Abstract: Disclosed is an electrochemical biosensor having a sample introduction channel in which an insulator is employed to introduce a small amount of a sample uniformly and accurately and to adjust an area of a working electrode, thereby guaranteeing the accurate quantitative analysis of a sample. Provided with a sample collection barrier at a sample entrance, the biosensor allows a sample to be introduced at higher accuracy and to be analyzed with higher reproducibility and reliability.

Abstract: A surface treating method of a negative electrode for a magnesium secondary battery is provided, wherein the magnesium secondary battery includes: a negative electrode capable of releasing magnesium ions during discharging and capable of precipitating elemental magnesium during charging; a positive electrode capable of precipitating a magnesium oxide during the discharging and capable of releasing magnesium ions during the charging; and a non-aqueous ion conductor for conducting magnesium ions as conduction species. The surface treating method comprises initializing the negative electrode by performing the discharging to form a bare surface at a surface of the negative electrode.

Abstract: A gas sensor having a sensor element including: a plate-shaped solid electrolyte body; and a pair of electrodes sandwiching the electrolyte body. The electrodes include a measurement electrode portion, and a standard electrode portion disposed in an inner portion of the sensor element. A lead portion, which extends along the surface of the solid electrolyte body, is connected to the standard electrode portion. The standard electrode portion is mainly formed with a precious metal and contains a ceramic. The lead portion is mainly formed of a precious metal and has a ceramic content smaller than the standard electrode portion. A porous portion, which extends to the inner portion of the sensor element along the surface of the solid electrolyte body, has a gas permeability higher than the lead portion, is mainly formed with a ceramic, and is connected to the standard electrode portion.

Abstract: There is provided a method of well filling copper in a conductivity-rendered non-through hole having an aspect ratio (depth/hole diameter) of 5 or more on a substrate in a short period of time, and the method comprises using an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid, chlorine ion, a brightener and a copolymer of diallylamines and sulfur dioxide and filling copper in the non-through hole by periodic current reversal copper plating.

Abstract: Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.

Abstract: Disclosed are apparatuses for detecting hemoglobin in patient samples. The apparatuses include a primary electrode and a reference electrode. The apparatus is configured to measure current or voltage generated between the primary electrode and the reference electrode in response a redox reaction catalyzed by hemoglobin. The apparatuses can detect a variety of hemoglobins, including dimeric hemoglobin associated with malaria. Also disclosed are biosensor systems including the apparatuses and methods of using the biosensor systems.

Abstract: Disclosed are pre-wetting apparatus designs and methods. In some embodiments, a pre-wetting apparatus includes a degasser, a process chamber, and a controller. The process chamber includes a wafer holder configured to hold a wafer substrate, a vacuum port configured to allow formation of a subatmospheric pressure in the process chamber, and a fluid inlet coupled to the degasser and configured to deliver a degassed pre-wetting fluid onto the wafer substrate at a velocity of at least about 7 meters per second whereby particles on the wafer substrate are dislodged and at a flow rate whereby dislodged particles are removed from the wafer substrate. The controller includes program instructions for forming a wetting layer on the wafer substrate in the process chamber by contacting the wafer substrate with the degassed pre-wetting fluid admitted through the fluid inlet at a flow rate of at least about 0.4 liters per minute.

Abstract: In order to compensate for variation in output of sensor elements 10, there is provided a compensating resistor 220 that has a resistance value reflected by correction information. The resistor 220 is connected in parallel with a VS cell 245 through paired electrode leads 236 and 237 and paired electrode pads 232 and 233. The paired electrode leads 236 and 237 are placed at a position electrically isolated from solid electrolyte substrates 120 and 140.

Abstract: Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrodeposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.

Abstract: A method for forming, on a conductive or semiconductor substrate, nanowires based on CuSCN, including the steps of: preparing an aqueous electrolytic solution from a Cu(II) salt having a concentration lower than 120 mM, a Cu(II) complexing agent from the aminocarboxylic acid family, and a thiocyanate salt, the solution having a pH ranging between 0.1 and 3; electrochemically depositing the aqueous electrolytic solution on the substrate.

Abstract: The present invention provides a device having at least one constriction that is sized to permit translocation of only a single copy of the molecule. The device has a pair of spaced apart sensing electrodes that border the constriction, which may be a nanopore. The first electrode is connected to a first affinity element and the second electrode is connected to a second affinity element. The first and second affinity elements are configured to temporarily form hydrogen bonds with first and second portions of the target molecule as the latter passes through the constriction.

Abstract: In a method for making hydraulic tubing a low carbon steel tube suitable for use as hydraulic tubing is coated on its inside surface with zinc phosphate and the outside surface is electroplated. The resulting hydraulic tubing will resist rust on the inside and on the outside during storage.

Abstract: Electroplating methods provide substantially uniform deposits of copper on the edges and walls of through-holes of printed circuit boards. The electroplating methods provide copper deposits which have high throwing power.

Abstract: Electric potential, current density, agitation, and deposition rate are controlled to deposit metal alloys, such as tin based solder alloys or magnetic alloys, with minimal variations in the weight ratios of alloying metals at different locations within the deposited metal alloy feature. Alternative embodiments include processes that form metal alloy features wherein the variation in weight ratio of alloying metals within the feature is not necessarily minimized, but is controlled to provide a desired variation. In addition to metal alloys, alternative embodiments include processes for improving the deposition of single metal features.

Abstract: Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional microneedle array comprising two or more microneedles, each including a high aspect ratio, polymeric three dimensional substrate structure which is at least substantially coated by an electrically conductive layer.

Abstract: An adjustable insertion assembly for an electrochemical sensor includes an electrode holder to receive the sensor, having a distal aperture to permit process fluid to contact the sensor. A receptacle slidably receives the holder, for a sliding range of motion extending from fully inserted to fully retracted positions. An open distal end portion of the receptacle extends through a wall of a process fluid vessel, so that the aperture is open to the process fluid when fully inserted, and closed when fully retracted. A leverage member is releasably movable relative to the receptacle, and moves with a captured extension. An abutment of the receptacle engages the extension so that movement of the leverage member in opposite directions alternately clamps and releases the electrode holder relative to the receptacle to substantially prevent and permit movement at substantially any point within the range of movement.

Abstract: An electroplating system and method has a needle anode associated with an XYZ or multi-direction positioning device and is configured for plating internal surfaces of holes in metal products. The needle anode is positioned such that an insertion portion of the needle anode is centered over a hole and inserted to a predetermined depth in the hole, with a discharge end located a predetermined distance from the inner end of the hole. Plating solution is supplied to the needle anode and flows continuously during plating from the discharge end of the needle, through a gap between the needle anode and inner surface of the hole, and out of the open end of the hole into a drain. In one example, the metal object is a terminal of an electrical connector and the hole is a solder cup at a terminal end of the connector.

Abstract: There is provided an electroplating method for a through-hole. The method includes: a first plating process, a second plating process, and a third plating process. The first plating process is a plating process of forming a metal film with a uniform thickness in the through-hole to reduce a diameter of the through-hole, the second plating process is a plating process of blocking up a central portion of the through-hole with the metal film using a PR pulsed current, and the third plating process is a plating process of completely filling the through-hole with the metal film using the plating current whose value is equal to or larger than a forward-current value of the PR pulsed current used in the second plating process.

Abstract: A method of determining an electrolyte in a sample including adding the sample to an electrolyte module, the electrolyte module including a dilution cup, a flow cell, and a pump, the flow cell having a flow channel with a first end and a second end, the first end fluidically coupled to the dilution cup, and the second end fluidically coupled to the pump; combining the sample with a diluent in the dilution cup to produce a diluted sample; operating the pump to aspirate the diluted sample into the flow cell; measuring the electrolyte in the diluted sample in the flow cell; and reversing the pump to dispense fluid through the second end to displace the diluted sample from the flow cell back into the dilution cup.

Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.