Patents Examined by Mandeep S Buttar
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Patent number: 11497140Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. Advantageously an absorption/desorption unit is employed having a carbon element and a controller configured to regulate the absorption unit.Type: GrantFiled: May 17, 2021Date of Patent: November 8, 2022Assignee: TMGCORE, INC.Inventors: John David Enright, Jacob Mertel, Taylor Monnig, William Hadala
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Patent number: 11491933Abstract: An integrated controller (A) for a vehicle, and a vehicle (B), where the integrated controller (A) includes a box body (10), a high-voltage power distribution module (900) disposed in the box body (10), and a left driving motor controller (300), a right driving motor controller (400), an air compressor motor controller (500), a steering motor controller (600), and a DC-DC voltage converter (700) that are all connected to the high-voltage power distribution module (900); and the box body (10) is provided with a plurality of input/output interfaces corresponding to the high-voltage power distribution module (900), the left driving motor controller (300), the right driving motor controller (400), the air compressor motor controller (500), the steering motor controller (600), and the DC-DC voltage converter (700).Type: GrantFiled: July 26, 2019Date of Patent: November 8, 2022Assignee: BYD COMPANY LIMITEDInventors: Lulin Zeng, Axi Qi, Cunlong Liu, Qiwei Zhan, Youxin Zhang
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Patent number: 11497147Abstract: A cooling module for a parallel type power module of an inverter may include parallel type power modules configured to be disposed in three or more columns and rows, wherein three parallel type power modules are disposed to correspond to U, V, and W phases of the inverter in the three or more rows in each of the three or more columns, a first cooling water passage having a passage through which cooling water flows and configured to be brought into contact with an upper surface and a lower surface of a power module disposed at a first row, and a second cooling water passage having a passage through which the cooling water flows and configured to be brought into contact with an upper surface and a lower surface of a power module disposed at a third row.Type: GrantFiled: June 25, 2020Date of Patent: November 8, 2022Assignees: Hyundai Motor Company, Kia Motors CorporationInventors: Je-Hwan Lee, Han-Geun Jang, Eun-Cheol Lee, Seong-Min Lee, Yun-Ho Kim, Sang-Cheol Shin
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Patent number: 11487326Abstract: The present disclosure relates to a docking station including a triangular prism shaped body, and a cradle proximal to a top section of the triangular prism shaped body for detachably receiving a mobile device, wherein the cradle may include a plurality of different connection interfaces to provide a selectable connection with a complementary connection interface of the mobile device.Type: GrantFiled: November 4, 2020Date of Patent: November 1, 2022Assignee: Intel CorporationInventors: Jeff Ku, Tin Poay Chuah, Yew San Lim, Min Suet Lim, Chee Chun Yee
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Patent number: 11481009Abstract: Example implementations relate to a host electronic device and a method of establishing a thermal contact with a removable electronic device by a cooling component of the host electronic device. The host electronic device includes a housing, the cooling component, and a plurality of flexible arms. The cooling component is movably coupled to the housing. The plurality of flexible arms extend towards an internal cavity of the housing to hold the cooling component in a first position (retracted position). Further, the plurality of flexible arms are displaceable from the internal cavity by a movement of the removable electronic device into the host electronic device, to allow the cooling component to drop down to a second position (extended position) for establishing the thermal contact with a heat generating component of the removable electronic device.Type: GrantFiled: April 22, 2021Date of Patent: October 25, 2022Assignee: Hewlett Packard Enterprise Development LPInventor: Michael Scott
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Patent number: 11477914Abstract: An immersion liquid cooling tank assembly includes a generally hexagonal tank, a condenser, a manifold system, and at least one top cover. The tank includes a base and a plurality of side walls. The base and the plurality of sidewalls are connected. The condenser includes a plurality of condenser tubes. The manifold system is coupled to the condenser to assist in distributing liquid flow to and from the plurality of condenser tubes. The at least one top cover is located generally opposite to the base.Type: GrantFiled: April 21, 2021Date of Patent: October 18, 2022Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Yu-Nien Huang, Guo-Xiang Hu
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Patent number: 11477923Abstract: Field customizable airflow systems, and methods related to the same, are provided. A housing for an electronic display subassembly includes an intake and an exhaust for ambient air. A communications box located above the electronic display subassembly includes one or more electronic components, a convection aperture plate with one or more apertures, an intake portion, an exhaust portion, and one or more fans which cause a flow of ambient air to be accepted at the intake portion, circulated through each of the apertures in the convection aperture plate, and exhausted through the exhaust portion when activated.Type: GrantFiled: October 2, 2020Date of Patent: October 18, 2022Assignee: Manufacturing Resources International, Inc.Inventor: Mike Brown
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Patent number: 11477912Abstract: An autonomous vehicle is disclosed which can map a facility and navigate its way to a particular liquid cooling system. The vehicle can be in communication with a central server, which can control the vehicle. The vehicle can align itself against the liquid cooling system and receive a computing device on a platform of the vehicle. The platform can be lowered and secured in an enclosure of the vehicle. Then, the vehicle can transport the computing device to a storage facility.Type: GrantFiled: August 3, 2021Date of Patent: October 18, 2022Assignee: TMGCore, INC.Inventors: John David Enright, Jacob Mertel, Taylor Monnig, William Hadala
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Patent number: 11470745Abstract: An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed on the chassis. The heat dissipation assembly includes evaporator and condenser. The evaporator is in thermal contact with the heat source. The condenser is disposed on the chassis and comprises first thermally conductive plate, second thermally conductive plate and third thermally conductive plate that are stacked on one another. A condensation space is formed between the first thermally conductive plate and the second thermally conductive plate. A first liquid-cooling space is formed between the second thermally conductive plate and the third thermally conductive plate. The condensation space is in fluid communication with the evaporator. The first liquid-cooling space is not in fluid communication with the condensation space and is configured to be in fluid communication with the external heat dissipation device.Type: GrantFiled: June 16, 2021Date of Patent: October 11, 2022Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Kai-Yang Tung, Hung-Ju Chen
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Patent number: 11456020Abstract: A data storage system includes a chassis housing multiple data storage devices, such as hard disk drives, a compartment housing cooling fans, and an air plenum positioned between the fans and the storage devices. A multibody chambered acoustic attenuator, which may be installed in the air plenum, includes a plate part having airflow holes therethrough and may include a convex arched part having airflow holes therethrough and coupled with the plate part to form a chamber. Acoustic damping material lines an interior surface of the plate part and the interior and exterior surfaces of the arched part, and the airflow holes of the plate part and of the arched part are not aligned, such that direct acoustic emissions and reflections would contact the acoustic damping material and a circuitous airflow path is provided from the cooling fans to the storage devices, to reduce the acoustic sound pressure upon the devices.Type: GrantFiled: June 30, 2020Date of Patent: September 27, 2022Assignee: Western Digital Technologies, Inc.Inventors: David Niss, Hussam Zebian, Dana Fisher, Jeffrey Wilke
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Patent number: 11452231Abstract: Various types of electronic devices may be mounted in a chassis in order to facilitate interfacing with the devices, containing the devices, provide cooling systems which may remove heat from the electronic devices, etc. Delivering adequate cooling air flow to each electronic device in a chassis may be an important issue for the proper functioning, lifetime, or other characteristics of electronic devices contained in a chassis. Some electronic devices may be particularly challenging to cool due to various design characteristics. Other electronic devices may have other requirements that are not well served by existing chassis designs. For example, some electronic devices may benefit from additional electrical and/or thermal connections. Embodiments presented herein describe a novel design for a modular card cage accessory that may be configured to modify air flow and/or to meet particular requirements of an electronic device in a chassis, among various possibilities.Type: GrantFiled: June 15, 2020Date of Patent: September 20, 2022Assignee: National Instruments CorporationInventors: Richard G. Baldwin, Jr., Michael H. Singerman
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Patent number: 11452225Abstract: A fin frame baseplate is disclosed. Specific implementations include a baseplate configured to be coupled to a substrate, a fin frame including a base portion coupled to the baseplate, and a plurality of fins extending from the base portion, the plurality of fins protruding from the base portion. The fin frame may include a plurality of openings therethrough.Type: GrantFiled: March 29, 2021Date of Patent: September 20, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Atapol Prajuckamol, Chee Hiong Chew, Yushuang Yao
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Patent number: 11432434Abstract: A system includes a network element having a housing that is configured for front-to-rear airflow; and a cooling apparatus located adjacent to the network element and having a housing that forms a cavity that is closed by the housing of the network element, wherein the cooling apparatus includes one or more fan units that are accessible via front access and wherein the one or more fan units are configured to draw the front-to-rear airflow from the network element into the cavity. This enables a front-to-back airflow design with rear fan access to be converted into a front-to-back airflow design with front fan access.Type: GrantFiled: December 7, 2020Date of Patent: August 30, 2022Assignee: Ciena CorporationInventors: Cindy Lee, Kevan Peter Jones, Michael R. Bishop
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Patent number: 11432431Abstract: A two-phase cooling apparatus for an information handling system, including a container holding dielectric fluid, the dielectric fluid having a vapor-fluid boundary within the container, the container further containing a printed circuit board (PCB) including computing components, with the dielectric fluid surrounding the PCB and the computing components, the dielectric fluid decreasing a temperature of the PCB by removing heat from the PCB in the form of vaporization; a pump positioned within the container, the pump capturing a portion of vapor of the dielectric fluid, at the vapor-fluid boundary, that results from the vaporization of the dielectric fluid; and a diffuser positioned within the container and coupled to the pump to introduce the captured vapor into the dielectric fluid.Type: GrantFiled: April 9, 2021Date of Patent: August 30, 2022Assignee: Dell Products L.P.Inventors: Steven Thomas Embleton, Jon Taylor Fitch, Jimmy Doyle Pike
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Patent number: 11419245Abstract: A data centre, a method of cooling electrical equipment in a data centre, and a services module for a data centre, are disclosed. The data centre is for accommodating a plurality of racks of IT equipment and comprises: a) a plurality of hot aisles interleaved with a plurality of cold aisles separated by IT equipment rack storage areas; b) an air handling unit configured to supply cooling air to the cold aisles; c) a services area for accommodating at least one UPS switchboard for directing electrical power to a plurality of IT equipment racks, the services area comprising hot and cold zones, a hot zone being separated from a cold zone by at least one of (i) a UPS switchboard storage area and (ii) a partition; wherein, in use, cooling air is supplied to the UPS switchboard storage area from the air handling unit via the cold zone of the services area.Type: GrantFiled: September 10, 2019Date of Patent: August 16, 2022Assignee: Bripco (UK) LimitedInventors: William Thornton, Aaron Favill
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Patent number: 11402884Abstract: A crossflow air deflector part for directing airflow includes a front central spine, a first arcuate wall extending from the spine to a first back lateral edge of the airflow deflector, and a second arcuate wall extending from the spine to a second back lateral edge of the airflow deflector opposing the first back lateral edge. Such an airflow deflector can be implemented into a storage server, positioned between a laterally adjacent pair of data storage device (DSD) chambers and a pair of vertically stacked fans, such that the crossflow air deflector functions to direct airflow from one of the lateral DSD chambers into the lower fan and to direct airflow from the other lateral DSD chamber into the upper fan. Independent airflow control for each DSD chamber and each corresponding DSD is thereby provided.Type: GrantFiled: February 16, 2021Date of Patent: August 2, 2022Assignee: Western Digital Technologies, Inc.Inventors: Shailesh R Nayak, Joe Paul Moolanmoozha, Steven Cheng, Erik Silaprasay, Nicholas Maris
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Patent number: 11406045Abstract: The invention concerns a helicopter ventilation architecture, said helicopter comprising at least two avionics bays (112a, 112b) comprising electronic equipment (116a, 116b) to be ventilated, said architecture comprising, for each avionics bay, an air inlet (120a, 120b) allowing outside air to enter the avionics bay in order to ventilate said avionics bay, and an air outlet (124a, 124b), allowing the air ventilating the avionics bay to exit the avionics bay, characterised in that the ventilation architecture further comprises a mixing chamber (134), connected to the air outlets, configured to receive the air originating from all the avionics bays, at least one air duct (138a, 138b), connected to the mixing chamber and to an outlet (130a, 130b) for discharging the air to the outside, and at least two fans (128a, 128b), arranged and distributed in the air duct or ducts.Type: GrantFiled: July 10, 2018Date of Patent: August 2, 2022Assignee: SAFRAN ELECTRICAL & POWERInventors: Christophe Castelli, Fabien Del Rio, Florent Challas, Jean Manel-Delaleux
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Patent number: 11405063Abstract: Described herein are radio tray assemblies that include space for a specific radio and its power supply and that additionally provide cooling and power conversion and control functionalities. The disclosed radio tray assemblies are designed to have a form factor compatible with legacy radio systems (e.g., MIDS-LVT) while enabling installation of a new radio system (e.g., MIDS-JTRS). The disclosed radio tray assemblies are configured so that the radio and its power supply are secured to a tray so that the radio and power supply are side-by-side and parallel lengthwise. A cooling module or assembly of the disclosed radio tray assemblies is disposed immediately behind the radio and its power supply and is configured to cool these units using forced air cooling directed lengthwise through the radio and its power supply. A power converter and controller module converts input power into the power required by the radio power supply.Type: GrantFiled: January 15, 2021Date of Patent: August 2, 2022Assignee: VIASAT, INC.Inventors: Gregory D. Ostrin, Thomas J. Rock, Gregory A. Smyth
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Patent number: 11399448Abstract: A chassis can include a sliding liquid distributor that has blind mate connectors. The blind mate connectors mate with an IT rack in one direction and one or more electronic devices in an opposite direction. The liquid distributor circulates fluid to-and-from the electronic devices from-and-to the IT rack. Other embodiments are described and claimed.Type: GrantFiled: February 25, 2021Date of Patent: July 26, 2022Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 11388837Abstract: A server information handling system may include a processor; a network interface device (NID); a power source; a vertical backplane for providing electrical and data coupling to a plurality of hard disk drives (HDDs) operatively coupled to the vertical back plane; a plurality of vent holes formed through the vertical backplane; and an acoustic dampening device including a duct extension protruding away from the plurality of vent holes formed through the vertical backplane; the duct extensions to acoustically separate a fan system of the server information handling system from the plurality of HDDs within the information handling system server by mitigation of acoustic energy transmission generated by airflow through the plurality of vent holes.Type: GrantFiled: September 24, 2020Date of Patent: July 12, 2022Assignee: Dell Products, LPInventors: Paul A. Waters, Jean M. Doglio, Evangelos Koutsavdis