Abstract: A processor can be damaged by a heat sink. If the heat sink is improperly installed, the heat sink may damage the processor and/or the motherboard. Sequential tightening of mechanical fasteners is thus recommended, but the sequential tightening is challenging to implement. Sequential tightening of fasteners helps reduce damage to a processor. When a heat sink is fastened over the processor to a motherboard, mechanical fasteners are tightened in a sequence to reduce damage to the processor. To ensure sequential tightening of the mechanical fasteners, the heat sink is first secured with only two of the mechanical fasteners preinstalled in two of four holes in the heat sink and sequentially tightened into a bolster plate on a bottom side of the motherboard. A cover is then installed over the heat sink, and the cover has two mechanical fasteners that align with a remaining two of the four holes in the heat sink. A remaining two of the mechanical fasteners may then be sequentially tightened into the bolster plate.

Abstract: A heat radiation member, a heat radiation circuit board, and a heat emission device package are provided. The heat radiation circuit board includes a printed circuit board in which a heat radiation region is defined, and a heat radiation member inserted into the heat radiation region and including a bottom surface attached to the heat radiation region and a lateral surface bent from the bottom surface to pass through the printed circuit board. The heat radiation member is inserted into a region of the heat radiation circuit board adjacent to the heat emission device so that the heat radiation effect is improved. The heat radiation member having the spatial structure is formed to obtain the superior heat radiation effect. The structure of the heat radiation member is simplified so that the heat radiation member is automatically assembled, thereby reducing the failure of the heat radiation member.

Abstract: A cooling module row for an inline-memory module is provided. The cooling module row may include an inlet chamber and an outlet chamber positioned at a same end of the cooling module row. The cooling module row may also include a conduit in fluid communication with the inlet chamber and the outlet chamber. The conduit may be sized to fit adjacent the in-line memory module. A method of heat management for an in-line memory module is also provided. The method may include positioning a cooling module row adjacent the in-line memory module, the cooling module row having an inlet chamber and an outlet chamber positioned at the same end of the cooling module row.

Abstract: Size reduction of a power conversion device is intended. A power conversion device according to the present invention includes: a first power semiconductor module; a second semiconductor module; and a fixing member which fixes the first power semiconductor module, wherein the first power semiconductor module has a first power semiconductor device, a first case which houses the first power semiconductor device, and a first flange portion connected to the case, the second power semiconductor module has a second power semiconductor device, and a second case which houses the second power semiconductor device, the second case is connected to the first flange portion so as to provide a first flow path space for allowing a coolant to flow between the second case and the first case, and the first flange portion is fixed to the fixing member while supporting the first case and the second power semiconductor module.

Abstract: An equipment strap is provided. The equipment strap includes at least one strap, the at least one strap configured to hold together a plurality of electronic devices as a bundle of the electronic devices. The equipment strap includes at least one panel attached to the at least one strap. The at least one panel includes at least one cable integrated therein. The at least one cable is configured to couple to the plurality of electronic devices, wherein the at least one cable provides an electrical interconnection among the plurality of electronic devices.

Abstract: Aspects of the embodiments are directed to an optics module including a top-side inner wall and a bottom-side inner wall. The optics module may include a receiving element for receiving a small form factor pluggable (SFP) device; a heat sink including a first portion, the first portion including a top side and a bottom side, the bottom side of the heat sink in contact with the receiving element; and a first springing element residing between the first portion of the heat sink and the top-side inner wall of the optics module, the first springing element configured to bias the top side of the first portion of the heat sink onto the receiving element. In some embodiments, the optics module also includes a thermal interface material residing between the bottom-side inner wall of the optics module and the second portion of the heat sink, the thermal interface material configured to establish a thermal conduction path between the bottom-side inner wall of the optics module and the heat sink.

Abstract: Disclosed herein is an electronic apparatus including a component disposed inside the electronic apparatus, a vent that is located in a first direction with respect to the component disposed inside the electronic apparatus and is opened toward the external of the electronic apparatus, a plurality of first louvers that are provided in the vent and are lined in a second direction perpendicular to the first direction when the vent is viewed along the first direction, and a plurality of second louvers that are located between the component disposed inside the electronic apparatus and the plurality of first louvers and are lined in the second direction when the vent is viewed along the first direction. A straight line that passes between adjacent two first louvers and is along the first direction intersects any of the plurality of second louvers.

Abstract: An embodiment provides an electronic device, including: a housing with an exhaust port and an intake port; a heat source contained in the housing; a heat transfer unit connected to the heat source; a first radiator located adjacent to the exhaust port, wherein the first radiator is connected to the heat transfer unit; a first blower fan, wherein the first blower fan discharges heat transmitted to the first radiator; and a second radiator located adjacent to the intake port, wherein the second radiator is connected to the heat transfer unit. Other embodiments are described and claimed.

Abstract: An electronic part module, comprising: an electronic part substrate having an insulating panel to which a plurality of bus bars is attached, each of the bus bars having an external terminal-connecting portion and being electrically connected to an electronic part, a case for receiving the electronic part substrate therein, and a connector-connecting portion in which a plurality of the external terminal-connecting portions of the plurality of bus bars is collected, and which is disposed between a plurality of the electronic parts.

Abstract: A first integrated circuit disposed in a region, in which a length of a first space in a device depth direction is largest, among two regions dividing an entire region of a first main surface of a signal processing circuit board into two in a device width direction. The first space is a space between the signal processing circuit board and a metal chassis, which is a member of the metal chassis and a back cover that opposes the first main surface on which the first integrated circuit is mounted. A first heat sink is disposed between the metal chassis and the back cover and has a plurality of fins. A length of each of the plurality of fins in the device depth direction is set according to a length of the first space in the device depth direction at a position of the fin in the device width direction.

Abstract: The present application provides a heat dissipating module, a heat dissipating system and a circuit module. The heat dissipating module adapted to be used with a heat element. The heat dissipating module comprises a heat exchanger which has a heat exchanging zone contacted with the heat element; a securing structure; and a fluid driving unit which is communicated with the heat exchanger for guiding a working fluid into the heat exchanger and is secured to the heat exchanger by the securing structure, wherein the fluid driving unit and the second heat exchanger are separately installed and communicated with each other.

Abstract: An electric power converter includes a stacked semiconductor unit formed by stacking semiconductor modules and cooling tubes, and a case. The case has a rear wall portion, a front wall portion, and a pair of side wall portions. The rear wall portion has an opening hole formed in a shape that an outer profile of the cooler fits inside. The stacked semiconductor unit has a closing member joined to a rear-most cooling pipe that is disposed on a rear side to close the opening hole, a refrigerant introducing pipe extended rearward from the closing member, and a refrigerant discharging pipe extended rearward from the closing member. The refrigerant introducing pipe and the refrigerant discharging pipe, and the closing member are connected in close contact with each other, and the closing member and the case are in close contact by a seal section.

Abstract: A stand-alone immersion tank datacenter (SITDC) includes: a multi-phase heat transfer immersion cooling tank having external walls surrounding a tank volume within which a dielectric liquid is maintained and heated to a boiling point temperature; a plurality of servers having one or more processing and memory components submerged within the dielectric liquid for cooling of the one or more components via heat dissipation from the one or more components into the dielectric liquid when the one or more components are connected to an electric power supply; and a condenser located vertically above the plurality of servers and in a direct path of rising dielectric vapor created when the dielectric liquid absorbs sufficient heat from the one or more components to reach a boiling point temperature of the liquid. The condenser can be a passive heat exchanger, created by providing a heat conductive material as a top lid of the tank.

Abstract: A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.

Abstract: A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided, a metal core provided on the lower surface of the first insulating layer, in such a way as to vertically overlap with the mounting regions, and a second insulating layer provided on the lower surface of the first insulating layer, around the metal core. The lower surface of the metal core is exposed from the second insulating layer, the thermal conductivities of the first insulating layer and the metal core are higher than the thermal conductivity of the second insulating layer, and the hardness of the first insulating layer is higher than the hardness of the second insulating layer. Through holes that penetrate the insulating layers and that connect wiring patterns of the insulating layers are provided.

Abstract: An electronic unit includes a heat sink, a substrate, a heating component, a temperature sensor, a first interconnection, and a second interconnection. The heat sink includes a strut. The substrate is fixed to the strut of the heat sink. The heating component is mounted on the substrate to generate heat upon energization of the heating component. The temperature sensor is mounted on the substrate to detect temperature. The first interconnection is provided in a high-temperature region in which the heating component is mounted on the substrate, and is connected to the strut of the heat sink. The second interconnection is provided in a detection region in which the temperature sensor is mounted on the substrate, and is provided separately from the first interconnection. The second interconnection is connected to the strut of the heat sink and the temperature sensor.

Abstract: The vertical data center module is a multistory compact footprint data center unit that exploits vertical air movements, both downward and upward, to efficiently sustain conventional low-cost air-cooled computing systems. It integrates a hybrid cooling system that can benefit from an air-side economizer without compromising its compact footprint. For polluted urban environments, this air-side economizer comprises an air-to-air heat exchanger to effectively limit the amount of outside air that can enter the module and come into contact with sensitive computing systems. Through side-to-side, side-to-back or back-to-back juxtaposition, multiple units can be assembled in clusters on a colocation site to create large-scale vertical data center complexes, effectively maximizing real estate use and cost effectiveness by fully exploiting all three dimensions.

Abstract: A system for building multistory data centers using prefabricated modules that can be both juxtaposed side-by-side and stacked vertically, with fluid communication across stories to create two-way vertical airflow for efficient and cost effective high density heat management.

Abstract: A display device includes a casing, a display panel, a transparent plate, a fan, a humidity sensor, a first temperature sensor, a second temperature sensor and a processing unit. The casing includes a front bezel with an opening. The display panel is disposed on a first side of the opening and the transparent plate is disposed on a second side of the opening such that a space is formed between the display panel and the transparent plate. The humidity sensor is configured for sensing a humidity of the space. The first temperature sensor is configured for sensing a first temperature of the space. The second temperature sensor is configured for sensing a second temperature of the transparent plate. When the processing unit determines that the humidity, the first temperature and the second temperature meet a predetermined relationship, the processing unit increases a rotational speed of the fan.

Abstract: An electronic apparatus includes a base and an electronic device. The base includes a first main body and at least one first connection portion. The first connection portion includes a rotating component, and the rotating component is pivoted to the first main body and has a driven portion and a positioning portion. The electronic device includes a second main body and at least one second connection portion. The second connection portion includes an elastic component and a positioning trench. The elastic component is connected to the second main body, and the positioning trench is formed on the second main body. When the base supports the electronic device so that the first connection portion is aligned to the second connection portion, the elastic component pushes the driven portion such that the positioning portion is engaged into the positioning trench.