Abstract: A flash memory device and related method of operation are provided. The device generally comprises a word line voltage generator circuit configured to generate a word line voltage based on incremental step pulse programming; and a word line voltage controller circuit that controls the word line voltage generator circuit so that either the unit program time or the increment size of the word line voltage is varied according to the number of program data bits among the set of input data bits that the device will store in memory cells.

Abstract: A Magnetic Random Access Memory (MRAM), in which very little current flows through MTJ elements and very little voltage is applied across them, the MRAM being provided with sense-amplifiers capable of amplifying the potential difference between their corresponding pairs of bit lines at high speed. This is accomplished by a sense amplifier including CMOS inverters cross-connected or connected in loop, a P-channel MOS transistor for shutting the power off during standby, and N-channel MOS transistors for initializing the output of the sense amplifier during standby. A ground terminal of the inverter is connected to a bit line through a transistor of a bit switch, and a ground terminal of the inverter is connected to a bit line through a transistor of a bit switch.

Abstract: Embodiments of the invention relate to non-volatile memory devices and their methods of manufacture. Embodiments comprise an array of non-volatile memory cells, the array comprising a multiplicity of array columns having at least one redundant column of non-volatile memory cells adapted to replace a defective array column, a column decoder, and a column redundancy unit. The column decoder is adapted to receive an address of a memory cell to which data is to be written or from which data is to be read. The column redundancy unit is adapted to decide whether the decoded address is to be written to or read from an array from or a redundant column. The data required by the column redundancy unit is stored in a column redundancy memory, which is connected to the column redundancy unit by means of a dedicated column redundancy bus.

Abstract: The invention proposes am improved twin MONOS memory device and its fabrication. The ONO layer is self-aligned to the control gate horizontally. The vertical insulator between the control gate and the word gate does not include a nitride layer. This prevents the problem of electron trapping. The device can be fabricated to pull the electrons out through either the top or the bottom oxide layer of the ONO insulator. The device also incorporates a raised memory bit diffusion between the control gates to reduce bit resistance. The twin MONOS memory array can be embedded into a standard CMOS circuit by the process of the present invention.

Abstract: Reading and verify operations are performed on non-volatile storage elements using temperature-compensated read voltages for unselected word lines, and/or for select gates such as drain or source side select gates of a NAND string. In one approach, while a read or verify voltage is applied to a selected word line, temperature-compensated read voltages are applied to unselected word lines and select gates. Word lines which directly neighbor the selected word line can receive a voltage which is not temperature compensated, or which is temperature-compensated to a reduced degree. The read or verify voltage applied to the selected word line can also be temperature-compensated. The temperature compensation may also account for word line position.

Abstract: In one embodiment, a memory array is provided comprising one or more columns each comprising a plurality of bit cells divided into groups of bit cells with each group of bit cells controllably coupled to a separate bit line.

Abstract: A delay from the release of a low power consumption mode of nonvolatile memory to the restart of read operation is reduced. Nonvolatile memory which can electrically rewrite stored information has in well regions plural nonvolatile memory cell transistors having drain electrodes and source electrodes respectively coupled to bit lines and source lines and gate electrodes coupled to word lines and storing information based on a difference between threshold voltages to a word line select level in read operation, and the nonvolatile memory has a low power consumption mode. In the low power consumption mode, a second voltage lower than a circuit ground voltage and higher than a first negative voltage necessary for read operation is supplied to the well regions and word lines. When boost forming a rewriting negative voltage therein, a circuit node at a negative voltage is not the circuit ground voltage in the low power consumption mode.

Abstract: A dynamic random access memory has logically identical circuits for providing the same logical control signals. Each set of control signals can have different electrical parameters. One circuit can be optimized for high speed performance, while another circuit can be optimized for low power consumption. The logically identical circuits can include wordline address predecoder circuits, where a high speed predecoder circuit is enabled during a normal operating mode and a slower low power predecoder circuit is enabled for self-refresh operations. During self-refresh operations, the high speed circuit can be decoupled from the power supply to minimize its current leakage.

Abstract: The invention proposes am improved twin MONOS memory device and its fabrication. The ONO layer is self-aligned to the control gate horizontally. The vertical insulator between the control gate and the word gate does not include a nitride layer. This prevents the problem of electron trapping. The device can be fabricated to pull the electrons out through either the top or the bottom oxide layer of the ONO insulator. The device also incorporates a raised memory bit diffusion between the control gates to reduce bit resistance. The twin MONOS memory array can be embedded into a standard CMOS circuit by the process of the present invention.

Abstract: A memory device is provided which includes a substrate, a common P-well isolated from the substrate, a plurality of sectors, and a common sector selection transistor configured to select one of the sectors for erasure. Each of the sectors share the same common sector select transistor, and the common P-well. The selected sector is configured to be erased by applying appropriate voltages to the selected sector.

Abstract: Memory blocks having memory cells which are comprised of vertical transistors and memory elements in which the resistance value is varied depending on the temperature imposed on the upper side thereof, are laminated to realize a highly-integrated non-volatile memory.

Abstract: A tunnel magnetic resistive element forming a magnetic memory cell includes a fixed magnetic layer having a fixed magnetic field of a fixed direction, a free magnetic layer magnetized by an applied magnetic field, and a tunnel barrier that is an insulator film provided between the fixed and free magnetic layers in a tunnel junction region. In the free magnetic layer, a region corresponding to an easy axis region having characteristics desirable as a memory cell is used as the tunnel junction region. A hard axis region having characteristics undesirable as a memory cell is not used as a portion of the tunnel magnetic resistive element.

Abstract: A method of performing a power on sequence for a flash memory includes applying device voltage to the flash memory and loading nonvolatile memory data and nonvolatile memory complementary data to a read data register and a read complementary data register, respectively. The nonvolatile memory data and the nonvolatile memory complementary data are compared with the read data register and the read complementary data register during the power on sequence, e.g., after initial power up or power on reset (POR). When the comparison determines a mismatch, the loading of the nonvolatile memory data and the nonvolatile memory complementary data to the read data register and the read complementary data register, respectively, is repeated.

Abstract: A memory component includes at least one memory bank array, a DQ region, a clock tree, and a voltage generator. The memory component is configured in a semiconductor wafer. The at least one memory bank array is configured such that data is read out of it during a read operation. The clock tree is coupled to the DQ region and is configured for driving data during the read operation. The voltage generator is coupled to at least some components of the clock tree in order to provide at least some of the components of the clock tree with an increased voltage.

Abstract: A nonvolatile memory array has a single transistor flash memory cell and a two transistor EEPROM memory cell which maybe integrated on the same substrate. The nonvolatile memory cell has a floating gate with a low coupling coefficient to permit a smaller memory cell. The floating gate placed over a tunneling insulation layer, the floating gate is aligned with edges of the source region and the drain region and having a width defined by a width of the edges of the source the drain. The floating gate and control gate have a relatively small coupling ratio of less than 50% to allow scaling of the nonvolatile memory cells. The nonvolatile memory cells are programmed with channel hot electron programming and erased with Fowler Nordheim tunneling at relatively high voltages.

Abstract: A method of operating on a plurality of non-volatile multi-level memory cells is disclosed. The memory cells have at least a first, second, third and fourth program level. Each of program levels corresponds to a different binary state and has a voltage threshold distribution. A constant operating voltage is maintained on the memory cells and the voltage threshold distribution of the memory cell is controlled by varying a pulse width of a programming pulse applied to each memory cell.

Abstract: A memory comprises a sense amplifier for sensing a logic state of a selected bitline. The sense amplifier includes a first precharge circuit, a current-to-voltage converter, a latch circuit, and a second precharge circuit. The first precharge circuit is for precharging a selected bitline to a first predetermined voltage in response to a first precharge signal. The current-to-voltage converter has a current input coupled to the selected bitline, and a voltage output. A latch circuit has a storage node coupled to the voltage output of the current-to-voltage converter. The second precharge circuit is for precharging the storage node of the latch circuit to a second predetermined voltage in response to a second precharge signal.

Abstract: Word line driver circuitry for selectively charging and discharging one or more word lines is provided. The driver circuitry uses a dual transistor topology, where a first transistor is driven by a signal, DOUT, and a second transistor is driven by a time-delayed complement of the DOUT, DOUT_BAR. The time delay prevents DOUT_BAR from changing its state immediately after DOUT changes state. As result, both the first and second transistors are turned ON at the same time for a predetermined of time. It is during this time that the voltage on the word line is rapidly driven to a LOW voltage. When the second transistor turns OFF, high impedance circuitry limits the flow of leakage current. This minimizes leakage current when the word line is OFF and when short circuit conditions are present between two or more word lines or between a word line and a bit line.

Abstract: Systems and methods for reducing the latency of data transfers between memory cells by enabling data to be transferred directly between sense amplifiers in the memory system. In one embodiment, a memory system uses a conventional DRAM memory structure having a pair of first-level sense amplifiers, a second-level sense amplifier and control logic for the sense amplifiers. Each of the sense amplifiers is configured to be selectively coupled to a data line. In a direct data transfer mode, the control logic generates control signals that cause the sense amplifiers to transfer data from a first one of the first-level sense amplifiers (a source sense amplifier) to the second-level sense amplifier, and from there to a second one of the first-level sense amplifiers (a destination sense amplifier.) The structure of these sense amplifiers is conventional, and the operation of the system is enabled by modified control logic.

Abstract: A string of memory cells with a charge trapping structure is read, by selecting part of a memory cell selected by a word line. Part of the memory cell is selected by turning on one of the pass transistors on either side of the string of memory cells. The charge storage state of the selected part is determined by measuring current in a bit line tied to both pass transistors.