Abstract: A specified proton concentration in a volume (80) is produced by passing a controlled electrophoresis current through an adjacent electrophoresis volume (28) between a working electrode (26) and a counter electrode (24). An array of such volumes with specified proton concentration is used to provide the pH gradient for isoelectric focusing.

Abstract: A device for generating droplets includes a substrate comprising a reservoir site configured to hold a liquid and including a first electrode, a droplet creation site including a second electrode, and droplet separation site disposed between the reservoir site and the droplet creation site and containing an electrode. The device includes control circuitry operatively coupled to the first, second, and third electrodes. The control circuitry is configured to measure the fluid volume on the electrodes and independently adjust an applied voltage to increase/decrease the quantity of fluid. The device can move fluid onto the creation site or back onto to the reservoir site. When the fluid volume is at the desired value or range, a driving voltage is delivered to the first and second electrodes to form a new droplet. The device may generate droplets having a uniform or user-defined size smaller than the electrode.

Abstract: A copper electroplating bath for producing copper electrodeposits is described. The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl, aryl or alkylaryl diamine. The copper electroplating bath can be used for producing electroformed copper deposits having low oxygen content.

Abstract: A method for manufacturing a molding core includes: providing a cylindrical roller having a circumference surface coated with a first film layer; coating a second film layer on the first film layer; coating a preprocessed molding film on the second film layer; engraving a number of molding patterns on the preprocessed molding film to obtain a molding film; separating the molding film from the roller and spreading out the molding film to be a flat plate; and manufacturing the molding core using the molding film by electroforming method.

Abstract: A package substrate includes: a dielectric layer having two opposite surfaces; a wiring layer embedded in the dielectric layer and exposed from the two opposite surfaces of the dielectric layer, wherein the wiring layer has solder pads, conductive pads and circuit wires electrically connecting the solder pads and the conductive pads; and a first insulating protection layer disposed on one of the two opposite surfaces of the dielectric layer to cover the dielectric layer and the wiring layer and having a plurality of openings for exposing the conductive pads, respectively. The package substrate, by directly using the dielectric layer as a base, provides a package substrate having reduced thickness and lower fabrication costs compared to the prior art.

Abstract: A gas sensor element has a solid electrolyte of an oxygen ion conductivity, a target gas electrode formed on one surface of the solid electrolyte, a reference gas electrode formed on the other surface of the solid electrolyte, a porous diffusion resistance layer through which the target gas passes to reach the target gas electrode, and a catalyst layer formed on an outer surface of the porous diffusion resistance layer. The target gas electrode is formed around the porous diffusion resistance layer. The catalyst layer contains noble metal catalysts. The noble metal catalysts contain at least rhodium and palladium. A content of rhodium is not less than 10 mass % and a content of palladium is not less than 20 mass % to the entire of the noble metal catalysts.

Abstract: An apparatus and method for sensing time varying ionic current in an electrolytic system having a first fluid chamber and a second fluid chamber separated by a barrier structure is provided, wherein the barrier structure includes thick walls and a substrate having an orifice therein, with the first and second fluid chambers being in communication via the orifice. A potential is applied between electrodes in respective first and second fluid chambers, thus driving an electrical current between them and through the orifice. Total capacitance of the system is less than 10 pF. Analytes are added to one of the first and second fluid chambers and time varying ionic current that passes across the orifice is measured. An amplifier proximal to the barrier structure and electrodes amplifies the ionic current signal.

Abstract: The object of the present invention is an electroplating composition intended in particular for coating a copper-diffusion barrier layer with a seed layer, This composition comprises a source of copper ions, in a concentration of between 0.4 and 40mM; at least one copper complexing agent chosen from the group of primary aliphatic amines, secondary aliphatic amines, tertiary aliphatic amines, aromatic amines, nitrogen heterocycles and oximes; the copper/complexing agent(s) molar ratio being between 0.1 and 2.5, preferably between 0.3 and 1.3; and the pH of the composition being less than 7, preferably between 3.5 and 6.5.

Abstract: The disclosure relates to compositions, devices and methods for screening of photocatalysts for water-splitting.

Abstract: A method of activating a copper seed layer during a plating process is disclosed that comprises application of vapor generated by an ultrasonic wave nebulizer. The energized vapor droplets include water and a weak organic acid such as acetic acid, lactic acid, citric acid, uric acid, oxalic acid, or formic acid that have a vapor pressure proximate to that of water. The weak organic acid preferably has a pKa high enough to avoid Cu etching but is sufficiently acidic to remove copper oxide at a rate that is compatible with high throughput manufacturing. In one embodiment, weak acid/water vapor is applied to a substrate in a spin bowl and is followed by a deionized water rinse step in the same spin bowl. Improved wettability results in improved uniformity in subsequently plated copper films. Considerable cost savings is realized as a result of reduced chemical consumption and higher product yields.

Abstract: A mold is fabricated with a cavity formed in an insulating layer formed so as to be placed on an upper surface of a conductive base material. This mold is disposed in an electrolyte bath to be applied with a voltage, and a metal is electrodeposited on the bottom surface of the cavity to electroform a metal-formed product in the cavity. In this electrodepositing process, when the width of the cavity is taken as W and a vertical height of a head space between an upper opening of the cavity and an upper surface of a metal layer is taken as H, the growth of the metal layer is stopped so that the height H of the head space left above the metal layer satisfies: where 300 ?m?W; H?W/3.75 where 200 ?m?W<300 ?m; H?W/4 where 100 ?m?W<200 ?m; and H?W/10 where W<100 ?m.

Abstract: For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ?-caprolactam, is contained in the bath as a leveler.

Abstract: A method of manufacturing an electrode includes: providing a metal foil; depositing titanium metal on the metal foil; masking the titanium metal surface to control the density of sites where anodization will occur; and anodizing the Ti/metal foil so as to produce a nano-porous titania dielectric on the surface of the anode. The process may be on only one surface of the metal foil or on both sides simultaneously. The metal foil may be an aluminum foil. The porous titania dielectric may comprise titania nanotubes. An electrode structure may be fabricated using a linear process tool for reel-to-reel processing of a metal foil, the tool may include: a titanium deposition station for depositing a uniform thin film of titanium on the surface of the metal foil; a masking station for modifying the titanium surface to control the density of sites where anodization will occur; and an anodization station for transforming the Ti thin film into a porous titania dielectric film.

Abstract: Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards are described. One such method includes applying a first resist layer on a substrate having a first copper layer, applying a first image to the first resist layer, developing the first resist layer in accordance with the first image, applying a second copper layer on the first copper layer, electroplating a first metallic layer on the second copper layer, removing the first resist layer, etching a portion of the first copper layer, removing the first metallic layer, depositing a third copper layer on a surface of the assembly, applying a second resist layer on the third copper layer, applying a second image to the second resist layer, developing the second resist layer in accordance with the second image, electroplating a preselected metal layer on the third copper layer, removing the second resist layer, and etching a portion of the third copper layer.

Abstract: A composition comprising a source of metal ions and at least one leveling agent obtainable by condensing at least one trialkanolamine of the general formula N(R1—OH)3 (Ia) and/or at least one dialkanolamine of the general formula R2—N(R1—OH)2 (Ib) to give a polyalkanolamine(II), wherein the R1 radicals are each independently selected from a divalent, linear or branched aliphatic hydrocarbon radical having from 2 to 6 carbon atoms, and the R2 radicals are each selected from hydrogen and linear or branched aliphatic, cycloaliphatic and aromatic hydrocarbon radicals having from 1 to 30 carbon atoms, or derivatives obtainable by alkoxylation, substitution or alkoxylation and substitution of said polyalkanolamine(II).

Abstract: Variable property deposit, at least partially of fine-grained metallic material, optionally containing solid particulates dispersed therein, is disclosed. The electrodeposition conditions in a single plating cell are suitably adjusted to once or repeatedly vary at least one property in the deposit direction. In one embodiment denoted multidimension grading, property variation along the length and/or width of the deposit is also provided. Variable property metallic material deposits containing at least in part a fine-grained microstructure and variable property in the deposit direction and optionally multidimensionally, provide superior overall mechanical properties compared to monolithic fine-grained (average grain size: 2 nm-5 micron), entirely coarse-grained (average grain size: >20 micron) or entirely amorphous metallic material deposits.

Abstract: An electrochemical sensing apparatus and methods are provided. In one embodiment, an apparatus is provided having a carrier that supports an electrochemical module and that communicates between electrodes on the electrochemical module and an analyte measurement device.

Abstract: Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.

Abstract: A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The metallic article has a plurality of electroformed elements that are configured to serve as an electrical conduit for a photovoltaic cell. A first electroformed element has at least one of: a) a non-uniform width along a first length of the first element, b) a change in conduit direction along the first length of the first element, c) an expansion segment along the first length of the first element, d) a first width that is different from a second width of a second element in the plurality of electroformed elements, e) a first height that is different from a second height of the second element in the plurality of electroformed elements, and f) a top surface that is textured.

Abstract: A plating fixture that affords improved control and process repeatability of the placement of material on a surface of a terminal lead is described. The thereby plated terminal lead is further incorporatable into an electrochemical cell. The plating fixture consists of a membrane that prevents migration of the electroplating chemicals along areas of the lead that are not desired. Furthermore, the fixture utilizes a setup plate that controls the length of the lead that is plated.