Patents Examined by Megan McCulley
  • Patent number: 9976085
    Abstract: A liquid crystal alignment agent capable of forming a liquid crystal display element having good resistance to ultraviolet decay and no mura effect, a liquid crystal alignment film, and a liquid crystal display element having the same are provided. The liquid crystal alignment agent includes a polymer (A), a polysiloxane (B), a photopolymerizable compound (C), and a solvent (D). The polymer (A) is obtained by reacting a first mixture. The first mixture includes a tetracarboxylic dianhydride component (a1) and a diamine component (a2). The polysiloxane (B) is obtained by reacting a polysiloxane compound and a carboxylic acid compound (b4) having a C4 to C50 long chain. The polysiloxane compound is obtained by reacting a second mixture including a silane compound (b1) containing a polymerizable unsaturated group and a silane compound (b2) containing an epoxy group.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: May 22, 2018
    Assignee: Chi Mei Corporation
    Inventor: Wan-Ting Huang
  • Patent number: 9963533
    Abstract: A copolymer is provided, which includes a chemical structure of: R is C1-6 alkylene group. T is a terminal group including C1-6 alkyl group, C3-6 cycloalkyl group, or C6-12 aromatic group. l is 0.05 to 0.3, m is 0.1 to 0.2, n is 0.5 to 0.8, l+m+n=1, x is 40 to 100, and o is 10 to 120. An epoxy resin composite is also provided, which includes 100 parts by weight of epoxy resin and 1 to 20 parts by weight of toughness enhancer such as the above copolymer.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: May 8, 2018
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chien-Pang Wu, Li-Cheng Jheng, Chia-Hao Li, Jyh-Horng Wu, Hsi-Hsin Shih
  • Patent number: 9963586
    Abstract: Embodiments herein relate to a prepreg comprising a thermosetting resin, and reinforcing fibers in the thermosetting resin, wherein when the prepreg is cured in vacuum bag only conditions, and a method of making the same. The method also applies for autoclave processing. Embodiments also relate to a cured fiber reinforced composite material made by thermally curing the prepreg.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: May 8, 2018
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Jonathan C Hughes, Jeffrey A Satterwhite, Nobuyuki Arai, Atsuhito Arai, Alfred P Haro, Kenichi Yoshioka
  • Patent number: 9957398
    Abstract: A composition including: (a) a silane derivative of the formula (I) in which R1, R2, R3 and R4, which may be the same or different, are selected from alkyl, acyl, alkyleneacyl, cycloalkyl, aryl and alkylenearyl, and/or a hydrolysis and/or condensation product of the silane derivative of the formula (I); (b) a silane derivative of the formula (II) R6R73?nSi(OR5)n??(II) in which R5 is an alkyl, acyl, alkyleneacyl, cycloalkyl, aryl or alkylenearyl group, R6 is an organic radical containing an epoxide group, R7 is an unsubstituted or substituted alkyl, cycloalkyl, aryl or alkylenearyl group, n is 2 or 3, and/or a hydrolysis and/or condensation product of the silane derivative of the formula (II); (c) a colloidal inorganic oxide, fluoride or oxyfluoride; (d) an epoxide compound having at least two epoxide groups, and (e) a catalyst system.
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: May 1, 2018
    Assignee: Carl Zeiss Vision GMBH
    Inventors: Norbert Hugenberg, Bin Peng, Joerg Puetz
  • Patent number: 9957425
    Abstract: An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120° C. to 130° C. for 1 to 20 minutes, a second stage at a temperature ranging from 140° C. to 150° C. for 1 to 10 minutes, a third stage at a temperature ranging from 160° C. to 180° C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160° C. to 180° C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: May 1, 2018
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Jun Woo Lee, Sung Min Kim, In Hwan Kim, Baek Soung Park, Su Mi Lim, Jae Won Choi
  • Patent number: 9951257
    Abstract: An epoxy caulking adhesive, including: a component A and a component B. The component A at least includes the following components in parts by weight: between 50 and 100 parts of an epoxy resin, between 0 and 100 part(s) of an inorganic filler, between 0 and 20 part(s) of a thickener. The component B at least includes the following components in parts by weight: between 20 and 100 parts of an amine curing agent, between 0 and 150 part(s) of the inorganic filler, and between 0 and 25 part(s) of the thickener. The weight ratio of the component A to the component B is between 1:1 and 10:1. At least one of the inorganic filler and the thickener exists in both the component A and the component B.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: April 24, 2018
    Assignee: WUHAN KEDA MARBLE PROTECTIVE MATERIALS CO., LTD.
    Inventors: Kunwen Du, Kunwu Du, Qiong Lei, Yunfei Wang
  • Patent number: 9944836
    Abstract: The present invention provides novel polymeric amine compositions employing amine compounds having multiple tertiary amine groups. Methods of making these new compositions are also disclosed. Amine compositions and amine-epoxy compositions employing the polymeric amine compositions of the present invention are also provided.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: April 17, 2018
    Assignee: Evonik Degussa GmbH
    Inventors: Gamini Ananda Vedage, Juan Jesus Burdeniuc, Eugene George Lutz
  • Patent number: 9938428
    Abstract: The invention relates to an aqueously dispersible epoxy resin E, comprising building blocks derived from an aliphatic polyether polyol A, an epoxy resin B having at least two epoxide groups per molecule, an epoxy resin B? having at least two epoxide groups per molecule, which may be identical to B, or different from B, an epoxy-functional fatty acid ester D, and an aromatic polyol C, a process for the preparation thereof, and a method of use thereof.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: April 10, 2018
    Assignee: Allnex Austria GmbH
    Inventors: Thomas Fischer, Elfriede Prucher
  • Patent number: 9932491
    Abstract: A method for preparing an emulsion for a cationic electrodeposition coating composition at an emulsification field, wherein the method includes synthesizing a base resin for a cationic electrodeposition coating composition, removing the base resin in a liquid state from a reaction vessel and then changing the resin into a solid state, and optionally, adjusting a size of the resin into an predetermined size, and emulsifying the resin at the emulsification field by adding water and an optional solvent, a neutralizing agent, a curing agent or additives, wherein the base resin is an aminated resin and has a softening point of 20-90° C., and wherein the adjusted shortest size of the base resin is 40 cm or less. Furthermore, the present application relates to a method for transporting a resin for cationic electrodeposition coating composition.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: April 3, 2018
    Assignee: NIPPON PAINT AUTOMOTIVE COATINGS CO., LTD.
    Inventors: Takeshi Hara, Nobuhiro Miyamae, Makoto Andou, Masahiko Harada, Noriyuki Nakazawa
  • Patent number: 9920143
    Abstract: A fluorine-containing highly branched polymer obtained by polymerizing a polyfunctional monomer A that has two or more radically polymerizable double bonds and all or a portion of which has a bisphenol structure, a monomer B having a fluoroalkyl group and at least one radically polymerizable double bond, within a molecule, and a monomer C having at least one ring-opening polymerizable group selected from the group including an epoxy group and an oxetanyl group, and having at least one radically polymerizable double bond, within a molecule, under the presence of a polymerization initiator D with an amount of 5% by mole to 200% by mole to the number of moles of the polyfunctional monomer A; an epoxy resin composition including the polymer; and an epoxy resin cured product obtained from the resin composition.
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: March 20, 2018
    Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Tomoko Misaki, Motonobu Matsuyama, Masayuki Haraguchi, Masaaki Ozawa
  • Patent number: 9920181
    Abstract: A polylactic acid resin composition includes: 0.005 parts by weight to 1.2 parts by weight of a metal phosphate represented by Formula (1): MxHyPOz??(1) (in Formula (1), M is an alkali metal atom or an alkaline earth metal atom, and x, y, and z are integers satisfying 1?x?2, 1?y?4, and 2?z?8, respectively) with respect to 100 parts by weight of a polylactic acid resin including a poly-L-lactic acid component and a poly-D-lactic acid component, wherein a crystallization enthalpy of crystals in the polylactic acid resin is not less than 5 J/g when a temperature of the polylactic acid resin composition is increased to 250° C., and the temperature is kept constant for 3 minutes, followed by decreasing the temperature at a cooling rate of 20° C./min in differential scanning calorimetry.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: March 20, 2018
    Assignee: Toray Industries, Inc.
    Inventors: Yoshitake Takahashi, Takuma Naotsuka, Yasuto Tachibana, Hiroyuki Ome
  • Patent number: 9914827
    Abstract: The present invention relates to a concentrated polymeric composition which comprises: a) vinyl aromatic polymers and/or copolymers in an amount ranging from 10% to 90% by weight, calculated with respect to the overall composition, with respect to the overall composition, b) at least one compound containing epoxy functional groups in an amount ranging from 0.01% to 5% by weight, calculated with respect to the overall composition, with respect to the overall composition, c) at least one infrared absorbing agent, in an amount ranging from 10% to 90% by weight, calculated with respect to the overall composition, with respect to the overall composition.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: March 13, 2018
    Assignee: Versalis S.p.A.
    Inventors: Antonio Ponticiello, Attilio Arienti, Francesco Pasquali
  • Patent number: 9914800
    Abstract: The invention relates to a curing agent for epoxy resins which is an aqueous dispersion of a multifunctional amine AC having more than one primary amino group per molecule, and at least one moiety per molecule derived from the reaction of a compound C containing at least one reactive group which is preferably an epoxide group, with a molecule having at least one blocked primary amino group and at least one group which is reactive towards the at least one reactive group of compound C, which is selected from the group consisting of secondary amino groups >NH, of hydroxyl groups —OH, of mercaptan groups —SH, of amide groups —CO—NHR, where R can be hydrogen or an alkyl group having from one to twelve carbon atoms, of hydroxyester groups, and of acid groups, particularly of carboxyl groups —COOH, sulphonic acid groups —SO3H, and phosphonic acid groups —PO3H2, and preferably, also moieties which are compatible with an epoxy resin, as well as a process for its preparation, and a method of use thereof.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: March 13, 2018
    Assignee: ALLNEX AUSTRIA GMBH
    Inventors: Florian Lunzer, Gerald Hobisch, Michaela Zirngast
  • Patent number: 9909009
    Abstract: An environmental protection cold mixing type modulus-adjustable pavement material and preparation method thereof. Equal components of waterborne epoxy resin and waterborne curing agent are added in a container to obtain a waterborne epoxy resin mixture. Emulsified bitumen, the waterborne epoxy resin mixture, an emulsifying agent, a defoaming agent and a stabilizing agent are prepared according to a certain mass ratio; the emulsified bitumen is first added in the container, and the pH is regulated with hydrochloric acid to be 5.0 to 6.5; the above-mentioned other materials are added and stirred to make mixed liquid; a stator of a high-speed shearing machine is put into the mixed liquid, and the rotational speed is set as 350 to 500 rpm for about 20 to 40 min to obtain waterborne epoxy emulsified bituminous emulsion. B.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: March 6, 2018
    Inventors: Guiping He, Zheng Sun, Xixi Hou, Quncong Qiu, Zhisong Huang, Xiaohua Jiang, Hua Chen
  • Patent number: 9902825
    Abstract: A prepreg for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance includes a base material, a resin composition impregnated into or coated on the base material, and huntite. The resin includes (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by xMgCO3·yMg(OH)2·zH2O wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4; (B) an epoxy resin; and (C) a curing agent. The prepreg can be used to prepare a laminated sheet and a metal foil-laminated sheet.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: February 27, 2018
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yoshihiro Kato, Takaaki Ogashiwa, Hiroshi Takahashi, Tetsuro Miyahira
  • Patent number: 9905855
    Abstract: A binder composition for a non-aqueous secondary battery electrode may comprise functional group-containing crosslinked resin microparticles produced by polymerizing: (A) at least one monomer selected from the group consisting of (a) a monomer having one ethylenically unsaturated group per molecule and also having a monofunctional or polyfunctional epoxy group, (b) a monomer having one ethylenically unsaturated group per molecule and also having a monofunctional or polyfunctional amide group, and (c) a monomer having one ethylenically unsaturated group per molecule and also having a monofunctional or polyfunctional hydroxy group; (B) at least one monomer selected from the group consisting of (d) a monomer having one ethylenically unsaturated group per molecule and also having an alkoxysilyl group and (e) a monomer having at least two ethylenically unsaturated groups per molecule; and (C) (k) a monomer which has an ethylenically unsaturated group and is different from the monomers (a) to (e).
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: February 27, 2018
    Assignees: TOYO INK SC HOLDINGS CO., LTD., TOYOCOLOR CO., LTD.
    Inventors: Sachiko Kinoshita, Hiromi Yokoyama, Takaaki Koike, Koichiro Miyajima, Yasuyuki Moroishi, Shingo Ikeda
  • Patent number: 9896546
    Abstract: A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 ?m/sec to 0.02 ?m/sec after the heat history of 180° C. for 60 minutes, (c) a bleed-out amount is 50 mg/m2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG).
    Type: Grant
    Filed: January 18, 2013
    Date of Patent: February 20, 2018
    Assignee: ASAHI KASEI E-MATERIALS CORPORATION
    Inventors: Koichiro Shimoda, Yasuhito Iizuka, Masaki Yamamoto, Yoro Sasaki, Hiroaki Adachi, Shuji Kashiwagi
  • Patent number: 9887382
    Abstract: The present invention relates to a thermosetting composition for an organic light-emitting element filler, which comprises (A) 100 parts by weight of an epoxy-based resin including (A1) an epoxy resin having a weight average molecular weight of around about 200 g/mol or more to less than about 1000 g/mol, (A2) an epoxy resin having a weight average molecular weight of around about 1000 g/mol or more to less than about 20000 g/mol and (A3) an epoxy resin having a weight average molecular weight of about 20000 g/mol or more to less than about 100000 g/mol, (B) about 10 parts by weight to about 40 parts by weight of a sheet-like filler and (C) about 0.1 parts by weight to about 20 parts by weight of an imidazole curing agent having a cyano group; and an organic light-emitting element display device comprising the same.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: February 6, 2018
    Assignee: Cheil Industries, Inc.
    Inventors: Mi Sun Kim, Taek Jin Baek, Gyu Seok Song, In Jae Song, Jin Ah Lee, Seung Jib Choi
  • Patent number: 9878941
    Abstract: A glass composition including SiO2 in an amount from about 70.0 to about 78.2% by weight, Al2O3 in an amount from about 18.6 to about 26.2% by weight, MgO in an amount from about 3.1 to about 10.7% by weight, CaO in an amount from 0.0 to about 7.6% by weight, Li2O in an amount from about 0.1 to about 5.0% by weight, and Na2O in an amount from 0.0 to about 0.2% by weight is provided. In exemplary embodiments, the glass composition is free or substantially free of B2O3 and fluorine. The glass fibers have a specific strength between about 1.6×106 J/kg and 2.24×106 J/kg and a specific modulus between about 3.3×107 J/kg and 3.7×107 J/kg. Glass fibers formed from the inventive composition possess exceptionally high specific strength and a low density, which make them particularly suitable in applications that require high strength, high stiffness, and low weight, such as in wind blades and aerospace structures.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: January 30, 2018
    Assignee: OCV Intellectual Capital, LLC
    Inventors: Douglas Alan Hofmann, Peter B. McGinnis
  • Patent number: 9862797
    Abstract: The present disclosure relates, in part, to an epoxy resin composition comprising: an epoxy resin; and an aliphatic polyamine (e.g., as a cross-linking agent), wherein the aliphatic polyamine comprises a compound having the structure of Formula (1): wherein each of R1 and R2 is independently selected from the group consisting of hydrogen, alkyl group, cycloalkyl group and aromatic group; or R1 and R2 together with the carbon atom to which they are attached form a cyclic ring; each of R3 and R4 is independently selected from the group consisting of hydrogen, alkyl group, cycloalkyl group and aromatic group.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: January 9, 2018
    Assignee: Connora Technologies, Inc.
    Inventor: Stefan J. Pastine