Abstract: A dual port memory is updated at substantially the same data sampling rate as a clock frequency of the dual port memory. The dual port memory stores data relating to each different parameter value in a stream of data samples, and provides the stored data from an address in the memory corresponding to the received parameter value. An updating element updates stored data and provides the updated data to an input of the dual port memory for writing back into the address corresponding to the received parameter value. A first port of the dual port memory is utilised as the output of the dual port memory coupled to the input of the updating element on a first clock cycle of the dual port memory, and a second port of the dual port memory is normally utilised as the input of the dual port memory coupled to the output of the updating element on a second clock cycle, the next address being accessed via the first port on the second clock cycle.

Abstract: Storage circuitry (66) may be used to store the values of fuses (77) so that storage circuitry (66) can be read instead of fuses (77). By accessing the fuse values from storage circuitry (66) rather than from fuses (77), there will be no sense current to fuses (77) that may cause marginal fuse blowage for fuses that have not yet been blown. This helps to prevent the situation in which an unblown fuse is erroneously read as having been blown. The use of storage circuitry (66) thus significantly improves the reliability of fuse module (20). For some embodiments, selection storage circuitry (64) may be used to determine whether storage circuitry (66) may be read or whether one of fuses (77) must be read in order to retrieve the desired current fuse value. The fuse value stored in storage circuitry (66) can also be used as direct hardware signals (80).

Abstract: A method for repairing cells of a flash memory array includes using a fuse memory array circuit. The fuse memory cells are initially programmed. The locations of defective memory cells of the main array are determined. These locations are stored in the fuse memory cells by erasing predetermined locations in the fuse memory cell array so that the locations are programmed.

Abstract: Disclosed are a precharge circuit employing an inactive weak precharging and equalizing scheme, a memory device including the same and a precharging method. The inactive weak precharging and equalizing scheme equalizes a non-selected bit line and complementary bit line while sensing and amplifying memory cell data delivered to a selected bit line and complementary bit line to evaluate the voltage difference between the selected bit line and complementary bit line. Then, the scheme precharges the selected bit line and complementary bit line and the non-selected bit line and complementary bit line. This does not require high precharge driving capability for inactivated bit line and complementary bit line equalized to a predetermined voltage level so that precharge current and operating current can be reduced.

Abstract: Flash memory devices having a cell string structure. According to the present invention, the size of a first group of memory cells connected to a first word line and a second group of memory cells connected to a last word line is formed greater than that of a third group of memory cells respectively connected to the remaining word lines other than the first and last word lines. Accordingly, the program speed of the first and second groups of the memory cells can be improved.

Abstract: The invention proposes am improved twin MONOS memory device and its fabrication. The ONO layer is self-aligned to the control gate horizontally. The vertical insulator between the control gate and the word gate does not include a nitride layer. This prevents the problem of electron trapping. The device can be fabricated to pull the electrons out through either the top or the bottom oxide layer of the ONO insulator. The device also incorporates a raised memory bit diffusion between the control gates to reduce bit resistance. The twin MONOS memory array can be embedded into a standard CMOS circuit by the process of the present invention.

Abstract: A semiconductor memory with wordline timing, which links activating a wordline to an isolation signal. The isolation signal is applied to a memory section adjacent the memory section containing the wordline to be activated. Upon such an isolation signal shifting low and isolating the adjacent memory section, a timing circuit triggers a wordline decoder to activate a select wordline. The timing circuit prevents activation of the wordline decoder until the isolation signal is received.

Abstract: A circuit for implementing memory arrays using a global bitline domino read/write scheme. The memory circuit includes a plurality of cells each configured to store a bit of data. The memory circuit further includes a plurality of local bitlines, wherein each cells is coupled to one of the local bitlines. Each of the plurality of local bitlines is a differential bitline having a signal path and a complementary signal path which are cross-coupled by a pair of transistors.

Abstract: The semiconductor memory device comprising: an n-channel memory cell transistor including: a first diffused region and a second diffused region formed in a semiconductor substrate; a charge storage layer formed over the semiconductor substrate between the first diffused region and the second diffused region; and a gate electrode formed over the charge storage layer; a power supply circuit formed on the semiconductor substrate, the power supply circuit being connectable to the first diffused region, pumping a voltage supplied from an outside power supply and outputting the pumped voltage; and writing means which, upon writing to the n-channel memory cell transistor, applies a reference voltage to the second diffused region, and applies a negative voltage with respective to the reference voltage supplied from the power supply circuit to the first diffused region to thereby flow current between the first diffused region and the second diffused region and to store charges in the charge storage layer.

Abstract: A memory cell has a selection transistor constituted of an MOS transistor having a gate electrode and a cell transistor constituted of an MOS transistor having the same polarity as the selection transistor, in such a configuration that these two transistors are connected in series. A bit line is connected to a drain region of the selection transistor and a word line is connected to the gate electrode thereof. A gate electrode of the cell transistor is not electrically connected anywhere so as to be in a floating potential state, while a drain region thereof is connected to a source region of the selection transistor. A source line is connected to a source region of the cell transistor.

Abstract: Non-volatile memory read operations compensate for floating gate coupling when the apparent threshold voltage of a memory cell may have shifted. A memory cell of interest can be read using a reference value based on a level of charge read from a neighboring memory cell. Misreading the neighboring cell may have greater effects in particular programming methodologies, and more specifically, when reading the neighboring cell for particular states or charge levels in those methodologies. In one embodiment, memory cells are programmed to create a wider margin between particular states where misreading a neighboring cell is more detrimental. Further, memory cells are read in one embodiment by compensating for floating gate coupling based on the state of a neighboring cell when reading at certain reference levels but not when reading at other reference levels, such as those where a wider margin has been created.

Abstract: A method and apparatus is described herein for managing bad blocks/sectors in a nonvolatile memory. Upon detecting an input/output fault to a target block in a nonvolatile memory, the target block is remapped to a spare block, if the block is predicted as a bad block. Remapping is done for blocks used to store code both in serial execution code sequences and code sequences utilizing address translation. The remapping of bad blocks/sectors in nonvolatile memory allows nonvolatile memory in computer systems to be robust and resilient in handling bad blocks.

Abstract: Non-volatile storage elements are programmed using counter-transitioning waveform portions on neighboring word lines which reduce capacitive coupling to a selected word line. In one approach, the waveform portions extend between pass or isolation voltages of a boosting mode, which are applied during a programming pulse on the selected word line, and read voltages, which are applied when verify pulses are applied to the selected word line to verify whether the storage elements have been programmed to a desired programming state. The waveform portions reduce the net voltage change which is coupled to the selected word line. The selected word line can reach a reduced, steady state level sooner so that the verify pulses can be applied sooner, thus reducing the overall programming time.

Abstract: A semiconductor memory with wordline timing, which links activating a wordline to an isolation signal. The isolation signal is applied to a memory section adjacent the memory section containing the wordline to be activated. Upon such an isolation signal shifting low and isolating the adjacent memory section, a timing circuit triggers a wordline decoder to activate a select wordline. The timing circuit prevents activation of the wordline decoder until the isolation signal is received.

Abstract: A flash memory device is programmed by loading first data into a page buffer of a first mat. Second data is loaded into a page buffer of a second mat while programming the first data in a first memory block of the first mat.

Abstract: Disclosed are a precharge circuit employing an inactive weak precharging and equalizing scheme, a memory device including the same and a precharging method. The inactive weak precharging and equalizing scheme equalizes a non-selected bit line and complementary bit line while sensing and amplifying memory cell data delivered to a selected bit line and complementary bit line to evaluate the voltage difference between the selected bit line and complementary bit line. Then, the scheme precharges the selected bit line and complementary bit line and the non-selected bit line and complementary bit line. This does not require high precharge driving capability for inactivated bit line and complementary bit line equalized to a predetermined voltage level so that precharge current and operating current can be reduced.

Abstract: An access circuit selectively couples an externally accessible terminal to each of a plurality of isolated DRAM wells in which respective DRAM arrays are fabricated. The access circuit for each well includes first and second transistors fabricated in respective wells coupled between the externally accessible terminal and a respective one of the DRAM wells. The well of the first transistor is coupled to the externally accessible terminal, and the well of the other transistor is coupled to a respective DRAM well. A control circuit applies select signals to gate electrodes of the first and second transistors. The control circuit includes respective shunt transistors that shunt the gate electrodes to the source regions of the first and second transistors when the transistors are turned off to isolate the respective DRAM wells from the external terminal regardless of the magnitude and polarity of a test voltage applied to the externally accessible terminal.

Abstract: A method and apparatus are provided for high performance, high voltage memory operations on selected memory cells (200) of a semiconductor memory device (100). A high voltage generator (106) during program or erase operations provides a continuous high voltage level (702) on selected word lines (502) and maintains a continuous high voltage level supply to a bit line decoder (120) which sequentially provides the high voltage level (706) to a first portion of bit lines (504) and discharges (708) those bit lines (504) before providing the high voltage level to a second portion (710).

Abstract: A memory cell with a charge trapping structure is read by measuring current between the substrate region of the memory cell and one of the source region of the memory cell and the drain region of the memory cell. The read operation decreases the coupling between different parts of the charge trapping structure when other parts of the charge trapping structure store data that are not of interest. The sensing window of the memory cell can be greatly improved by this read operation.

Abstract: Reading and verify operations are performed on non-volatile storage elements using temperature-compensated read voltages for unselected word lines, and/or for select gates such as drain or source side select gates of a NAND string. In one approach, while a read or verify voltage is applied to a selected word line, temperature-compensated read voltages are applied to unselected word lines and select gates. Word lines which directly neighbor the selected word line can receive a voltage which is not temperature compensated, or which is temperature-compensated to a reduced degree. The read or verify voltage applied to the selected word line can also be temperature-compensated. The temperature compensation may also account for word line position.