Abstract: A power electronics assembly may include a power electronics device, a packaging assembly, a thermal management system, and an emitter. The packaging assembly supports power electronics device. The thermal management system supports the packaging assembly and includes a thermal plate to deliver coolant for thermally communicating with the device. The thermal plate defines a channel with a wall. The emitter is arranged with the wall to form a peristaltic pump to adjust a cross-sectional area of the channel to control a flow of coolant therethrough. A membrane may be partially secured to the wall and include one of dielectric particles or magnetic particles. The emitter may selectively output one of a voltage, an electric field, or a magnetic field to impart a force on the particles to move the membrane and adjust the cross-sectional area of the channel to control a flow of coolant therethrough.

Abstract: Example embodiments disclose a passive system of power and cooling with a liquid metal for a digital system. The passive system may include a digital device operatively coupled to a printed circuit board, a hollow conductive channel body attached to the printed circuit board to circulate the liquid metal to flow within the conductive channel so as to convey electrical power to the digital device during a power loss and transfer heat generated by the digital device, and a tube to deliver the liquid metal in and out of the hollow conductive channel body. A method of operating a liquid metal may involve the use of the passive system.

Abstract: An electronics structure includes at least one barrier impermeable to fine particles, interposed between at least one Electrical and/or Electronics (“E & E”) system and the frame of the structure. The barrier delimits, with the frame and the E & E system, a first area isolated from the outside of the electronics structure. The structure makes it possible to isolate sensitive electrical and electronic components from fine particles such as dust dispersed outside the electronics structure.

Abstract: Structures and methods for providing heat sink attachments on existing heat sinks. According to a device, a first heat sink comprises a first base and fins extending from the first base. The first base comprises a cutout therein and a first base bottom surface contacting a first electronic component. A second heat sink comprises a second base and fins extending from the second base. The second heat sink is located in the cutout of the first heat sink. The second base comprises a second base bottom surface contacting a second electronic component. A pressure plate is attached to the first heat sink and overlays the second heat sink. The pressure plate contacts the second heat sink and applies pressure between the second heat sink and the second electronic component.

Abstract: The disclosure describes methods and apparatuses that are used to provide a telecommunication equipment chassis for supporting telecommunication equipment within server racks while providing an adjustable venting arrangement for the telecommunication equipment. More particularly, the disclosure describes a telecommunication equipment chassis for supporting telecommunication equipment within a server rack, which is vertically adjustable, rather than horizontally adjustable, to modify the venting arrangement for the telecommunication equipment without changing a width of the telecommunication equipment chassis.

Abstract: An electronic device with a cooling function includes a cap nut, a case, a semiconductor unit, a second bus bar for external output, and a connecting bolt. The case includes a side wall and a bottom surface. The bottom surface of the case has a coolant passage and a recessed portion to receive the cap nut. The coolant passage is open to above and is generally U-shaped. The recessed portion is positioned in a position surrounded by the coolant passage and the side wall of the case, and the cap nut is received in the recessed portion. The semiconductor unit includes a first bus bar that extends from the semiconductor unit. The semiconductor unit is fixed to the case in a posture and position that closes off the coolant passage from above. The second bus bar passes through the side wall of the case.

Abstract: Systems and methods for a dry power supply for immersion-cooled Information Handling Systems (IHSs) are described. In some embodiments, an IHS may include: a chassis configured to be at least partially disposed under a surface of a dielectric liquid coolant, where the chassis includes one or more components configured to be cooled by the dielectric liquid coolant during operation of the IHS; and a power supply coupled to the chassis and configured to provide power to the one or more components via an adaptor configured to maintain the power supply above the surface of the dielectric liquid coolant during operation of the IHS, where the power supply comprises a fan configured to blow air.

Abstract: A suspension board with circuit includes one pair of pedestals. A pedestal conductive layer of one pedestal has a fan portion and a continuous portion. The pedestal conductive layer of the other pedestal has at least the fan portion. When the pedestal conductive layer of the other pedestal has only the fan portion, the pedestal supporting layer is disposed so as to be overlapped with the fan portion in the thickness direction in each of the pedestals and so as not to be overlapped with the continuous portion in the one pedestal and when the pedestal conductive layer of the other pedestal has the continuous portion, the pedestal supporting layer is disposed so as to be overlapped with the continuous portion or is disposed so as to be overlapped with the fan portion and so as not to be overlapped with the continuous portion in each of the pedestals.

Abstract: An apparatus may include a heat sink to be mounted to a printed circuit board. The apparatus may include a power supply mounted to the heat sink. The power supply may receive input power and supply output power to one or more components of the printed circuit board.

Abstract: An electronic module includes a substrate, a metallic shielding cover, an electronic component and a piezoelectric element. The metallic shielding cover is disposed on the substrate and forms an accommodating chamber together with the substrate, wherein the metallic shielding cover has an opening, and the accommodating chamber is communicated with outside via the opening. The electronic component is disposed on the substrate and accommodated in the accommodating chamber. The piezoelectric element is adhered to the metallic shielding cover, wherein the piezoelectric element after being enabled is configured to bring a local portion of the metallic shielding cover for vibrating to change the volume of the accommodating chamber. In addition, a heat dissipation module is also disclosed.

Abstract: A lead screw operated drawout mechanism for an electrical system is disclosed. The lead screw operated drawout mechanism includes a lead screw, a nut, a drive shaft and a connecting mechanism. The lead screw is supported on a support frame in a way such that the lead screw rotates with respect to the support frame. The nut is disposed on the lead screw, wherein rotary motion of the lead screw facilitates linear motion of the nut on the lead screw. The drive shaft is rigidly disposed on the nut and configures linear motion along with the nut. The connecting mechanism is functionally connected to the drive shaft and the electrical system for facilitating activation and de-activation of the electrical system.

Abstract: Disclosed herein are apparatuses and methods for the cooling of electronic components of a COM-Express module using an adapter module to become VITA-59 compliant module. The adapter module operatively and thermally couple to a modular computing device, e.g., the COM-Express compliant module, configured with a conduction-cooled plate to provide an additional path for conducting thermal energy generated from integrated circuit components located on the modular computing device. The adapter module includes dimensions and thicknesses to form a spatial gap between an assembled system having the adapter module, the cooling plate, and the modular computing device and a cooling surface of an external heat sink to which the assembled system couples. The spatial gap relative to the cooling plate provides clearance for the adapter module to elastically deform such that the surfaces of the assembly contacts the heat sink when the assembled system is coupled thereto.

Abstract: A memory module cooling system includes a liquid cooled manifold assembly and a heat spreader assembly rotateably attached to the liquid cooled manifold assembly about an axis perpendicular to the memory module. The liquid cooled manifold assembly includes a manifold, an liquid inlet, and a liquid outlet. The heat spreader assembly includes a base in thermal contact with a heat pipe, and a heat spreader in thermal contact with the heat pipe, the heat spreader configured to thermally engage the memory module. In certain embodiments, thermal bonds are maintained between a plurality of neighboring memory modules when a particular heat spreader assembly is rotated away from an associated memory module.

Abstract: A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device.

Abstract: An elastic body and an electronic device are provided. The electronic device includes a casing, an electronic component, and a conductive base. The electronic component and the conductive base are installed in the casing. The conductive base includes a base body and the elastic body. The base body has a first opening. The elastic body includes a bottom plate and an elastic part. The bottom plate is installed on the base body and has a second opening. The first opening is communicated with the second opening. The elastic part is connected to the bottom plate and has a contacting portion. The contacting portion is installed corresponding to the second opening, and the contacting portion contacts the electronic component.

Abstract: A heat-dissipating system for high-power cabinet is provided, which comprises: a cabinet; at least one main air duct, which is formed in the cabinet with a first opening and a second opening, and a first heat-generating assembly, a second heat-generating assembly and at least one first fan, which are mounted in the at least one main air duct, wherein the first fan is mounted between the first heat-generating assembly and the second heat-generating assembly; and the outlet of the first fan faces the first heat-generating assembly, airflow enters the main air duct from the first opening of the main air duct, flows through the second heat-generating assembly, an inlet of the first fan, an outlet of the first fan, and the first heat-generating assembly in sequence, and finally is discharged out of the cabinet from the second opening of the main air duct cabinet.

Abstract: A mobile terminal is disclosed. A mobile terminal according to the present invention comprises a housing; PCB installed inside the housing; and a battery pack disposed at least one side of the PCB and including at least one heat conductive layer radiating heat generated from the PCB. According to the present invention, a mobile terminal is capable of radiating heat generated from PCB by disposing part of a battery pack on one side of the PCB and of increasing capacity of the battery pack by utilizing a housing for the battery pack.

Abstract: A frequency converter (10a, 10b, 10c) includes a housing (30), a circuit board (12a) arranged in the housing, and a coupling arrangement (20) arranged externally on the housing (30) for galvanically coupling the circuit board (12a) to an adjacently arranged second frequency converter (10b, 10c), wherein the coupling arrangement (20) either comprises a base portion (22) and a coupling member (26) movable with respect to the base portion (22) along a defined movement path, or is formed as a rigid busbar which is designed for simultaneous attachment to the frequency converter and the second frequency converter, and the coupling arrangement (22) is galvanically coupled to the circuit board (12a). The coupling arrangement (22) is connected to the circuit board (12a) by a spring element (40), wherein this spring element (40) has a fastening portion (44) on the circuit board side and a fastening portion (42) on the coupling arrangement side.

Abstract: A display apparatus includes: a substrate; a display panel on the substrate; and a sealing substrate opposite to the display panel. The display apparatus includes further includes a heat dissipating layer which is between the display panel and the sealing substrate and dissipates heat generated from the display panel; and a sealing portion which is between the substrate and the sealing substrate and surrounds the display panel.

Abstract: An air-cooled case enabling automatic setting of a flow of cooling air during natural cooling and during forced cooling contains a heating element and a cooling fan in a space surrounded by multiple surfaces that include a top surface and mutually facing side surfaces. The air-cooled case is provided with a top surface ventilation opening formed in the top surface, side surface ventilation openings formed in the side surfaces, and a shutter that is provided in the top surface ventilation opening and opens/closes the top surface ventilation opening.