Patents Examined by Michael A Matey
  • Patent number: 11910561
    Abstract: Aspects of the present disclosure relate to a cooled wireless mobile device charger. As an example, a cooling enclosure is provided, comprising a cooling surface. The cooling enclosure may shield a mobile device therein from direct sunlight or other adverse conditions, thereby reducing the heat exposure of the device. The cooling surface may comprise a thermoelectric cooling element or any of a variety of other cooling means. Additionally, the cooling surface may be angled about a lateral axis to enable a user to more easily view at least a part of the mobile device (e.g., in a landscape or portrait orientation) while the device is in the cooling enclosure. In some instances, a detachable visor is provided that further shields the mobile device from sunlight. As another example, the visor may retract within the cooling enclosure.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: February 20, 2024
    Assignee: Polaris Industries Inc.
    Inventors: Benjamin D. Duke, Walter B. Ross, Benoit J. Renaud, Robert J. Wachs, Jr.
  • Patent number: 11910517
    Abstract: A system including a point of load converter module (POL). The POL module includes a point of load printed circuit board. At least one inductor is mounted to the point of load printed circuit board. The POL module includes a power network. The point of load converter module is configured to be surface mounted. The system includes a heat sink including a first leg configured to be surface mounted adjacent the point of load printed circuit board, a second leg configured to be surface mounted adjacent the point of load printed circuit board opposite the first leg, and a cap portion connecting the first leg to the second leg. The heat sink is sized and shaped to encompass the POL and configured to connect to the power network. The power network may be a PGND network.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: February 20, 2024
    Assignee: AcLeap Power Inc.
    Inventors: John Andrew Trelford, Alok K. Lohia, Arturo Silva
  • Patent number: 11910563
    Abstract: A computing device comprises a housing, a heat-generating electronic component, at least one additional electronic component, and a liquid cooling module. The heat-generating component, the at least one additional electronic component, and the liquid cooling module are all positioned inside the housing. The liquid cooling module is configured to cool the heat-generating electronic component, and includes at least one movable radiator. The at least one movable radiator is configured to move between a first position and a second position. When the at least one movable radiator is in the first position, the at least one movable radiator blocks access to the at least one additional electronic component within the housing. When the at least one movable radiator is in the second position, the at least one movable radiator allows access to the at least one additional electronic component within the housing.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: February 20, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Jen-Mao Chen, Wei-En Tsai, Sin-Hong Lien, Jhih-Bin Guan
  • Patent number: 11910557
    Abstract: Several transportable datacenters are described. The transportable datacenters include transport systems allowing them to be transported between an assembly location and an operating location. The transportable datacenters also include a ventilation system for cooling processors positioned in racks in the datacenters. The ventilation system draws cold air from the environment, through processor bays containing the processors and then exhausts the air back to the environment.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: February 20, 2024
    Assignee: Digital Shovel Holdings Inc.
    Inventor: Scot Arthur Johnson
  • Patent number: 11903161
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a fan where the fan blades are decoupled from the center shaft. The fan can include a center shaft, a motor coil support, motor coils coupled to the motor coil support, a rotator coupled to the center shaft, and fan blades coupled to the rotator, where rotation of the fan blades is decoupled from the center shaft by the rotator. A blade support can be coupled to the rotator, where the blade support couples the fan blades to the rotator and magnets can be coupled to the blade support. In an example, the rotator can include an inner, an outer race, and bearings.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: February 13, 2024
    Assignee: Intel Corporation
    Inventors: Srinivas Rao Konakalla, Prakash Kurma Raju, Bijendra Singh, Juha Tapani Paavola, Prasanna Pichumani
  • Patent number: 11889656
    Abstract: An electronic apparatus includes a body including a containing cavity, a separation component arranged at the containing cavity to divide the containing cavity into a first cavity and a second cavity, a heat generation assembly arranged at the first cavity, and an air guide component arrange at the second cavity to drive airflow at the second cavity to dissipate the heat of the heat generation assembly through the separation component, wherein the second cavity is configured as an air duct of the electronic apparatus.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: January 30, 2024
    Assignee: Lenovo (Beijing) Limited
    Inventors: Shenghua Xi, Xin Wei
  • Patent number: 11889640
    Abstract: According to various embodiments of the disclosure, an electronic device may comprise: a foldable housing including a hinge structure comprising a hinge, a first housing connected to the hinge structure and including a first surface and a second surface spaced apart from the first surface and inclined at a first angle with respect to the first surface and a second housing connected to the hinge structure and including a third surface and a fourth surface spaced apart from the third surface, wherein in a folded state, the first surface faces the third surface and, in a fully unfolded state, a direction in which the first surface faces is identical to a direction in which the third surface faces, a first support disposed in the first housing and including a fifth surface inclined at a second angle different from the first angle with respect to the first surface, a first battery disposed on the fifth surface, and a display including a display panel extending from the first surface to the third surface and a disp
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: January 30, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woosung Chun, Soojung Kim, Joon Heo, Hyunju Hong
  • Patent number: 11882644
    Abstract: A cooling device for improving the cooling of computing devices in a data center is disclosed. The cooling device comprises an air deflector that is configured to be attached to a hot aisle air barrier at an angle to direct computing device exhaust air toward the nearest hot aisle exhaust vent. The device may comprise a mounting mechanism for fixing the air deflector in position, such as eyelets or clips that attach to the computing device's exhaust fan grille. The air deflector may be rotatable so that the angle between the hot aisle air barrier and the air deflector may be adjusted. The cooling device may further comprise a visual air flow indicator to assist in positioning of the air deflector and airflow monitoring.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: January 23, 2024
    Assignee: Core Scientific Operating Company
    Inventor: Lawrence Kom
  • Patent number: 11880248
    Abstract: A docking station for secondary external cooling for mobile computing devices, including: one or more ports for docking a mobile computing device; a docking platform for supporting the mobile computing device; a cooling element; and a thermal interface housed in the docking platform for transferring heat between the mobile computing device and the cooling element.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: January 23, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Christopher M. Jaggers, Christopher M. Helberg
  • Patent number: 11871549
    Abstract: Provided is a heat conduction mechanism including: a first member including at least one heat source; a second member including a heat dissipation element, the second member displaceable with respect to the first member; and a heat conductive sheet that transfers heat of the heat source to the heat dissipation element, in which a protective sheet is provided to a portion of the heat conductive sheet that can be in contact with at least a part of the first member or the second member.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: January 9, 2024
    Assignee: SONY GROUP CORPORATION
    Inventor: Hiroto Yamada
  • Patent number: 11867366
    Abstract: An LED module may include at least one LED and an indicator. The indicator may include one or more diffusing surfaces defining an angular diffusing groove. The diffusing groove may receive the LED such that the LED is at least partially located within a volume space defined by the one or more diffusing surfaces. The diffusing groove may diffuse a light emitted from the LED and incident on the one or more diffusing surface of the diffusing groove such that the light is diffused into an interior of the indicator.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: January 9, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seongyun Baek, Jaehong Park, Yusuf Cinar, Hanhong Lee
  • Patent number: 11871542
    Abstract: A user device that can be touched by a user includes a heat source that can generate heat; a case body covering the heat source; and a polymer-containing heat storage body attached to the case body.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: January 9, 2024
    Inventors: Tsuyoshi Morimoto, Naoki Furukawa, Atsuko Sano, Hiroshi Yokota
  • Patent number: 11864344
    Abstract: A computing device chassis for a common cooling solution for die packages comprising: a chassis base comprising: an internal cavity; a cooling element housed in the internal cavity; and one or more thermal interfaces to the cooling element.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: January 2, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventor: Christopher M. Jaggers
  • Patent number: 11860462
    Abstract: An electronic display assembly and a double-sided display are provided. The electronic display assembly comprises a case with an opening, a display panel, an air-interchange device and a flow generator. The air-interchange device is arranged in the opening of the case. The flow generator generates airflow through a pathway within the case. The direction of a first portion of the pathway near the air-interchange device is not parallel to a normal of the opening.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: January 2, 2024
    Assignee: DYNASCAN TECHNOLOGY CORP.
    Inventors: Tsun-I Wang, Ching-Chun Wu, Chia-Liang Yang
  • Patent number: 11864332
    Abstract: Disclosed are a control box and a display device including the same. The control box includes a case providing an inner accommodation space and having an opening formed in the upper surface thereof, a first plate supported by the lower surface of the case, a second plate located on the first plate so as to be spaced apart from the first plate, a third plate located on the second plate so as to be spaced apart from the second plate, a rotary plate covering the opening in the case and rotatably mounted to the third plate, and a transceiver located inside the case and coupled to the rotary plate. The display device includes a head including a display panel, and the head exchanges information with the transceiver.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: January 2, 2024
    Assignee: LG ELECTRONICS INC.
    Inventors: Gihyung Lee, Sangmoon Hwang, Joonsub Bae, Seokwoo Kwon, Yonghan Kim
  • Patent number: 11846994
    Abstract: According to one embodiment, an electronic device includes a housing unit including a surface at least on a side on which the housing unit is placed, the housing unit including an attachment portion, the attachment portion including a groove and a protrusion, and a support unit that supports the housing unit. The support unit is provided continuously from one end side to the other end side of the surface. Rigidity of an intermediate portion located between the one end side and the other end side is made lower than rigidity of both end portions on the one end side and the other end side by making a protrusion length of the protrusion at the intermediate portion shorter than a protrusion length of the protrusion at both the end portions.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: December 19, 2023
    Assignee: Dynabook Inc.
    Inventor: Tomomi Murayama
  • Patent number: 11847003
    Abstract: A folding device and a heat dissipation apparatus, where the folding device includes a heat collection element, including a heat collection plate and a first shaft sleeve, where a first end of the heat collection plate is in contact with a heat source in a first folding part, and a second end of the heat collection plate is coupled to an outer wall of the first shaft sleeve, the first shaft sleeve is sleeved on a rotating shaft, and a third end of the cooling element is in contact with the rotating shaft, and a fourth end of the cooling element is in contact with a heat dissipation device in a second folding part.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: December 19, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Guo Yang, Tao Huang, Wenming Shi, Teng Long, Wei Li, Jianliang Wang, Zhiguo Zhang
  • Patent number: 11836020
    Abstract: A temperature regulating mount for portable electronic devices is provided that includes a temperature control unit for preventing portable electronic devices from reaching critical temperatures during operation to avoid undesired shut down of the electronic device. The mount is further accompanied by a protective perimeter casing for protecting the electronic device and allowing the device to mate with a universal mount. The perimeter casing leaves the back of the device open or exposed (e.g., through webbing) for temperature control. The protective perimeter casing includes grooves and indents for mating with guide rails and a movable clamping mechanism for securing the electronic device to the mount in a particular orientation to maximize the mount's ability to regulate the temperature of the electronic device.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: December 5, 2023
    Inventor: Darren Saravis
  • Patent number: 11829214
    Abstract: The description relates to devices and air cooling of devices. One example can include a heat generating component positioned in a housing and a temperature-based gas separation assembly configured to receive ambient air and to separate the ambient air into warmer air that is directed outside the housing and cooler air that is directed inside the housing to cool the heat generating component.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: November 28, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Chien Lung Yang, Matthew Gen, Todd Chiles
  • Patent number: 11822810
    Abstract: In one embodiment, a network switch for an information handling system includes: a central processing unit (CPU); and a fan module removably coupled to the network switch, the fan module including: a housing having a front end and a back end; a plurality of fans disposed within the housing proximate to the back end; a memory interface disposed within the housing proximate to the front end, the memory interface communicably coupled to the CPU; a memory device disposed within the housing proximate to the memory interface, the memory device storing information associated with the networking operations and communicably coupled to the memory interface, the memory device removably coupled to the fan module.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: November 21, 2023
    Assignee: Dell Products L.P.
    Inventors: Robert Neal Beard, Colin John Montgomery, Shree Ramakrishna Rathinasamy, Padmanabhan Narayanan