Abstract: A deflection device and an electronic device are disclosed. The deflection device is located in the electronic device for guiding airflow generated by a fan device to at least one electronic component. The deflection device includes a first fixed part and a plurality of strip structures. The first fixed part is used for fixing the deflection device in a suitable position. One end of each of the strip structures is connected to the first fixed part and able to undergo compression deformation independently such that forms a first shape when not compressed or a second shape when compressed. When the deflection device is fixed in a suitable position of the electronic device and close to the electronic component, the shape of the at least one strip structure is changed from a first shape to a second shape for guiding the airflow to the electronic component.

Abstract: The present invention is an electrical signal computing module capable of accommodating printed circuit board, able to lead the exterior air into the main case body, exchange heat with the printed circuit boards, without accumulation of heat and damage of the printed circuit board. The present invention has a main case body with a bottom case and an internal board set, and four accommodating areas are formed by the internal board set and a transmission circuit board, in addition, numerous flow holes disposed at specific position are designed for air flowing in, exchanging heat produced by printed circuit boards as well.

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The cooling apparatus includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. The cooling apparatus further includes a coolant loop coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink.

Abstract: Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s).

Abstract: A thermal management system includes a distributor plate secured to and parallel to a circuit board. The circuit board has a module secured thereto and the distributor plate defines an area on an inner surface thereof secured to or otherwise in thermal contact with the module. Heat pipes embedded in the distributor plate include a portion over the module and a portion over the circuit board outward from the module. A portion of the heat pipes outward from the module may be substantially perpendicular to a direction of airflow between the circuit board and distributor plate. The module may be located closer to one edge of the circuit board and the heat pipes may according extend from adjacent that edge to an opposite edge of the circuit board. An inward facing surface may include fins extending toward the circuit board and the fins may be contoured to the circuit board.

Abstract: A heat dissipation device includes a heat absorbing member, a number of fins mounted on the heat absorbing member, a first connecting pipe, and a second connecting pipe. A top surface of the heat absorbing member defines a serpentine slot. The slot includes an inlet hole and an outlet hole communicating with two opposite ends of the slot and extending through the heat absorbing member. The first connecting pipe is connected to the inlet hole of the heat absorbing member, and the second pipe is connected to the outlet hole of the heat absorbing member.

Abstract: A system includes a rack, a plurality of shelves, a plurality of shelf-mountable electrical systems, and an inter-shelf power-pooling bus. The inter-shelf power-pooling bus is coupled to a power output of a shelf power supply mechanism on each of the shelves and a power input of a shelf computing device on each of the shelves. The inter-shelf power-pooling bus supplies pooled power from the shelf power supply mechanisms coupled to the inter-shelf power bus to the shelf computing devices coupled to the inter-shelf power-pooling bus.

Abstract: A radiator includes a header including a supply chamber for a coolant to cool an electronic part mounted on a circuit board and a discharge chamber partitioned from the supply chamber, and a plurality of tubes stacked in a heightwise direction of the header, one end of each of the plurality of tubes being connected to the supply chamber and the other end of each of the plurality of tubes being connected to the discharge chamber, and the coolant flowing from the one end to the other end. The plurality of tubes include a first tube at least including a lowermost tube, and a second tube provided over the first tube and having a surface area greater than that of the first tube.

Abstract: In a method for processing a plurality of printed circuit boards, comprising the following steps: providing a plurality of printed circuit boards, providing at least one frame element, for coupling to a plurality of printed circuit boards, coupling or the printed circuit boards to the at least one frame element, processing the printed circuit boards in the state coupled to the frame element, it is provided that printed circuit boards of different sizes and/or thicknesses and/or of different constructions are coupled to the at least one frame element to form a composite assembly and are subjected to further processing in the composite assembly formed by the printed circuit boards and the at least one frame element. Furthermore, a composite assembly for processing a plurality of printed circuit boards and also a use of such a method and composite assembly are provided.

Abstract: A tablet information handling system processes information with processing components disposed in a planar housing for presentation as images at a display disposed at the upper surface of the planar housing. Support members extend at the lower surface of the planar housing to support the planar housing in an upright configuration having the housing in a first orientation or an inclined configuration having the housing in a second orientation. A cooling fan controller manages cooling airflow direction through the planar housing based upon the orientation of the planar housing to blow hot air exiting the housing in a direction away from the likely location of an end user relative to the planar housing.

Abstract: A radiator includes a header including a supply chamber for a coolant to cool an electronic part mounted on a circuit board and a discharge chamber partitioned from the supply chamber, and a plurality of tubes stacked in a heightwise direction of the header, one end of each of the plurality of tubes being connected to the supply chamber and the other end of each of the plurality of tubes being connected to the discharge chamber, and the coolant flowing from the one end to the other end. The plurality of tubes include a first tube at least including a lowermost tube, and a second tube provided over the first tube and having a surface area greater than that of the first tube.

Abstract: Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and a daughterboard coupled to the motherboard and including a Graphics Processing Unit (GPU) coupled to a second side of the heat pipe. In other embodiments, a method may include providing a motherboard including a CPU; coupling a cooling system to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and coupling a daughterboard to the motherboard, the daughterboard including a GPU coupled to a second side of the heat pipe.

Abstract: Cooling device with liquid for electronic cards, in particular for high-performance processing units, comprising at least a hydraulic circuit in which a heat-carrying fluid flows in order to extract the heat produced by electronic components and/or hot spots present on an associated electronic card. The device comprises a cooling plate mechanically coupled to the electronic card so as to be inserted in a containing rack of the processing unit. The plate has a heat extraction surface facing and partly in contact, or at least in close proximity, with the electronic components and/or the hot spots. The hydraulic circuit is made in the thickness of the plate and has a geometric grid development, along which a plurality of hydraulic sub-circuits are disposed and switching means to define desired paths. The plate has sliding guide means able to cooperate with corresponding alignment means of the containing rack.

Abstract: A tablet information handling system processes information with processing components disposed in a planar housing for presentation as images at a display disposed at the upper surface of the planar housing. Support members extend at the lower surface of the planar housing to support the planar housing in an upright configuration having the housing in a first orientation or an inclined configuration having the housing in a second orientation. A cooling fan controller manages cooling airflow direction through the planar housing based upon the orientation of the planar housing to blow hot air exiting the housing in a direction away from the likely location of an end user relative to the planar housing.

Abstract: A portable electronic device includes a main body, a motherboard, at least one connector, and at least one external graphics card module. The motherboard is disposed within the main body and equipped without a built-in graphics chip. The connector is disposed on the motherboard. The main body has at least one slot, and the slot is disposed at a position corresponding to the position of the connector. The external graphics card module includes a circuit board, and a graphic processing unit and a first connecting interface are electrically disposed on the circuit board. The external graphics card module is removable and selectively inserts into the slot, and the external graphics card module electrically connects to the motherboard via the first connecting interface.

Abstract: A printed circuit board having an electronic component which is to be cooled by a cooling surface biased thereon, where the biasing elements are abutted not by the PCB but a stiffer element attached to the PCB in order to not strain or bend the PCB.

Abstract: A power electronic device is disclosed. The power electronic device may include a housing, a conductive element positioned within the housing and rated for at least a medium voltage, a cooling system in fluid communication with the conductive element, a plurality of temperature sensing tags and a data collection unit having a receiver that is configured to receive signals from the antennae of the temperature sensing tags. The cooling system may have a plurality of outlet conduit elements that are positioned within the housing. Each of the tags may be attached to one of the outlet conduits and may include a power supply, a temperature sensor, and an antenna.

Abstract: A thermally controlled assembly having two parallel PCBs defining there between, and by the aid of a channel forming element, a channel in which air is forced, using a fan, to cool components in the channel. The fan has a cooling surface cooled by air from the fan and which is biased toward an element provided in a space below the cooling surface. The forced air also drawing air from outside the assembly through the space and into the channel to cool other elements provided in the space.

Abstract: A notebook computer includes a base, a display, a bracket, and a fan. The display is rotatably connected to a rear side of the base and defines a number of heat dissipation holes in an outer surface of the display. The bracket is connected to the display and aligned with the heat dissipation holes. The fan is fastened to the bracket. An airflow inlet of the fan faces the heat dissipation holes, and an airflow outlet of the fan is opposite to the heat dissipation holes.

Abstract: A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metal sleeve around the perimeter of the dielectric plates to form a device assembly. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.