teachings of the present disclosure may include, for example, a solid-state selector having a vessel for carrying a liquid medium with one or more molecules surrounded by ions, a solid state conductive structure doped with impurities having one or more through-holes extending between two surfaces of the solid state conductive structure positioned within the liquid medium of the vessel, a voltage source coupled to the solid state conductive structure to selectively stimulate the ions surrounding the one or more molecules to pass through the one or more through-holes. Additional embodiments are disclosed.Type: GrantFiled: March 22, 2012Date of Patent: April 22, 2014Assignee: The Board of Trustees of the University of IllinoisInventors: Jean-Pierre Leburton, Gregory Timp, Maria E. Gracheva, Julien Vidal
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Patent number: 8608931Abstract: Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold.Type: GrantFiled: September 22, 2010Date of Patent: December 17, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Wan Zhang-Beglinger, Jonas Guebey, André Egli
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Patent number: 8603317Abstract: A housing having a coating is disclosed. The housing comprises a base substrate made of metallic material; a micro-arc oxide layer formed on the base substrate; and a protection outer film formed on the micro-arc oxide layer and comprising a coating layer and a metallic layer, wherein the metallic layer is formed on the micro-arc oxide layer and covers a portion of the micro-arc oxide layer; and the coating layer is formed on a remaining portion of the micro-arc oxide layer so that the micro-arc oxide layer is covered by the metallic layer and the coating layer.Type: GrantFiled: December 6, 2011Date of Patent: December 10, 2013Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Zhe-Xuan Zhang, Shih-Pin Wang, Yan Xiong, Che-Chao Chu
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Patent number: 8580100Abstract: Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.Type: GrantFiled: February 24, 2011Date of Patent: November 12, 2013Assignees: Massachusetts Institute of Technology, The Trustees of Boston College, GMZ Energy, Inc.Inventors: Hsien-Ping Feng, Gang Chen, Yu Bo, Zhifeng Ren, Shuo Chen, Bed Poudel
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Patent number: 8568575Abstract: An adjustable insertion assembly for an electrochemical sensor includes an electrode holder to receive the sensor, having a distal aperture to permit process fluid to contact the sensor. A receptacle slidably receives the holder, for a sliding range of motion extending from fully inserted to fully retracted positions. An open distal end portion of the receptacle extends through a wall of a process fluid vessel, so that the aperture is open to the process fluid when fully inserted, and closed when fully retracted. A leverage member is releasably movable relative to the receptacle, and moves with a captured extension. An abutment of the receptacle engages the extension so that movement of the leverage member in opposite directions alternately clamps and releases the electrode holder relative to the receptacle to substantially prevent and permit movement at substantially any point within the range of movement.Type: GrantFiled: July 23, 2010Date of Patent: October 29, 2013Assignee: Invensys Systems, Inc.Inventor: Stephen B. Talutis
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Patent number: 8551320Abstract: Methods for calculating an analyte concentration of a sample are provided. In one exemplary embodiment the method includes steps that are directed toward accounting for inaccuracies that occur as a result of temperature variations in a sample, a meter, or the surrounding environment. In another exemplary embodiment the method includes steps that are directed toward determining whether an adequate sample is provided in a meter because insufficient samples can result in inaccuracies. The methods that are provided can be incorporated into a variety of mechanisms, but they are primarily directed toward glucose meters for blood samples and toward meters for controls solutions.Type: GrantFiled: May 13, 2009Date of Patent: October 8, 2013Assignee: LifeScan, Inc.Inventors: Alastair M. Hodges, Ronald C. Chatelier
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Patent number: 8535511Abstract: A chemistry matrix for use in determining the concentration of an analyte in a biological fluid includes a glucose dehydrogenase, nicotinamide adenine dinucleotide, an alkylphenazine quaternary salt, and/or a nitrosoaniline. The chemistry matrix is used with an electrochemical biosensor to determine the concentration of an analyte after a reaction occurs within the biosensor, at which time an analysis is completed to determine the concentration. A method of determining the concentration of an analyte using the chemistry matrix of glucose dehydrogenase, nicotinamide adenine dinucleotide, an alkylphenazine quaternary salt, and/or a nitrosoaniline is another aspect that is described. The method also further features test times of five seconds or less. Methods utilizing the new chemistry matrix can readily determine an analyte such as blood glucose at concentrations of from about 20-600 mg/dL at a pH of from about 6.5 to about 8.5.Type: GrantFiled: August 12, 2011Date of Patent: September 17, 2013Assignee: Roche Diagnostics Operations, Inc.Inventors: Christopher D. Wilsey, Mitali Ghoshal, Herbert Wieder
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Patent number: 8512539Abstract: The invention relates to a method (3) of fabricating a mould (39, 39?, 39?) that includes the following steps: a) providing (10) a substrate (9, 9?) that has a top layer (21, 21?) and a bottom layer (23, 23?) made of electrically conductive, micromachinable material, and secured to each other by an electrically insulating, intermediate layer (22, 22?); b) etching (11, 12, 14, 2, 4) at least one pattern (26, 26?, 27) in the top layer (21, 21?) as far as the intermediate layer (22, 22?) to form at least one cavity (25, 25?) in said mould; c) coating (6, 16) the top part of said substrate with an electrically insulating coating (30, 30?); d) directionally etching (8, 18) said coating and said intermediate layer to limit the presence thereof exclusively at each vertical wall (31, 31?, 33) formed in said top layer. The invention concerns the field of micromechanical parts, in particular, for timepiece movements.Type: GrantFiled: March 12, 2010Date of Patent: August 20, 2013Assignee: Nivarox-FAR S.A.Inventors: Pierre Cusin, Clare Golfier, Jean-Philippe Thiebaud
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Patent number: 8506788Abstract: Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit.Type: GrantFiled: September 11, 2012Date of Patent: August 13, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Deyan Wang, Robert D. Mikkola, George G. Barclay
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Patent number: 8506780Abstract: A gas sensor includes an internal space, diffusion control part, pumping cell, and measuring cell. The diffusion control part communicates with the internal space and has a slit-like shape with a smaller thickness than that of the internal space. The pumping cell pumps out oxygen from the internal space when voltage is applied between a first electrode fowled on a surface of the internal space and a second electrode formed outside the internal space. The measuring cell measures a current flowing between a third and fourth electrodes when a voltage is applied between the third and fourth electrodes. The third electrode is formed in the diffusion control part, and can reduce an oxide gas component in a predetermined gas component to which a predetermined diffusion resistance has been applied by the diffusion control part. The fourth electrode is formed in a part different from the diffusion control part.Type: GrantFiled: October 12, 2010Date of Patent: August 13, 2013Assignee: NGK Insulators, Ltd.Inventors: Mika Murakami, Hiroki Fujita, Sumiko Horisaka, Takashi Ito, Sang Jae Lee
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Patent number: 8480870Abstract: A gas sensor element, wherein an amount of flexure in a first section extending in a longitudinal direction of the sensor element from the position 8/27 of a size of the element apart from one end of the element to the other end, is set to be greater than or equal to 1/1360 and less than or equal to 1/670 with respect to the size in the longitudinal direction of the element. The amount of flexure is a sum of a distance from a regression line to an upper side maximum displacement point and a distance from the regression line to a lower side maximum displacement point when calculating the regression line representing the relation of the position X in the longitudinal direction of the element and the displacement Y in a thickness direction from a plurality of data sets showing the relation of position X and displacement Y.Type: GrantFiled: March 5, 2012Date of Patent: July 9, 2013Assignees: NGK Insulators, Ltd., NGK Optoceramics Co., Ltd.Inventors: Yoshio Suzuki, Kunihiko Nakagaki, Yuji Okuda
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Patent number: 8470154Abstract: The method of fabricating metal microstructures includes the following steps: a) taking a substrate that has a conductive strike surface; b) to d) forming a first resin mould by UV photolithography, the apertures in the first resin mould revealing the conductive strike surface of the substrate; e) electroforming the first element by galvanic deposition of a first metal material in the apertures of the first resin mould, f) removing the first mould around the first element to expose the conductive strike surface of the substrate; g) to i) forming a new resin mould by UV photolithography, the apertures in the new resin mould revealing the first element, and the conductive strike surface of the substrate; j) electroforming the second element by galvanic deposition of a second metal material in the apertures of the new resin mould to form said metal microstructure; k) separating said metal microstructure from the substrate and from said new mould.Type: GrantFiled: October 7, 2009Date of Patent: June 25, 2013Assignee: Nivarox-FAR S.A.Inventor: Gilles Rey-Mermet