Abstract: A cage for receiving a pluggable module comprises a plurality of plates including a lower plate, an upper plate, a left side plate disposed between the lower plate and the upper plate, and a right side plate disposed between the lower plate and the upper plate opposite the left side plate. A bay is defined by the plurality of plate and is sized to receive a pluggable module. The cage further includes one or more cooling interface modules. Each cooling interface module of the one or more cooling interface modules comprises a gap pad and a protective cover and is disposed such that the gap pad is adjacent to a given plate of the plurality of plates and the protective cover is adjacent to the bay.

Abstract: An electronic assembly has a circuit board and two or more heat sinks arranged on the printed circuit board, each having a straight air duct section from an air inlet opening of the heat sink to an air outlet opening of the heat sink. The heat sinks are spaced apart from each other one behind another in a row by intervening spaces, with their air duct sections lying in a straight line and forming an air duct. Through-hole-mounted THT components, which in each case rest against an outside surface of one of the heat sinks, have connecting pins secured in the printed circuit board. A fan generates an air stream that enters the air inlet opening of the heat sink that is located at the beginning of the row and flows through the air duct.

Abstract: For increasing the operational reliability of a system component such as a light source unit or a camera control unit of a visualization system, waste heat produced by at least one heat source, which is arranged in an interior of the system component that is closed off to the outside, preferably so as to be air-tight, is transported by a cooling line, which is arranged in the interior and is filled with coolant, and/or by using an internal air circulation effected with appropriately, to a primary heat sink arranged in the interior, and the waste heat is then released from the interior to the outside through the primary heat sink using heat conduction. An efficient cooling of the at least one heat source can be achieved thereby; in addition, the heat source remains largely protected from external ambient influences, in particular it remains protected against dust.

Abstract: A thermal exchange device including a sliding plate and a thermal exchange unit is provided. The sliding plate includes a plate-shaped body, a first flange and a second flange. The first flange, protruding from a first side of the plate-shaped body, has a guide slit including a first section, a second section and a guide slit connecting the two sections. The first section, extending in a direction parallel to a long axis of the plate-shaped body, is separated from the first side by a first distance. The second section, extending to the said direction, is separated from the first side by a second distance greater than the first distance. The second flange, protruding from a second side of the plate-shaped body, defines a slide groove with the first flange and the plate-shaped body. The thermal exchange unit, at least partly received in the slide groove, includes a guide rod.

Abstract: The systems, methods, and devices disclosed herein relate to a multi-layer structures arranged in a vertically orientation. In some embodiments, a computing assembly can include a first cooling system, a first electronics layer, a second cooling system, and a second electronics layer. The first cooling system can be disposed on top of and can be in thermal communication with the first electronics layer. The first electronics layer array includes an array of integrated circuit dies that are in electronic communication with each other in a plane that is orthogonal to power delivery. The first electronics layer can be disposed on top of and can be in thermal communication with the second cooling system, and the second cooling system can be disposed on top of and can be in thermal communication with the second electronics layer. The second electronics layer includes an array of power delivery modules. In some embodiments, at least one layer can use system on wafer packaging.

Abstract: A disclosed server liquid cooling system includes a chassis coolant manifold housed in a base portion of a chassis below a PCB of the chassis. The chassis coolant manifold is adapted to cool server hardware on the PCB by circulating a liquid coolant throughout channels below the PCB between a coolant inlet and a coolant outlet.

Abstract: An electrical junction box includes a heat generating component (a relay and a bus bar) and a cooling unit that cools the heat generating component. The cooling unit includes: a metal cooling plate; a heat transfer member having insulating properties and intervening between the bus bar of the heat generating component and the metal cooling plate; and a spacer having insulating properties, being in contact with the bus bar of the heat generating component and the metal cooling plate, and maintaining a predetermined interval between the heat generating component and the metal cooling plate.

Abstract: An electronic device is provided. The electronic device includes a base plate, a first component disposed on the base plate, a second component which is disposed on the base plate and provided at a position spaced apart from the first component, an interposer which is connected to the base plate and surrounds the first component and the second component, a cover plate including a cover plate body which is connected to the interposer and covers the first component and the second component, and a cover hole which is formed to penetrate the cover plate body, and a heat dissipation plate including a heat dissipation plate body which is disposed on the cover plate body and faces the first component and the second component, a heat dissipation hole which is formed to penetrate the heat dissipation plate body and communicates with the cover hole, and a flow guide which is formed on the heat dissipation plate body and guides the flow of a thermal interface material.

Abstract: A voltage transformer switch assembly (VTSA) including a voltage transformer disconnect switch (VTDS) for a utility metering section of a medium voltage switchgear, is provided. The VTDS includes one switch blade for each phase of a voltage transformer switch input bus. Upper and lower clips allow a tight connection to the switch blades for connecting the VTDS to a main bus or a ground bus. A switch handle operates the VTDS via a drive system. An upper fuse clip bus is connected to the VTDS in a connected ON position using braided copper elements or fuse clips. The fuse clips installed on upper and lower fuse clip buses allow a convenient installation of fuses of a voltage transformer. The VTSA is adapted for a low current rating and multiple voltage ratings. The VTSA is disposed in an enclosure that meets multiple electrical enclosure requirements and that withstands stringent rain tests.

Abstract: A wireless communication apparatus is disclosed. According to at least one embodiment of the present disclosure, a wireless communication apparatus including a main case; a random disposed on a front surface of the main case and forming an accommodation space therein; a heat dissipation portion disposed at a rear surface of the random; an upper screen disposed in contact with a rear end of an upper surface of the main case and having a plurality of first through holes formed therein; and a cover portion disposed on a rear surface of the main case, configured to be opened and closed, and having a plurality of second through holes formed therein.

Abstract: A thermal conductive element includes a thermal conductive sheet and a target piece. The target piece is configured to be disposed in a target area of the thermal conductive sheet, and the target piece makes a target part of the thermal conductive sheet deform to form a first protrusion.

Abstract: A cooling system, a microstructure, and a two-phase heat dissipation method are disclosed. The heating surface, including a plurality of protrusions; wherein an inter-protrusion gap and an interstitial space are formed between the plurality of protrusions; wherein a coolant vapor is formed within the inter-protrusion gap, driven toward the interstitial space, and drifts out from the interstitial space.

Abstract: An aircraft cooling system comprises an evaporator, condenser, an accumulator, and a pump system. The evaporator is configured to cool a set of heat loads in an aircraft using a liquid. The liquid forms a vapor in response to cooling the set of heat loads. The condenser is configured to receive the vapor from the evaporator and cool the vapor in which cooling the vapor forms the liquid. The accumulator is configured to receive the liquid from the condenser and store the liquid. The pump system is configured to pump the liquid stored in the accumulator to the evaporator.

Abstract: Disclosed are embodiments for a fan assembly that includes: a housing, the housing defines a fan chamber; a base member including a first metallic layer located on a first side of the base member, a second metallic layer located on a second side of the base member, a channel extending through the base member, the channel places the first side in fluid communication with the second side, and the second metallic layer is joined to the first metallic layer; and a fan, the fan is coupled to the base member adjacent the second side at the channel.

Abstract: A liquid level height detection mechanism and a computing device are provided. The liquid level height detection mechanism includes a first mounting bracket and a first detection member mounted on the first mounting bracket, and the first detection assembly being configured to detect a first height of a liquid level of coolant; a second detection assembly comprising a second mounting bracket and a second detection member mounted on the second mounting bracket, and the second detection assembly being configured to detect a second height of the liquid level of the coolant; and a distance adjusting base, wherein the first mounting bracket and the second mounting bracket are both movably mounted on the distance adjusting base, and the first detection assembly is located higher than the second detection assembly.

Abstract: The invention relates to a housing assembly based on polycarbonate material, of which at least the front cover and the back cover are easily recyclable due to its separability into different parts for all components which are attached to the front cover or the back cover and which cannot be recycled together with the front cover or the back cover, respectively. Snap-fits, interference-fits, predetermined breaking points and other means are used for an easily detachable, but for use safe connection of the single parts.

Abstract: A cooling system for cooling electronic devices has a fluid tank with a coolant fluid having a fluid level within the fluid tank, a fluid inlet adjacent to the bottom surface of the fluid tank, and a fluid outlet spaced from the fluid inlet. The fluid inlet and the fluid outlet are in fluid communication through a flow path. A baffle is disposed between the fluid inlet and the fluid outlet. A top of the baffle is below the fluid level of the coolant fluid. A plurality of electronic devices are positioned within the fluid tank, wherein: the plurality of electronic devices are submerged within the coolant fluid; and the plurality of electronic devices engage the baffle to define parallel channels that extend vertically along a portion of the flow path such the coolant fluid cools the plurality of electronic devices.

Abstract: A power supply device includes a control board disposed within the chassis. An input connector and an output connector are disposed within the chassis and are electrically connected to the control board. A fan module includes a fan frame and a fan connector disposed on the outer surface of the fan frame. A flexible printed circuit board includes a conducting section, a fan connecting section and a lighting connecting section. The conducting section is electrically connected to the control board, fan connecting section and the lighting connecting section. The fan connecting section is electrically connected to the fan connector. The light-guiding handle is coupled to the chassis and disposed on the lighting connecting section to face the light-guiding handle.

Abstract: Provided is an electronic control device having satisfactory assembly workability capable of efficiently and reliably performing a fitting work of a fan-side connector to a substrate-side connector in a facilitated manner without increasing a number of components or causing a failure, such as a poor fitting (poor electrical connection). The base housing 20 is provided with a wiring passage 30 including a wiring housing groove 31 and a through-hole 35 for routing the fan-side connector 50 with a fan wiring 28 from a front surface side to a back surface side, and provided with a connector holding guide portion 40 to which the fan-side connector 50 after passing through the through-hole 35 is fitted from the back surface side and held.

Abstract: An electronic display includes a housing and a display panel having a display surface that is visible through the housing. An inlet is provided to allow external air into the housing and an outlet is provided to allow external air out of the housing. There is a closable vent at the inlet or outlet and a temperature sensor. A controller is arranged to control opening and closing of the vent in response to the output of the temperature sensor.