Abstract: An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.

Abstract: Data center includes a first container and a second container containing data racks therein. The first container includes an air intake for inputting outside cooling air into the first container. The second container contacts the first container via a base between the first container and the second container. The base defines a cooling air passage and heated air passage both communicating the first container and the second container. The cooling air passage inputs cooling air from the first container to the second container. The heated air passage inputs heated air from the second container to the first container.

Abstract: A semiconductor device includes: a block module which internally includes a power semiconductor element and a first heatsink, and from which a main circuit terminal and a control terminal are drawn; a control substrate connected to the control terminal; a package in which the block module and the control substrate are housed; and a second heatsink to which the package is fixed by a connection screw. The connection screw is inserted into the second heatsink so as to be inclined at an inclination angle ? relative to a normal to a surface of the second heatsink.

Abstract: The present description relates to the field of microelectronic assemblies, wherein a heat dissipation device may be incorporated into the microelectronic assembly with a loading mechanism having at least one outrigger that is rotatable or pivotable between a first position and a second position to accommodate different heat dissipation device sizes or shapes.

Abstract: A power converter is provided. The power converter includes a heat sink provided with a holding unit, a plurality of semiconductor devices disposed on the heat sink, and a fixing assembly pressing each of the semiconductor devices toward the heat sink to fix the semiconductor device. The fixing assembly includes a lower push unit disposed on the semiconductor device, and an upper push unit disposed on the lower push unit to press the lower push unit downward, the upper push unit being coupled to the holding unit. The upper push unit includes a central bent part that partially protrudes downward, an insertion part disposed on each of both ends of the central bent part in a left/right direction, the insertion part having a left/right distance therebetween that gradually increases upward, and a fixing bar inserted into the insertion part.

Abstract: A system is provided for a power distribution enclosure that includes an electronic circuit component. The system includes a conductive adapter having a head, and a circuit breaker base adapted for mounting to the power distribution enclosure. The circuit breaker base has an aperture adapted to receive the head of the conductive adapter. The head of the conductive adapter has a shape that substantially prevents rotation of the conductive adapter when the conductive adapter is inserted into the aperture. The conductive adapter is configured to draw away or absorb heat from the electronic circuit component and move the absorbed heat out of the power distribution enclosure. The circuit breaker base is adapted to substantially prevent heat from escaping from the conductive adapter into the power distribution enclosure. Numerous other aspects are provided.

Abstract: High-density rack unit systems and methods are described for telecommunication and data communication systems that utilize novel airflow mechanisms thereby enabling modularity and high-density in small-form factor units. The high-density rack unit systems and methods offer novel airflow mechanisms via right-angle backplane connectors to enable more airflow in a rack unit as well as novel field replaceable fans in these high-density rack units. Further, the high-density rack unit systems and methods include a baffle structure to keep power-supply-related airflow separate from the airflow over other components in the 1U or 2U rack unit. In this manner, the high-density rack unit systems and methods enable system vendors and network operators to realize significant density improvements.

Abstract: A passive cooling system is provided for dissipating heat from an electronic component. The system includes a printed circuit board including a first dielectric layer and a first conductive layer, an electronic component coupled to the printed circuit board via a plurality of electrical contacts, and a cooling component thermally coupled to the electronic component through the first conductive layer by a micro via thermal array.

Abstract: A fluid cooled enclosure includes a fluid conduit that provides a fluid coolant path between sides of a housing. Optionally, the fluid conduit can provide bi-directional fluid coolant paths. In another example, an interface block can be provided with a first interface surface engaging an interface surface of a first end portion of the fluid conduit. In another example, a first end portion of the fluid conduit is fabricated with a first material composition and the interface block is fabricated with a second material composition that has a higher thermal conductivity than the first material composition. In further examples, methods of cooling a conduction cooled circuit module comprise the steps of mounting an interface block to a conduction cooled circuit module, mounting the interface block with respect to the fluid conduit, and cooling the electrical circuits of the conduction cooled circuit module by flowing fluid coolant through the fluid conduit.

Abstract: A telecommunications system (10/100) is disclosed herein. The telecommunications system (10/100) includes a chassis (12/112) defining a top end (14/114), a bottom end (16/116), and a generally pyramidal shape, wherein a transverse cross-sectional footprint (28) of the chassis (12/112) changes in outer dimension as the transverse cross-sectional footprint (28) extends from the top end (14/114) to the bottom end (16/116), the telecommunications chassis (12/112) further defining at least one sidewall (30/130, 32/132, 34/134, 36/136), the at least one sidewall (30/130, 32/132, 34/134, 36/136) extending at an angle to both the top end (14/114) and the bottom end (16/116), the at least one sidewall (30/130, 32/132, 34/134, 36/136) defining ports (38) defining connection locations for receiving telecommunications equipment.

Abstract: A box-shaped electric control cabinet is provided which can be closed by a cover and which is used to receive electric components and devices for a blade angle adjustment drive (pitch drive) of a wind energy power plant, by means of which one or more rotor blades of the plant can be rotated about the blade axis. The control cabinet includes at least two cabinet segments, and specific electric components and devices are associated with respectively each module according to its function. The cabinet segments can be associated with and/or assigned to respectively different electric components and devices, with which, combined as a part function, different total functions and/or embodiment forms of the control cabinet can be produced or are producible.

Abstract: An electronic board includes a support on which first electronic components are installed, the first electronic components having a height of less than a first threshold height h1; a cold plate that extends parallel to the support, the distance between the cold plate and the support being equal to the first threshold height h1, the cold plate including a base plate in which at least one channel is formed through which a coolant can circulate, the base plate being fixed to a complementary plate closing the channel, the cold plate covers all first electronic components, the first electronic components being connected to the cold plate through deformable pads made of a heat conducting material.

Abstract: A self-cooling energy saver includes a housing filled with insulating oil and having a plurality of conduits disposed on a first lateral side and a second lateral side thereof, a plurality of heat dissipation modules including a plurality of fins connecting corresponding conduits and heat dissipation flow path formed by adjacent fins; at least one input rod disposed on a top side of the housing and comprising a plurality of insulators; at least one output rod disposed on the top side of the housing and including a plurality of insulators; and an energy saving unit immersed in the insulating oil, electrically connected to the input rod and the output rod and comprising a plurality of reactance elements coupled to filter reactors electrically connected to a switch electrically connecting the reactance elements.

Abstract: Power electronics modules having jet impingement assemblies utilized to cool heat generating devices are disclosed. In one embodiment, a jet impingement assembly includes coupled manifold plates having a fluid inlet and outlet, a distribution surface, and a collection surface. The distribution surface of the first and second manifold plate is coupled to define a distribution manifold having a fluid distribution channel and one or more arrays of orifices extending through both manifold plates. Heat transfer plates are coupled to each manifold plate's collection surface forming impingement chambers. The heat transfer plates include one or more arrays of fins extending toward the collection surface of each manifold plate fluidly coupled to the fluid outlet. The first and second manifold plates and the first and second heat transfer plates are positioned in a horizontal stack such that the fluid inlets of both manifold plates are adjacent.

Abstract: A heat-dissipating type of power converter comprises a support unit, at least one power module, at least one pair of rails and at least one main air duct module corresponding to the at least one power module. The pair of rails are fixed to the support unit and parallel to each other. The power module comprises a mounting plate module, a power unit and a radiator. wherein the power unit is fixed to the radiator, and the mounting plate module and the radiator are fixedly connected to each other. the main air duct module is fixed to the support unit and provided between the pair of rails, a second opening is defined in a side of the main air duct module toward the power module. The power module is assembled with or disassembled from the main air duct module by sliding along the pair of rails.

Abstract: A heat-dissipation structure for a motor controller. The heat-dissipation structure includes a control box, a circuit board, a plurality of radiators, and IGBT modules. The circuit board is installed in the control box. Each radiator includes a side plate and a heat dissipation block protruding from the side plate. The side plate is attached to an inner wall surface of the control box. The IGBT modules are installed on the heat dissipation block, and the pin terminals protruding from the IGBT modules are in electric or electronic connection with the circuit board.

Abstract: An apparatus includes at least one heat sink and first and second electronic assemblies mounted on the at least one heat sink at respective first and second mounting sites and configured to unequally (e.g., at least partially non-concurrently) produce heat. At least one heat pipe is thermally coupled to the at least one heat sink and extends between locations proximate the first and second mounting sites. For example, the first and second electronic assemblies may be components of respective subsystems of an uninterruptible power supply (UPS), such as a rectifier and a battery converter, that generate heat in an at least partially non-concurrent manner.

Abstract: An electronic device is provided that comprises a bottom frame portion; an information card reader over the bottom frame portion; a thermal insulation layer; a circuit board over the thermal insulation layer; a top broad heat sink over the circuit board; and a top cover over the top broad heat sink.

Abstract: A fixing-device that fixes a second member to be fastened to a first member to be fastened, the fixing-device includes, a base fixed to the first member to be fastened, a sprung-washer attached to the base and interposed between the base and the second member to be fastened, and a fastener that fastens the second member to be fastened and the base to each other, wherein the sprung-washer includes a threaded-portion insertion-hole into which a threaded-portion of the fastener is inserted, an edge-portion that is formed around the threaded-portion insertion-hole, and with which a pressing-portion provided in the fastener comes into contact and that is thereby pressed when the fastener is tightened, and a leaf-spring that extends from the edge-portion forward in a direction in which the fastener is inserted into the threaded-portion insertion-hole and outward, and that has a bent-portion midway along the length of the leaf-spring.

Abstract: Disclosed is an integrated power electric unit mounted on an electric vehicle, comprising a first power electric unit, a second power electric unit arranged over the first power electric unit in a vertical direction of the vehicle, a channel that connects the first and second power electric units so as to flow the air, and a breather provided in the second power electric unit to cause inner and outer sides of the second power electric unit to communicate with each other.