Patents Examined by Michael A Matey
  • Patent number: 11513573
    Abstract: A system includes a display panel, a temperature sensor configured to measure a temperature of the display panel, a thermoelectric device coupled to the display panel and configured to transfer heat to or from the display panel, and a controller electrically coupled to the temperature sensor and the thermoelectric device. The controller is configured to receive the measured temperature of the display panel and, based on the measured temperature of the display panel, send a second signal to the thermoelectric device to cause the thermoelectric device to remove a first quantity of heat from the display panel or send a third signal to the thermoelectric device to cause the thermoelectric device to provide a second quantity of heat to the display panel.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: November 29, 2022
    Assignee: META PLATFORMS TECHNOLOGIES, LLC
    Inventors: Min Hyuk Choi, Zhiming Zhuang, Kyung Won Park
  • Patent number: 11507154
    Abstract: A keyboard assembly for a portable information handing system. The keyboard assembly includes a plurality of keys, the plurality of keys being arranged in a typewriter style layout to allow a user to enter text content into the portable information handling system; and, a keyboard carrier, the plurality of keys being mounted to the keyboard carrier, the keyboard carrier determining when a key of the plurality of keys is actuated and generating information regarding the key of the plurality of keys, the keyboard carrier comprising a venting portion, the venting portion being located beneath a set of keys of the plurality of keys, the venting portion comprising a plurality of venting apertures.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: November 22, 2022
    Assignee: Dell Products L.P.
    Inventors: Mark Andrew Schwager, Travis C. North, Yu-Feng Huang, Kai-Yuan Cheng
  • Patent number: 11503740
    Abstract: An information handling system having a heat exchanger positioned near and in thermally-conductive conduct with an electrical, heat-generating component of the information handling system, such as a central processing unit or graphics processing unit. A fan directs air across the heat exchanger to cool the electrical component by convection. A first portion of the heat pipe may be in direct physical contact with the electrical component and a second portion of the heat pipe may be in thermal contact with the electrical component and the first portion and in direct physical contact with an additional heat exchanger. The fan may direct air across both heat exchangers to cool the electrical component.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: November 15, 2022
    Assignee: Dell Products L.P.
    Inventors: Qinghong He, Patrick Hampton
  • Patent number: 11483949
    Abstract: Self-contained server assemblies for housing servers or server blades and associated computing facilities are disclosed herein. In one embodiment, a server assembly includes an enclosure having an interior space housing a server blade, a dielectric coolant submerging heat producing components of the server blade, and a condenser assembly having a condenser coil in fluid communication with a vapor gap in the interior space. The condenser coil is configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the server blade.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: October 25, 2022
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Nicholas Keehn, Robert Jason Lankston, Husam Alissa
  • Patent number: 11474571
    Abstract: A display panel module and an electronic device is provided, the display pane module including a plurality of display panel modules. According to the disclosure, an electronic device comprises: a housing, a cover glass, a plurality of display panels disposed adjacent to a rear surface of the cover glass in the housing, a plurality of first heat dissipation plates disposed adjacent to rear surfaces of the plurality of display panels in the housing, a plurality of power/data reception circuit boards disposed adjacent to rear surfaces of the plurality of first heat dissipation plates in the housing, a support configured to support at least a portion of the plurality of power/data reception circuit boards, and a power/data transmission circuit board having at least a portion contacting and supported by the support and spaced apart by a predetermined distance from the plurality of power/data reception circuit boards in a space provided by the support.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: October 18, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seogyong Jeong, Junhyeong Park, Jaehyuck Shin, Youngho Ryu, Byeongguk Choi, Sungku Yeo, Chongmin Lee
  • Patent number: 11477911
    Abstract: A thermal module with a heat pipe configured on a first portion having a constant cross-section thickness and a tapered second end configured for contact with a fin stack. The heat pipe is tapered along a length of the second portion such that the cross-section thickness of the heat pipe decreases toward the end of the heat pipe. A fin stack coupled to the tapered portion comprises a plurality of fins of different heights, wherein the fin heights increase such that the combined fin height and heat pipe cross-section thickness remains approximately constant over the width of the fin stack. The tapered heat pipe and fin stack with fins with increasing fin heights provide increased cooling and decreased airflow impedance through the fin stack.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: October 18, 2022
    Assignee: Dell Products L.P.
    Inventor: Qinghong He
  • Patent number: 11467639
    Abstract: A heat dissipation assembly can be applied to the electronic device. By providing a heat dissipation fan and a temperature sensor for the heat dissipation assembly, and arranging the heat dissipation assembly in an accommodation space defined by a processor cover plate and a control mainboard, the heat dissipation fan can improve a heat dissipation effect on the processor by utilizing air flow generated by the heat dissipation fan in the accommodation space in cooperation with heat dissipation openings in the processor cover plate.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: October 11, 2022
    Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventor: Zhenxu Li
  • Patent number: 11460897
    Abstract: A computing device comprises: a base portion; a display portion that is movably coupled to the base portion and includes a housing having a movable panel and one or more fixed panels; and a mechanical assembly that positions the movable panel away from the one or more fixed panels as the display portion opens away from the base portion.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: October 4, 2022
    Assignee: NVIDIA Corporation
    Inventors: Amit Kulkarni, Gabriele Gorla, Andrew Bell, Boris Landwehr
  • Patent number: 11454537
    Abstract: An optical measurement stability control system includes a case, a circulating flow field, an optical measurement system and a heat dissipation flow field. The case has an airtight space. The circulating flow field is located in the airtight space and adapted to generate an airflow flowing in the airtight space. The optical measurement system is located in the airtight space and located on a flow path of the airflow. The heat dissipation flow field is connected to the case and located at an end of the flow path. The heat dissipation flow field discharges heat out of the airtight space by heat conduction and forced convection.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: September 27, 2022
    Assignee: Industrial Technology Research Institute
    Inventors: Wen-Hsien Su, Chun-Ming Wen, Chia-Ching Lin
  • Patent number: 11455019
    Abstract: A docking system for facilitating a connection of an electronics module to a mating connector comprises first and second rails. Each rail has an elongated guide slot for receiving a corresponding guide portion of the electronics module during sliding movement of the electronics module toward the mating connector. A first elastic structure is located on the first rail. The first elastic structure has a first engagement portion extending into the elongated guide slot of the first rail. A second elastic structure is located on the second rail. The second elastic structure has a second engagement portion extending into the elongated guide slot of the second rail. The first engagement portion and the second engagement portion are configured to engage the guide portions of the electronics module and to resist movement of the guide portions in a direction generally perpendicular to the sliding movement of the electronics module.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: September 27, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chun Chang, Chia-Chun Chen, Ta-Wei Chen, Zhao-Hong Chen
  • Patent number: 11457543
    Abstract: A fan package of an information handling system includes a rear cooling fan, a front cooling fan, and a fan fin package. The rear cooling fan generates a first airflow. The front cooling fan generates a second airflow. The fan fin package is in physical communication with the rear cooling fan and the front cooling fan. The fan fin package includes multiple fins. Based on the first airflow and the second airflow, the fins rotate between a closed position and an open position. The fins are biased toward the closed position.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: September 27, 2022
    Assignee: Dell Products L.P.
    Inventors: Harris Di IDihuweii, Mingming Zhang
  • Patent number: 11448226
    Abstract: The present invention is a fan having rotation sensing, comprising a casing, a motor disposed within the casing, a rotation sensing unit, and a control unit, the rotation sensing unit detecting a first rotation of the casing and outputting a first sensing signal, the control unit having a controller electrically coupled to the rotation sensing unit and the motor, the controller receiving the first sensing signal according thereto to control the motor to perform a first operation mode. Through this design, an operation mode of the fan can be adjusted according to the rotation of the fan in the present invention.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: September 20, 2022
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Po-Sheng Huang
  • Patent number: 11448473
    Abstract: A heat exchanging arrangement for a subsea electronic system, the heat exchanging arrangement including a wall section; a corrugation formed in the wall section, the corrugation having two generally opposing internal corrugation surfaces; and at least one heat exchanging element forced against at least one of the internal corrugation surfaces. A subsea electronic system including a heat exchanging arrangement is also provided.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: September 20, 2022
    Assignee: ABB Schweiz AG
    Inventors: Tor Laneryd, Thomas Gradinger, Thomas Wagner, Heinz Lendenmann
  • Patent number: 11435795
    Abstract: A cooling system comprises one or more hyperbaric fans and an electromagnetic interference (EMI) shield protecting selected components in a sealed chassis. The EMI shield comprises vents configured to allow airflow through the shield but prevent direct transmission of electromagnetic energy through the EMI shield. Airflow generated by a hyperbaric fan in the sealed chassis is able to flow through the vents to cool components surrounded by the EMI shield and the EMI shield prevents electromagnetic energy generated by some components from interfering with other components.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: September 6, 2022
    Assignee: Dell Products L.P.
    Inventors: Qinghong He, Allen B. McKittrick, Changsoo Kim
  • Patent number: 11432441
    Abstract: The present application discloses a display module (20) and a display apparatus (10). The display panel (10) includes a heat dissipation structure (70) for dissipating heat of a source driver (60). The heat dissipation structure (70) is adhered to an upper surface (61) of the source driver (60) far away from the printed circuit board (50), and at least one side or top corner of the upper surface (61) is not adhered with the heat dissipation structure.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: August 30, 2022
    Assignees: HKC CORPORATION LIMITED, CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Mingliang Wang
  • Patent number: 11432440
    Abstract: A power conversion apparatus includes an electric component, a housing, and a flow channel formation unit. The electric component configures at least a part of a power conversion circuit. The housing stores the electric component, and the electric component is fixed to the housing. The flow channel formation unit forms a refrigerant flow channel through which a refrigerant flows, and is thermally connected to the electric component. The flow channel formation unit is a member different from the housing, and an elastically deformable spacer is provided between the flow channel formation unit and the housing.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: August 30, 2022
    Assignee: DENSO CORPORATION
    Inventors: Hiromi Ichijo, Kazuya Takeuchi
  • Patent number: 11429164
    Abstract: A compact and mobile information handling system, such as a tablet, including a thermally-configured chassis having one or more fans and one or more inlets for directing air flow directly across components of the information handling system to cool such components by convection. Such fans may additionally direct air flow across a heat exchanger and/or heat pipe coupled to heat-producing components like a central processing unit and/or graphics processing unit. Components of the information handling system may be positioned on the thermally-configured chassis and used to efficiently direct the air flow throughout the chassis without requiring additional space. The inlets and outlets may be positioned on one or more sides of the information handling system.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: August 30, 2022
    Assignee: Dell Products L.P.
    Inventors: Allen B. McKittrick, Qinghong He
  • Patent number: 11432426
    Abstract: A modular mounting for a computer motherboard. An outer cabinet is designed to provide a protective enclosure for electrical components, and designed to permit throughhole drilling to facilitate mounting on a wall while avoiding disturbance of contents to be mounted within the outer cabinet. A subpanel plate is designed to detachably and securely attach a computer motherboard and cage assembly, and designed to removably mount the motherboard and cage assembly within the outer cabinet as a modular component, mounting of the motherboard and cage assembly being independent of power supply and nonvolatile storage. An inner cage is designed to protectably mount and enclose a computer motherboard and heat sink, and mount to the subpanel plate. A multipole switch may have a set of contacts for each conductor of a network cable entering the outer cabinet, one throw of the switch connecting all conductors of the cable, another throw of the switch disconnecting all contacts of the cable.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: August 30, 2022
    Assignee: Aertight Systems, Inc.
    Inventors: Gordon Triplett, Julia Triplett, Matthew Findley, Edward Triplett
  • Patent number: 11424089
    Abstract: The present disclosure envisages a heat-absorbing-and-dissipating jacket (80) for a terminal (100) of an electrical device (1000). The jacket has a body (81) configured to at least partially contour walls of the housing (10) of the terminal (100) and the jacket is made of a heat-absorbing-and-dissipating material. The body (81) of the jacket has a lower portion (86) extending operatively below the housing (10) of the terminal (100). The body (81) of the jacket also has an upper portion (88) extending operatively above the housing (10) of the terminal (100). The jacket (80) of the present disclosure is a cost-effective means which allows maximum heat absorption and dissipation from an enclosed electrical device and can be incorporated in an existing design of an electrical device.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: August 23, 2022
    Assignee: Appleton Grp LLC
    Inventor: Amit S. Kulkarni
  • Patent number: 11425846
    Abstract: A DC-DC converter as an electric power source device has a magnetic component, a semiconductor component, a circuit substrate and a thermal conductive component. The magnetic component has a thermal energy discharge surface. The semiconductor component is electrically connected to the magnetic component. A controller arranged on the circuit substrate is electrically connected to the semiconductor component to control behavior of the semiconductor component. The thermal conductive component is arranged in a thickness direction of the circuit substrate to be overlapped with the magnetic component. The thermal conductive component is arranged, without being electrically connected with the semiconductor component and the circuit substrate, to face the thermal energy discharge surface of the magnetic component to allow thermal energy generated in the magnetic component to be conducted with the thermal conductive component.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: August 23, 2022
    Assignee: DENSO CORPORATION
    Inventors: Kwan Ryul Kim, Shotaro Yamasaki