Abstract: The present disclosure relates, in part, to an epoxy resin composition comprising: an epoxy resin; and an aliphatic polyamine (e.g., as a cross-linking agent), wherein the aliphatic polyamine comprises a compound having the structure of Formula (1): wherein each of R1 and R2 is independently selected from the group consisting of hydrogen, alkyl group, cycloalkyl group and aromatic group; or R1 and R2 together with the carbon atom to which they are attached form a cyclic ring; each of R3 and R4 is independently selected from the group consisting of hydrogen, alkyl group, cycloalkyl group and aromatic group.

Abstract: An eugenol, an abundant natural phenol and the primary component of clove oil, which is converted to a thermoset resin via a high yield, two-step reaction. Modest heating yields a thermoset material with thermal stability above 350° C., a glass transition temperature of 187° C. and water uptake of only 1.8%.

Abstract: A flame retardant containing composition resistant to becoming sticky from moisture is prepared by the introduction of epoxy containing compound either into the ethyleneamine polyphosphates or into the polymeric composition.

Abstract: Embodiments include curable compositions including an epoxy resin and a hardener component including a polymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 0.5:1 to 5:1. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.

Abstract: A non-photosensitive resin composition including: a self-cross-linkable copolymer having structural units of Formulae (1) and (2): wherein each R0 is independently a hydrogen atom or methyl group; X is an —O— group or an —NH— group; R1 is a single bond or a C1-6 alkylene group; R2 is a C1-6 alkyl group; a is an integer of 1 to 5, b is an integer of 0 to 4, and when a and b satisfy 1?a+b?5, and b is 2, 3, or 4, such R2 optionally differ from each other; R3 is a divalent organic group of Formula (I), Formula (II), or Formula (III), and R4 is an organic group having an epoxy group: wherein c is an integer of 0 to 3, d is an integer of 1 to 3, and each e is independently an integer of 2 to 6; and a solvent.

Abstract: The present invention relates to curing agents for epoxy resins, containing at least one adduct of trimethylhexamethylenediamine and cresyl glycidyl ether. The curing agent has a low viscosity and cures quickly together with epoxy resins even in moist, cold conditions and without blushing to form films with a high hardness and surface quality, which scarcely undergo yellowing upon exposure to light. It is particularly suited for low-emission room temperature-curing coatings.

Abstract: Random copolymers, crosslinked thin films of the random copolymers and cell culture substrates comprising the crosslinked thin films are provided. Also provided are methods of making and using the copolymers, thin films and substrates. The copolymers are polymerized from glycidyl methacrylate monomers and vinyl azlactone monomers. The crosslinked thin films are substrate independent, in that they need not be covalently bound to a substrate to form a stable film on the substrate surface.

Abstract: An insulating thermally conductive resin composition (1) includes a phase-separated structure including: a first resin phase (2) in which a first resin continues three-dimensionally; and a second resin phase (3) different from the first resin phase and formed of a second resin. Moreover, the insulating thermally conductive resin composition includes: small-diameter inorganic filler (4) unevenly distributed in the first resin phase; and large-diameter inorganic filler (5) that spans the first resin phase and the second resin phase and thermally connects pieces of the small-diameter inorganic filler, which is unevenly distributed in the first resin phase, to one another. Then, an average particle diameter of the small-diameter inorganic filler is 0.1 to 15 ?m. Moreover, an average particle diameter of the large-diameter inorganic filler is larger than the average particle diameter of the small-diameter inorganic filler, and is 1 to 100 ?m.

Abstract: Elastomers are prepared from a reaction mixture that contains a polyene compound, an epoxy resin, a thiol curing agent and a basic catalyst. The polyene compound has an average of at least two groups containing aliphatic carbon-carbon double bonds capable of reaction with a thiol group. At least one of said aliphatic carbon-carbon double bonds is separated from each other said aliphatic carbon-carbon double bond by an aliphatic spacer group having a weight of at least 500 atomic mass units. These elastomers are typically phase-separated materials having good elongation and tensile properties.

Abstract: The present invention relates to a halogen-free thermosetting resin composition, and also a prepreg and a laminate for printed circuit prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 5 to 30 parts by weight of a first curing agent of phosphorus-containing bisphenol, (C) from 5 to 30 parts by weight of a second curing agent of alkylphenol novolac, and (D) a phosphorus-containing flame retardant. The prepreg and laminate for printed circuit prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better process workability, and can fulfill halogen-free flame retardance and achieve the grade of UL94 V-0.

Abstract: A process for making a phosphorus-containing compound is disclosed. The process comprises contacting a compound of formula (A) wherein RA and RB are selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups or can be combined to form cyclic structures; and RC is methyl, ethyl, isopropyl, n-butyl, i-butyl, t-butyl, phenyl or benzyl; and a compound of formula (B) wherein R1-R4 are selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups. The phosphorus-containing compound can then be used as a flame retardants for polymers, especially for epoxy, polyurethane, thermosetting resins and thermoplastic polymers. Such flame retardant-containing polymers can be used to make protective coating formulations and ignition-resistant fabricated articles, such as electrical laminates, polyurethane foams, and various molded and/or foamed thermoplastic products.

Abstract: An eugenol, an abundant natural phenol and the primary component of clove oil, which is converted to a thermoset resin via a high yield, two-step reaction. Modest heating yields a thermoset material with thermal stability above 350° C., a glass transition temperature of 187° C. and water uptake of only 1.8%.

Abstract: Polymeric nanocomposite materials are provided comprising polycyclic aromatic hydrocarbon compounds. During polymer synthesis, polycyclic aromatic hydrocarbon groups are directly incorporated into the polymer network. Free polycyclic aromatic hydrocarbon compounds are also dispersed within the polymer matrix. The resulting nanocomposite materials exhibit improvements in the thermal, rheological, and physical properties, including reinforcement, of the polymer material as compared to the unmodified polymer.

Abstract: A prepreg 10 comprises: a reinforcing fiber layer 3 including reinforcing fibers 1 and a resin composition 2 with which the space between fibers of the reinforcing fibers 1 is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer 6a or 6b provided on at least one surface of the reinforcing fiber layer 3 and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles 4 having an average particle size of 5 to 50 ?m, wherein the polyamide resin particles 4 include a particle made of a polyamide 11.

Abstract: Methods and systems and components made according to the methods and systems, are disclosed relating to improved curing methods for epoxy resin-containing composite prepreg materials, wherein the composite prepreg materials are exposed to a flow of ammonia-containing compounds to fully cure the composite prepreg materials at substantially ambient temperatures and pressures.

Abstract: A coating material composition for providing coated films is disclosed. The coating material composition contains coated film forming resin (A), crosslinking agent (B), and resin beads (C), in which compression strength of the resin beads (C) at the time of the 10% pressurized deformation of an individual resin bead by means of a micro-compression tester lies between 0.1 MPa and 20 MPa and a recovery of the resin beads (C) following 90% pressurized deformation of an individual resin bead by means of a micro-compression tester is at least 80%.

Abstract: A method of producing a thiol group-containing polymer includes reacting bis(2-chloroethyl) formal with sodium hydrosulfide, wherein the thiol group-containing polymer is represented by general formula: HS—(R—Sr)n—R—SH where R is an organic group including a —C2H4—O—CH2—O—C2H4— structure, n is an integer of from 1 to 200, r is an integer of from 1 to 5, and the average value of r is 1.1 or more and lower than 1.8, and wherein the thiol group-containing polymer is a liquid polymer.

Abstract: Provided is a polyarylene sulfide resin composition including a polyarylene sulfide resin, an epoxy resin, glass fiber, and glass flake. The amount of the epoxy resin is 0.5 to 20 parts by mass, the amount of the glass fiber is 10 to 350 parts by mass, and the amount of the glass flake is 1 to 250 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin. The epoxy resin is a combination of a bisphenol-type epoxy resin and a novolac-type epoxy resin. Also provided is a molded body formed by melt-molding the resin composition. The resin composition has good adhesiveness to epoxy resins and good flowability. Furthermore, a molded body having high thermal shock resistance can be produced using the resin composition.

Abstract: A low temperature shape memory thermosetting epoxy has a epoxy, a curing agent, a modifying material and a functional material. The curing agent is fatty amine, polyamide and aromatic amino compound. The modifying material is polyester polyol, polyether polyol, aromatic diamine, and silicon compound. The functional material is boron trifluoride, terminal carboxyl group, calcium carbonate, pigment, and mixture thereof. Thus, the epoxy is deformable and is shape memorable under room temperature.

Abstract: A thermosetting resin composition contains a thermosetting resin, a hardener capable of reacting with the thermosetting resin, and a flame retardant. The flame retardant contains a first phosphor compound compatible with a mixture of the thermosetting resin and the hardener, and a second phosphor compound incompatible with the mixture.