Abstract: A curable composition including (a) at least one epoxide compound comprising: (i) at least one solid or semi-solid epoxy resin; and (ii) at least one divinylarene dioxide resin compound; and (b) at least one hardener; wherein the curable composition being cured comprises a cured thermoset product having a Tg of greater than about 120° C. A thermoset can be prepared from the above curable composition.

Abstract: The invention relates to curable epoxy resin compositions containing at least one epoxy resin having on average more than one epoxide group per molecule, at least one inorganic filler and at least one polycarboxylate ether, wherein the inorganic filler is coated with the polycarboxylate ether. The invention also relates to multi-component systems for producing said epoxy resin compositions, cured epoxy resins, a powder component K3 for the multi-component system, uses and methods.

Abstract: A curable composition includes 3-substituted benzoxazine, polyepoxide, and polythiol. Articles including the curable composition, methods of curing the curable composition, and a tack-free reaction product preparable from the curable composition are also disclosed.

Abstract: Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR1R2R3, wherein each of R1, R2, and R3 is independently linear or branched C1-20 alkyl or two or more of R1, R2, and R3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70° F. and at least 8 ksi at 2% offset at 190° F.

Abstract: The epoxy resin curing agent of the present invention comprises a compound represented by the following formula (1): wherein R represents a methyl group, an ethyl group, or a hydroxyl group, and n is an integer of 1 to 3.

Abstract: Disclosed is an adhesive composition for hydrophobic or water-repellent substrate comprises an modified epoxy resin, a urethane resin, and a dilution solvent. The adhesive composition according to the present invention can be employed to be adhered the same or different materials or print pattern on a hydrophobic or water-repellent substrate.

Abstract: The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.

Abstract: A reaction resin composition that can be used for the chemical fastening of anchoring means in boreholes and for construction gluing is described. The composition includes (A) a resin component, which contains at least one radically hardenable compound and at least one epoxy resin, which contains, on average, more than one epoxy group per molecule, and a (B) hardener component, which contains a hardening agent for at least one radical compound and at least one amine. The radically hardenable compound and hardening agent in each case being reaction-inhibiting spatially separated from one another. In an embodiment the composition contains no Cu—, Mn—, and iron compound, and no bridging compound. The ratio of double bond value to epoxy value nDB:nEP in the resin component is between 0.01 and 0.55 or between 5 and 50.

Abstract: The present invention provides a structural adhesive sheet specifically for use in a mirror base of an automobile interior rear-view mirror and a method for producing the same, said structural adhesive sheet comprises in parts by weight of 20-100 parts of a nitrile-butadiene rubber, 10-70 parts of a partially cured polysulfide adhesive, 5-40 parts of a bisphenol A type epoxy resin, 0.1-2.5 parts of a crosslinking agent, 0.2-2.5 parts of a softening agent, 3-20 parts of a curing agent, 1-10 parts of an accelerator, 20-100 parts of an inorganic filler, and 0.1-3.0 parts of a silane coupling agent. The structural adhesive sheet of the present invention is obtained by subjecting the above-mentioned components to a compounding process and an extrusion film forming process. The advantages of said structural adhesive sheet include good film-forming property, and simple curing process, while having high structural strength, good toughness, and excellent heat-resistance and cold-resistance after cured.

Abstract: The invention relates to a resin composition which is characterized by including: a reaction product that includes (A) a polyphenylene ether having an average of 1.5 to 2 hydroxyl groups per molecule and (B) an epoxy compound having an average of 2 to 2.3 epoxy groups per molecule, wherein the reaction product is obtained by pre-reacting at least a part of hydroxyl groups on the polyphenylene ether (A) with epoxy groups on the epoxy compound (B) so that the concentration of terminal hydroxyl groups on the polyphenylene ether (A) becomes 700 ?mol/g or less; (C) a cyanate ester compound; and (D) an organometallic salt.

Abstract: Engineered crosslinked thermoplastic particles are useful for interlaminar toughening of pre-pregs and composite materials.

Abstract: Polymer compositions are described containing a poly(1,4-cyclohexanedimethanol terephthalate) polymer in combination with a white pigment and optionally one or more reinforcing fillers. In accordance with the present disclosure, the composition also contains one or more reactive viscosity stabilizers. In order to prevent against yellowing, the composition is free of various aromatic epoxy resins, such as novolac epoxy resins. The polymer composition has excellent reflectance properties making the composition well suited for producing reflectors for light sources, such as LED assemblies.

Abstract: Disclosed herein is a paint composition comprising a carboxyl group containing resin comprising two or more carboxyl groups per molecule, having an acid number of from 100 to 300 mgKOH/g and a weight average molecular weight of from 2,000 to 30,000, obtained by the copolymerization of a carboxyl group containing radically polymerizable monomer and another radically polymerizable monomer, wherein the carboxyl group containing resin comprises 5 to 50 weight percent of structural units based on a lactone compound, based on resin solids; an epoxy group containing resin, comprising two or more epoxy groups per molecule; an ultraviolet absorber; and a light stabilizer having a pKb value of at least 9; wherein the molar ratio of the carboxyl groups of the carboxyl group containing resin to the epoxy groups of the epoxy group containing resin is 3:1 to 1:3.

Abstract: Disclosed in the present invention are a fluorine-containing polymerizable compound of the general formula (1) and a polymer compound obtained therefrom: where A represents a single bond, an oxygen atom, a sulfur atom, SO2, CH2, CO, C(CH3)2, C(CH3)(CH2CH3), C(CF3)2, C(CH3)(C6H5), CH2—C6H4—CH2 or a divalent organic group obtained by elimination of two hydrogen atoms from benzene, biphenyl, naphthalene, cyclohexene or fluorene; and a and b each independently represent an integer of 0 to 2 and satisfy a relationship of 1?a+b?4. The thus-obtained polymer compound combines adequate hydrophilicity and high transparency with low water adsorption of fluorine-containing compound.

Abstract: The present invention provides a cationically curable resin composition for assembling hard disk devices which comprises a resin having a cationically polymerizable functional group (a component A) and a cationic polymerization initiator (a component B), the component B being at least one selected from the group consisting of X+(SbF6)?(B1), X+(B(C6F5)4)?(B2) and X+((Rf)nPF6-n)?(B3) (in the formulae, X+ is iodonium or sulfonium, Rf is a fluorinated alkyl having 1 to 6 carbon atoms, and n is an integer of 1 to 6). The invention also provides a hard disk device manufacturing method using the composition, and a hard disk device assembled with the composition.

Abstract: There is provided a resist underlayer film-forming composition having excellent solubility in a solvent containing propylene glycol monomethyl ether as a main component. A resist underlayer film-forming composition comprising a polymer having a structural unit of Formula (1a) or Formula (1c) and a structural unit of Formula (1b) and a solvent containing more than 50% by mass of propylene glycol monomethyl ether, wherein in the polymer, the structural unit of Formula (1a) or Formula (1c) and the structural unit of Formula (1b) are arranged alternately. (In Formulae (1a) and (1b), Q is a phenylene group or a naphthylene group, m is 1 or 2, and each of n is independently 0 or 1).

Abstract: Curable adhesive compositions, cured adhesive compositions, and articles that include the cured adhesive compositions are described. The curable adhesive composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, d) a toughening agent, and e) an oil displacing agent. The cured adhesive compositions can be used as structural adhesives.

Abstract: There is provided colloidal silica particles comprising at least one polyvalent metal element M selected from a group consisting of iron, aluminum, zinc, zirconium, titanium, tin, and lead in an average content of 0.001 to 0.02 in terms of an M/Si molar ratio, and having an average primary particle diameter of 5 to 40 nm, wherein the content of the polyvalent metal element M present in an outermost layer of the colloidal particles is 0 to 0.003 atom per square nanometer (nm2) of a surface area of the colloidal particles; and a silica sol that the colloidal silica particles are dispersed in an organic solvent, a silica sol that the colloidal silica particles are dispersed in a polymerizable compound, and a silica sol that the colloidal silica particles are dispersed in a dicarboxylic anhydride.

Abstract: A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package.

Abstract: The present invention relates to a curable composition including: (a) at least one compound having at least one (meth)acrylic functional group in the molecule thereof, which is selected from a (meth)acrylic monomer and a (meth)acrylic oligomer; (b) an organic peroxide; (c) an o-benzoic sulfimide; and (d) an oxazoline compound, in which the component (d) is contained in an amount of 0.005 to 10 parts by mass based on 100 parts by weight of the component (a).