Abstract: A polycarbonate resin composition and a molded product produced from the same includes (a) polycarbonate resin; (b) polycarbonate-polysiloxane copolymer; (c) aromatic copolyester resin; and (d) glass fiber.

Abstract: A liquid crystal alignment agent capable of forming a liquid crystal display element having good resistance to ultraviolet decay and no mura effect, a liquid crystal alignment film, and a liquid crystal display element having the same are provided. The liquid crystal alignment agent includes a polymer (A), a polysiloxane (B), a photopolymerizable compound (C), and a solvent (D). The polymer (A) is obtained by reacting a first mixture. The first mixture includes a tetracarboxylic dianhydride component (a1) and a diamine component (a2). The polysiloxane (B) is obtained by reacting a polysiloxane compound and a carboxylic acid compound (b4) having a C4 to C50 long chain. The polysiloxane compound is obtained by reacting a second mixture including a silane compound (b1) containing a polymerizable unsaturated group and a silane compound (b2) containing an epoxy group.

Abstract: A copolymer is provided, which includes a chemical structure of: R is C1-6 alkylene group. T is a terminal group including C1-6 alkyl group, C3-6 cycloalkyl group, or C6-12 aromatic group. l is 0.05 to 0.3, m is 0.1 to 0.2, n is 0.5 to 0.8, l+m+n=1, x is 40 to 100, and o is 10 to 120. An epoxy resin composite is also provided, which includes 100 parts by weight of epoxy resin and 1 to 20 parts by weight of toughness enhancer such as the above copolymer.

Abstract: Embodiments herein relate to a prepreg comprising a thermosetting resin, and reinforcing fibers in the thermosetting resin, wherein when the prepreg is cured in vacuum bag only conditions, and a method of making the same. The method also applies for autoclave processing. Embodiments also relate to a cured fiber reinforced composite material made by thermally curing the prepreg.

Abstract: A composition including: (a) a silane derivative of the formula (I) in which R1, R2, R3 and R4, which may be the same or different, are selected from alkyl, acyl, alkyleneacyl, cycloalkyl, aryl and alkylenearyl, and/or a hydrolysis and/or condensation product of the silane derivative of the formula (I); (b) a silane derivative of the formula (II) R6R73?nSi(OR5)n??(II) in which R5 is an alkyl, acyl, alkyleneacyl, cycloalkyl, aryl or alkylenearyl group, R6 is an organic radical containing an epoxide group, R7 is an unsubstituted or substituted alkyl, cycloalkyl, aryl or alkylenearyl group, n is 2 or 3, and/or a hydrolysis and/or condensation product of the silane derivative of the formula (II); (c) a colloidal inorganic oxide, fluoride or oxyfluoride; (d) an epoxide compound having at least two epoxide groups, and (e) a catalyst system.

Abstract: An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120° C. to 130° C. for 1 to 20 minutes, a second stage at a temperature ranging from 140° C. to 150° C. for 1 to 10 minutes, a third stage at a temperature ranging from 160° C. to 180° C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160° C. to 180° C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof.

Abstract: An epoxy caulking adhesive, including: a component A and a component B. The component A at least includes the following components in parts by weight: between 50 and 100 parts of an epoxy resin, between 0 and 100 part(s) of an inorganic filler, between 0 and 20 part(s) of a thickener. The component B at least includes the following components in parts by weight: between 20 and 100 parts of an amine curing agent, between 0 and 150 part(s) of the inorganic filler, and between 0 and 25 part(s) of the thickener. The weight ratio of the component A to the component B is between 1:1 and 10:1. At least one of the inorganic filler and the thickener exists in both the component A and the component B.

Abstract: The present invention provides novel polymeric amine compositions employing amine compounds having multiple tertiary amine groups. Methods of making these new compositions are also disclosed. Amine compositions and amine-epoxy compositions employing the polymeric amine compositions of the present invention are also provided.

Abstract: The invention relates to an aqueously dispersible epoxy resin E, comprising building blocks derived from an aliphatic polyether polyol A, an epoxy resin B having at least two epoxide groups per molecule, an epoxy resin B? having at least two epoxide groups per molecule, which may be identical to B, or different from B, an epoxy-functional fatty acid ester D, and an aromatic polyol C, a process for the preparation thereof, and a method of use thereof.

Abstract: A method for preparing an emulsion for a cationic electrodeposition coating composition at an emulsification field, wherein the method includes synthesizing a base resin for a cationic electrodeposition coating composition, removing the base resin in a liquid state from a reaction vessel and then changing the resin into a solid state, and optionally, adjusting a size of the resin into an predetermined size, and emulsifying the resin at the emulsification field by adding water and an optional solvent, a neutralizing agent, a curing agent or additives, wherein the base resin is an aminated resin and has a softening point of 20-90° C., and wherein the adjusted shortest size of the base resin is 40 cm or less. Furthermore, the present application relates to a method for transporting a resin for cationic electrodeposition coating composition.

Abstract: A fluorine-containing highly branched polymer obtained by polymerizing a polyfunctional monomer A that has two or more radically polymerizable double bonds and all or a portion of which has a bisphenol structure, a monomer B having a fluoroalkyl group and at least one radically polymerizable double bond, within a molecule, and a monomer C having at least one ring-opening polymerizable group selected from the group including an epoxy group and an oxetanyl group, and having at least one radically polymerizable double bond, within a molecule, under the presence of a polymerization initiator D with an amount of 5% by mole to 200% by mole to the number of moles of the polyfunctional monomer A; an epoxy resin composition including the polymer; and an epoxy resin cured product obtained from the resin composition.

Abstract: A polylactic acid resin composition includes: 0.005 parts by weight to 1.2 parts by weight of a metal phosphate represented by Formula (1): MxHyPOz??(1) (in Formula (1), M is an alkali metal atom or an alkaline earth metal atom, and x, y, and z are integers satisfying 1?x?2, 1?y?4, and 2?z?8, respectively) with respect to 100 parts by weight of a polylactic acid resin including a poly-L-lactic acid component and a poly-D-lactic acid component, wherein a crystallization enthalpy of crystals in the polylactic acid resin is not less than 5 J/g when a temperature of the polylactic acid resin composition is increased to 250° C., and the temperature is kept constant for 3 minutes, followed by decreasing the temperature at a cooling rate of 20° C./min in differential scanning calorimetry.

Abstract: The present invention relates to a concentrated polymeric composition which comprises: a) vinyl aromatic polymers and/or copolymers in an amount ranging from 10% to 90% by weight, calculated with respect to the overall composition, with respect to the overall composition, b) at least one compound containing epoxy functional groups in an amount ranging from 0.01% to 5% by weight, calculated with respect to the overall composition, with respect to the overall composition, c) at least one infrared absorbing agent, in an amount ranging from 10% to 90% by weight, calculated with respect to the overall composition, with respect to the overall composition.

Abstract: The invention relates to a curing agent for epoxy resins which is an aqueous dispersion of a multifunctional amine AC having more than one primary amino group per molecule, and at least one moiety per molecule derived from the reaction of a compound C containing at least one reactive group which is preferably an epoxide group, with a molecule having at least one blocked primary amino group and at least one group which is reactive towards the at least one reactive group of compound C, which is selected from the group consisting of secondary amino groups >NH, of hydroxyl groups —OH, of mercaptan groups —SH, of amide groups —CO—NHR, where R can be hydrogen or an alkyl group having from one to twelve carbon atoms, of hydroxyester groups, and of acid groups, particularly of carboxyl groups —COOH, sulphonic acid groups —SO3H, and phosphonic acid groups —PO3H2, and preferably, also moieties which are compatible with an epoxy resin, as well as a process for its preparation, and a method of use thereof.

Abstract: An environmental protection cold mixing type modulus-adjustable pavement material and preparation method thereof. Equal components of waterborne epoxy resin and waterborne curing agent are added in a container to obtain a waterborne epoxy resin mixture. Emulsified bitumen, the waterborne epoxy resin mixture, an emulsifying agent, a defoaming agent and a stabilizing agent are prepared according to a certain mass ratio; the emulsified bitumen is first added in the container, and the pH is regulated with hydrochloric acid to be 5.0 to 6.5; the above-mentioned other materials are added and stirred to make mixed liquid; a stator of a high-speed shearing machine is put into the mixed liquid, and the rotational speed is set as 350 to 500 rpm for about 20 to 40 min to obtain waterborne epoxy emulsified bituminous emulsion. B.

Abstract: A prepreg for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance includes a base material, a resin composition impregnated into or coated on the base material, and huntite. The resin includes (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by xMgCO3·yMg(OH)2·zH2O wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4; (B) an epoxy resin; and (C) a curing agent. The prepreg can be used to prepare a laminated sheet and a metal foil-laminated sheet.

Abstract: A binder composition for a non-aqueous secondary battery electrode may comprise functional group-containing crosslinked resin microparticles produced by polymerizing: (A) at least one monomer selected from the group consisting of (a) a monomer having one ethylenically unsaturated group per molecule and also having a monofunctional or polyfunctional epoxy group, (b) a monomer having one ethylenically unsaturated group per molecule and also having a monofunctional or polyfunctional amide group, and (c) a monomer having one ethylenically unsaturated group per molecule and also having a monofunctional or polyfunctional hydroxy group; (B) at least one monomer selected from the group consisting of (d) a monomer having one ethylenically unsaturated group per molecule and also having an alkoxysilyl group and (e) a monomer having at least two ethylenically unsaturated groups per molecule; and (C) (k) a monomer which has an ethylenically unsaturated group and is different from the monomers (a) to (e).

Abstract: A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 ?m/sec to 0.02 ?m/sec after the heat history of 180° C. for 60 minutes, (c) a bleed-out amount is 50 mg/m2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG).

Abstract: The present invention relates to a thermosetting composition for an organic light-emitting element filler, which comprises (A) 100 parts by weight of an epoxy-based resin including (A1) an epoxy resin having a weight average molecular weight of around about 200 g/mol or more to less than about 1000 g/mol, (A2) an epoxy resin having a weight average molecular weight of around about 1000 g/mol or more to less than about 20000 g/mol and (A3) an epoxy resin having a weight average molecular weight of about 20000 g/mol or more to less than about 100000 g/mol, (B) about 10 parts by weight to about 40 parts by weight of a sheet-like filler and (C) about 0.1 parts by weight to about 20 parts by weight of an imidazole curing agent having a cyano group; and an organic light-emitting element display device comprising the same.

Abstract: A glass composition including SiO2 in an amount from about 70.0 to about 78.2% by weight, Al2O3 in an amount from about 18.6 to about 26.2% by weight, MgO in an amount from about 3.1 to about 10.7% by weight, CaO in an amount from 0.0 to about 7.6% by weight, Li2O in an amount from about 0.1 to about 5.0% by weight, and Na2O in an amount from 0.0 to about 0.2% by weight is provided. In exemplary embodiments, the glass composition is free or substantially free of B2O3 and fluorine. The glass fibers have a specific strength between about 1.6×106 J/kg and 2.24×106 J/kg and a specific modulus between about 3.3×107 J/kg and 3.7×107 J/kg. Glass fibers formed from the inventive composition possess exceptionally high specific strength and a low density, which make them particularly suitable in applications that require high strength, high stiffness, and low weight, such as in wind blades and aerospace structures.