Abstract: Approaches, techniques, and mechanisms are disclosed for packaging electric power components. A power module comprises: a three-dimensional (3D) cooling structure that has a plurality of planar sides; a first set of mountable power components that are mounted on a first planar side in the plurality of planar sides of the 3D cooling structure; a second set of mountable power components that are mounted on a second planar side in the plurality of planar sides of the 3D cooling structure. The second planar side represents an opposing side, of the 3D cooling structure, to the first planar side. The 3D cooling structure includes an interior space containing one or more cooling channels in which cooling fluid is to flow. The interior space of the 3D cooling structure is spatially surrounded by other planar sides in the plurality of planar sides in combination with the first and second planar sides.

Abstract: An example compute cabinet assembly includes an equipment room configured to implement electrical components therein, an air inlet channel coupled to a first side of the equipment room, and a cabinet fan module coupled to a second side of the equipment room opposite the first side. A first air outlet channel is coupled to the cabinet fan module and extends along a third side of the equipment room towards a first outlet of the first air outlet channel. Moreover, electric fans are positioned in the cabinet fan module, the electric fans being configured to create an airflow path originating at an inlet of the air inlet channel. The airflow path further extends through the equipment room and cabinet fan module. A guide plate is also positioned adjacent to an inlet of the equipment room, the guide plate being configured to uniformly distribute the airflow path through the equipment room.

Abstract: A graphics card including a circuit board module, a first heat dissipation fin, and a pair of fans is provided. The circuit board module includes a circuit board and a heat source. The circuit board has first to fourth sides surrounding the heat source. The first and second sides are opposite sides. The third and fourth sides are opposite sides. The first heat dissipation fin is in thermal contact with the heat source and has multiple channels communicating with the first to fourth sides. The fans disposed on the first and second sides respectively have first flow outlets facing the first heat dissipation fin and generate flows towards the first heat dissipation fin through the first flow outlets. The flows meet and squeeze in the channels to form turbulent flows and flow out of the graphics card through the third and fourth sides respectively. A computer host is also provided.

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Abstract: The present embodiment relates to a power module frame comprising a first frame side plate and a second frame side plate, which face each other and are in contact with at least parts of both side plates of a fan module when the frame side plates are coupled to the fan module, respectively, wherein the first frame side plate and the second frame side plate comprise: at least one fastening groove coupled to a catching part formed on the both side plates of the fan module; guide parts extending by a predetermined length from the lower ends of the first frame side plate and the second frame side plate to face each other, to support the lower surface of the fan module; and a screw-fastening part for coupling the first frame side plate to the fan module.

Abstract: A board unit includes: a board stack including a first circuit board and a second circuit board that are supported while being spaced apart from each other; an electronic component mounted on the first circuit board; a first heat dissipation member that covers the board stack from outside of the first circuit board; a second heat dissipation member that covers the board stack from outside of the second circuit board; a first heat transfer portion that thermally connects the electronic component and the first heat transfer portion; and a second heat transfer portion that thermally connects the electronic component and the second circuit board. The electronic component has a body located between the first circuit board and the second circuit board, and the second heat transfer portion is partially provided at a position that corresponds to the body of the electronic component.

Abstract: An apparatus cools electronic circuitry. A housing encloses the electronic circuitry and includes a plurality of surfaces, each configured to face an adjacent inner wall of the back box upon the housing being mounted inside the back box. A rear surface faces a rear wall of the inner walls of the back box. A mounting plate is disposed opposite to the rear surface, is in thermal contact with the housing, and faces away from the back box. A touch plate is atop of, and in thermal contact with, the mounting plate. The mounting plate and the touch plate combine to provide a path for conducting heat generated by the electronic circuitry away from the housing and for radiating the heat to ambient air. The mounting plate or the touch plate is made of a higher thermal conductivity material to facilitate conduction of heat away from the housing.

Abstract: The power conversion apparatus includes a housing attached to a roof of a vehicle, a heat-receiving block, and one or more heat pipes. The housing has an opening on the top in the vertical direction, and accommodates electronic components. The electronic components are attached to a first main surface, which is one of the main surfaces of the heat-receiving block. The heat-receiving block is attached to the housing and closes the opening. The one or more heat pipes are attached to a second main surface, which is the other of the main surfaces of the heat-receiving block, extend in a direction away from the heat-receiving block, and accommodate refrigerant therein.

Abstract: Apparatuses, systems, and methods are disclosed for techniques for small form factor device cooling. An apparatus includes a housing unit, a fan located within the housing unit, a plurality of inlets on the housing unit for directing air to the fan, and a plurality of exhaust ports on the housing unit for directing air away from the fan in multiple different directions.

Abstract: A magnet mount assembly is provided for quickly mounting and releasing the portable electronic device to various objects, including stands, clamps and/or holders (i.e., support mount) to support the portable electronic device in elevated positions at a variety of angles. The magnet mount assembly may attach to the back of the temperature control device or electronics case or to the back of the portable devices by, for example, connecting to the universal mount. The mount may further include pong pins or other electrical connectors for supplying power and/or data to the cooling mount and/portable electronic device when the magnet mount assembly.

Abstract: A modular data center includes: a modular information technology component (MITC), in which the MITC comprises a cooling distribution unit (CDU), a floor, a bottom cooling distribution unit mounting component (CDUMC), a modular over-rack component (MORC), and a top CDUMC, in which the floor comprises a floor track apparatus (FTA), in which the bottom CDUMC affixes the CDU to the FTA, in which the top CDUMC affixes the CDU to the MORC, in which the top CDUMC provides air containment with an internal environment of the MITC; and a modular environmental control component (MECC), in which the MECC comprises a plurality of environmental control components (ECCs) and built-in airflow connection components, in which the built-in airflow connection components remove and supply air to the MITC.

Abstract: An electronic cooling assembly includes a heat-generating electronic component and a fan. In some examples the fan includes a housing defining an internal volume, the housing thermally coupled to the heat-generating electronic component, and a plurality of blades disposed in the internal volume. In some examples, the fan housing is thermally coupled directly to the heat-generating component via a thermal paste disposed between the heat-generating component and the housing.

Abstract: An electromagnetic induction charging device for an inductive, in particular contactless, charging of an at least partially electrified motor vehicle with electrical energy, with a housing, formed in a pot-like manner, which comprises a pot base and a pot collar, wherein the pot collar facing away from the pot base surrounds a pot opening, and with a thermally conductive cover which covers the pot opening and with an electromagnetic resonator arranged in the housing interior, wherein the housing includes a thermal insulation which is arranged at the pot collar and at the pot base for the thermal insulating of the housing interior with respect to the external environment.

Abstract: An electronic apparatus includes a retractable module, a flexible module, and a control module. The retractable module includes a first retractable structure and a second retractable structure that are connected to each other. The flexible module includes a vibration film and a one-way valve connected to the vibration film. The vibration film includes a first state and a second state. The control module is configured to control the vibration film to enter the second state from the first state in response to the first retractable structure being away from the second retractable structure and perform heat dissipation on the electronic apparatus through the vibration film and the one-way valve in the second state.

Abstract: An electrical device according to the present disclosure includes a heat generator, a heat dissipator, a thermal conductive sheet, and a thermal conductive fluid. The heat generator has a first surface. The heat dissipator has a second surface that faces the first surface. The thermal conductive sheet and the thermal conductive fluid are both interposed between the first surface and the second surface. The first surface and the second surface face each other in their respective counter regions. Each of the counter regions includes a first region and a second region when viewed in a direction in which the first and second surfaces face each other. The first region holds the thermal conductive fluid but does not receive the thermal conductive sheet. The second region is adjacent to the first region and receives the thermal conductive sheet.

Abstract: A better power output device is provided. A charging and power supply device having a power source in a housing, wherein the housing has USB power output terminals to which a load that receives DC output power is connected, AC power output terminals to which a load that receives AC output power is connected, a USB switch that receives an instruction from a user to output power from the USB power output terminals, and an AC switch that receives an instruction from the user to output power from the AC power output terminals, and the USB switch and the AC switch are disposed so as to match the arrangement order of the USB electric power output terminals and the AC electric power output terminals in the arrangement direction of the USB power output terminals and the AC power output terminals.

Abstract: A printed circuit board assembly comprises: a printed circuit board (PCB); an integrated circuit (IC) package that is mounted on the PCB and includes a first surface and a bare IC die disposed on the first surface; and a vapor chamber coupled to the first surface of the IC package.

Abstract: A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

Abstract: An information handling system may include a motherboard, an information handling resource, a heat spreader thermally coupled to the information handling resource, and a load plate mechanically coupled to the motherboard in order to maintain electrical and mechanical coupling of the information handling resource to the motherboard. The load plate may include a body at least partially overlapping with and mechanically coupled to the heat spreader when the load plate is mechanically coupled to the motherboard, an opening formed within the body and configured to expose the heat spreader through the opening when the load plate is mechanically coupled to the motherboard, and an angled feature formed at one edge of a perimeter of the opening and decreasing in depth from the opening to the body.

Abstract: An information handling system (IHS) includes an ion emitter/collector blower cooling system including an ion emitter and an ion collector, the ion emitter/collector blower system being placed at a location within a chassis of the IHS vertically lower than the hardware processor in the chassis. The IHS includes an ionic driving circuit operatively coupled to the ion emitter via a high voltage to ionize gases within the ion emitter/collector blower housing and create charged ions that generate an airflow along a voltage field to and through an ion collector.