Abstract: A composition comprising: (a) an epoxy resin composition comprising: (i) a first epoxy component comprising an epoxy resin having at least one oxazolidone ring structure; and (ii) a second epoxy component selected from the group consisting of a liquid epoxy resin, a divinylarene dioxide, and combinations thereof; (b) a core-shell rubber comprising a rubber particle core and a shell layer, and (c) a hardener, is disclosed.

Abstract: Novel oligomers and polymers derived from the reaction of benzoxazine compounds with a mixture of epoxy compounds and amine compounds are disclosed. The compositions are useful in coating, sealants, adhesive and many other applications.

Abstract: Oxygen barrier compositions for electrical devices and their related methods are provided. In certain embodiments, the oxygen barrier compositions comprise a meta-substituted aromatic resin and an additional aromatic epoxy resin. In some embodiments, the compositions have a chlorine content of less than approximately 1000 ppm. The compositions may have an oxygen permeability of less than approximately 0.4 cm3·mm/m2·atm·day at approximately 0% relative humidity and approximately 23° C. In certain embodiments, methods of curing the oxygen barrier compositions comprise partially curing the composition where, the partial cure is achieved through ultraviolet radiation or heat.

Abstract: Heat-activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composed at least of: a) an acid-modified or acid-anhydride-modified vinylaromatic block copolymer and b) an epoxidized vinylaromatic block copolymer.

Abstract: A curable composition obtained by blending a polymerizable compound (A) having predetermined types of polymerizable functional groups, a reactive compound (B) having predetermined types of reactive functional groups, a compound (C) which is an imidazolyl group-containing compound having a predetermined structure, and a compound (D) which is an oxime compound or an oxime ester compound having a predetermined structure.

Abstract: A frame sealant composition and a method of preparing the same, a liquid crystal panel containing the frame sealant composition. The frame sealant composition comprises a resin, a catalyst, a solvent, a hydrophobic silica filler, and silicon spheres; wherein, the hydrophobic silica filler has a shape of irregular polyhedron. The optimum of hydrophobic silica particles increases the whole surface area of the silica particles and correspondingly enhances the hydrophobicity of the frame sealant composition. The frame sealant composition further comprises a dispersant, the addition of which makes the silica fillers more evenly distributed in the frame sealant composition and avoids void caused by the uneven distribution.

Abstract: The present invention provides an adhesive composition excellent in adhesive strength. The adhesive composition of the present invention contains 100 parts by weight of polyalkylene oxide having a hydrolyzable silyl group, 1 to 20 parts by weight of an epoxy resin, 0.1 to 10 parts by weight of an epoxysilane coupling agent, 0.5 to 20 parts by weight of a ketimine compound, and 1 to 100 parts by weight of fatty acid-treated calcium oxide.

Abstract: A copolymer dispersion is described comprising a copolymer derived from a monomer mixture comprising: (a) 88.5 to 94% by weight of at least one vinyl ester of a saturated carboxylic acid; (b) 5 to 10.5% by weight of ethylene; (c) 0.5 to 5% by weight of at least one ethylenically unsaturated acid and/or an anhydride thereof and/or a salt thereof; and (d) 0.5 to 5% by weight of at least one ethylenically unsaturated monomer having at least one crosslinkable functional unit. The weight ratio of vinylester units to ethylene units in the copolymer is between 89:11 and 94:6 and the dispersion is stabilized with at least 1% by weight of an emulsifier, wherein the amounts of monomers and emulsifier refer to the total amount of monomers in the copolymer.

Abstract: A thiol group-containing polymer is represented by HS—(R—Sr)n—R—SH, wherein R is an organic group including a —O—CH2—O— bond and/or a branched alkylene group, n is an integer of from 1 to 200, r is an integer of from 1 to 5, and the average value of r is 1.1 or more and 1.8 or less. A curable composition using the thiol group-containing polymer can be used in sealants, adhesives, paints and the like, which require properties such as a low specific gravity, a low viscosity and a low glass transition temperature.

Abstract: A self-consuming structure is disclosed that is formed from a self-consuming composition based on an epoxy or polyurethane having fuel and/or oxidizer molecularly dispersed and/or as particulates in the epoxy or polyurethane. The composition may be used to form self-consuming structural components.

Abstract: A UV or thermally curable, low odor, liquid coating composition, which readily applied at room temperature without heating comprising: a) a reactive acrylic based polymer comprising pendant acrylate or methacrylate groups; b) reactive unsaturated monomers, typically acrylic or methacrylic monomers, often polyfunctional monomers; c) a thermal or UV activated radical initiator; and in many embodiments, d) an inert and non-polar wax or viscous oil, e.g., a paraffinic material, and e) optionally a tertiary amine, for example, a tertiary amine accelerator used with a thermally activated radical initiator. Also provided are substrates coated with the composition of the invention, for example, flooring coated with the inventive composition.

Abstract: An epoxy thermoset that includes a reaction product of a toughening agent prepared from a reaction of a first epoxy resin and a polyether polyamine, a second epoxy resin and a liquid amine hardener for the toughening agent and the second epoxy resin. The toughening agent is an adduct of the second epoxy resin and the polyether polyamine. The polyether polyamine phase of the toughening agent separates to form particles in the epoxy thermoset, where the particles have a volume average diameter in a range from 20 nanometers to 200 nanometers.

Abstract: A method of making an article includes mixing a filler material and a polymer matrix material to produce a composite material, introducing the composite material produced by the mixing into a mold of a desired shape, and removing an article having the desired shape from the mold. The resulting article has a water absorption of less than about one percent and the filler material comprises vitreous china.

Abstract: An epoxy resin composition is provided which includes a polycrystalline structure comprised of a plurality of monocrystalline structures. The plurality of monocrystalline structures are respectively comprised of a plurality of silicon oxide colloidal particles regularly aligned in epoxy resin. The plurality of silicon oxide colloidal particles are not contacted with each other. The mean distance between the silicon oxide colloidal particles adjacent to each other is less than 330 nm. The mean particle size of the plurality of silicon oxide colloidal particles is less than 290 nm. The concentration of the plurality of silicon oxide colloidal particles is 10-50% by mass. A relative permittivity of 4 or more is ensured. A method for producing the epoxy resin composition is provided. Building materials, ornaments and optical materials, each using the epoxy resin composition, are also provided.

Abstract: Compounds are attached to carbon nanotubes (CNT) by a process which comprises: subjecting surface treated CNTs which have been treated to induce negatively charged surface groups thereon, to nucleophilic substitution reaction with a compound carrying a functional group capable of reacting with the negatively charged groups on the CNT surface, whereby the compound chemically bonds to the CNT. The surface CNT treatment may be reduction. The compounds which are bonded to the CNT may be epoxy resins, bonded directly or through a spacer group. Bi-functional CNTs, grafted to both epoxy resins and other polymers such as polystyrene, are also made by this process.

Abstract: Compounds of formula I, uses as crosslinking agents or curing agents thereof, and resins obtained by using the compounds as crosslinking agents.

Abstract: A hardener composition comprising a) an accelerator comprising a first amine at least partially neutralized by salicylic acid and a first modifier; b) a non-isolated adduct of i) a difunctional epoxy; and ii) a second amine; and c) a second modifier, and a process for making the hardener composition, are disclosed. The hardener can be used with an epoxy resin to form a curable composition.

Abstract: The present invention provides a method for producing cellulose nanofibers, the method including fibrillating cellulose in a modified epoxy resin (A) having a hydroxyl value of 100 mgKOH/g or more. Also, the present invention provides cellulose nanofibers produced by the production method and a master batch containing the cellulose nanofibers and the modified epoxy resin (A). Further, present invention provides a resin composition containing the master batch and a curing agent (D), and provides a molded product produced by molding the resin composition.

Abstract: Disclosed herein are embodiments of an epoxy casting resin system which can be used to at least partially cover an electronic component or mechanism. In some embodiments, the epoxy resin can have a low viscosity, while maintaining advantageous physical, thermal, and electrical properties. Further described are methods for making embodiments of the epoxy casting resin.

Abstract: The invention relates to a method for in-situ synthesis of silicon nanoparticles in a thermosetting polymeric matrix, the thermosetting and thermoset matrices obtained in this way and a material including same. The method includes the following steps: a) forming an aqueous-phase/organic-phase inverse emulsion, wherein the aqueous phase includes at least a basic catalyst and the organic phase includes at least a non-cross-linked (co)polymer precursor chosen from an aliphatic, cycloaliphatic or aromatic epoxy resin precursor, a polyester-imide precursor, an unsaturated/epoxy polyester (co)polymer precursor, a polyether/epoxy (co)polymer precursor and a polyurethane precursor; b) introducing, into the inverse emulsion formed in step a), at least one silicon precursor forming a complete network whereof the rate of hydrolysis is greater than the cross-linking speed of the (co)polymer and c) stirring the mixture obtained in step b) and heating to a temperature between 20° C. and 70° C.