Patents Examined by Michael A Matey
  • Patent number: 11889640
    Abstract: According to various embodiments of the disclosure, an electronic device may comprise: a foldable housing including a hinge structure comprising a hinge, a first housing connected to the hinge structure and including a first surface and a second surface spaced apart from the first surface and inclined at a first angle with respect to the first surface and a second housing connected to the hinge structure and including a third surface and a fourth surface spaced apart from the third surface, wherein in a folded state, the first surface faces the third surface and, in a fully unfolded state, a direction in which the first surface faces is identical to a direction in which the third surface faces, a first support disposed in the first housing and including a fifth surface inclined at a second angle different from the first angle with respect to the first surface, a first battery disposed on the fifth surface, and a display including a display panel extending from the first surface to the third surface and a disp
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: January 30, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woosung Chun, Soojung Kim, Joon Heo, Hyunju Hong
  • Patent number: 11882644
    Abstract: A cooling device for improving the cooling of computing devices in a data center is disclosed. The cooling device comprises an air deflector that is configured to be attached to a hot aisle air barrier at an angle to direct computing device exhaust air toward the nearest hot aisle exhaust vent. The device may comprise a mounting mechanism for fixing the air deflector in position, such as eyelets or clips that attach to the computing device's exhaust fan grille. The air deflector may be rotatable so that the angle between the hot aisle air barrier and the air deflector may be adjusted. The cooling device may further comprise a visual air flow indicator to assist in positioning of the air deflector and airflow monitoring.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: January 23, 2024
    Assignee: Core Scientific Operating Company
    Inventor: Lawrence Kom
  • Patent number: 11880248
    Abstract: A docking station for secondary external cooling for mobile computing devices, including: one or more ports for docking a mobile computing device; a docking platform for supporting the mobile computing device; a cooling element; and a thermal interface housed in the docking platform for transferring heat between the mobile computing device and the cooling element.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: January 23, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Christopher M. Jaggers, Christopher M. Helberg
  • Patent number: 11871549
    Abstract: Provided is a heat conduction mechanism including: a first member including at least one heat source; a second member including a heat dissipation element, the second member displaceable with respect to the first member; and a heat conductive sheet that transfers heat of the heat source to the heat dissipation element, in which a protective sheet is provided to a portion of the heat conductive sheet that can be in contact with at least a part of the first member or the second member.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: January 9, 2024
    Assignee: SONY GROUP CORPORATION
    Inventor: Hiroto Yamada
  • Patent number: 11867366
    Abstract: An LED module may include at least one LED and an indicator. The indicator may include one or more diffusing surfaces defining an angular diffusing groove. The diffusing groove may receive the LED such that the LED is at least partially located within a volume space defined by the one or more diffusing surfaces. The diffusing groove may diffuse a light emitted from the LED and incident on the one or more diffusing surface of the diffusing groove such that the light is diffused into an interior of the indicator.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: January 9, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seongyun Baek, Jaehong Park, Yusuf Cinar, Hanhong Lee
  • Patent number: 11871542
    Abstract: A user device that can be touched by a user includes a heat source that can generate heat; a case body covering the heat source; and a polymer-containing heat storage body attached to the case body.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: January 9, 2024
    Inventors: Tsuyoshi Morimoto, Naoki Furukawa, Atsuko Sano, Hiroshi Yokota
  • Patent number: 11864344
    Abstract: A computing device chassis for a common cooling solution for die packages comprising: a chassis base comprising: an internal cavity; a cooling element housed in the internal cavity; and one or more thermal interfaces to the cooling element.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: January 2, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventor: Christopher M. Jaggers
  • Patent number: 11864332
    Abstract: Disclosed are a control box and a display device including the same. The control box includes a case providing an inner accommodation space and having an opening formed in the upper surface thereof, a first plate supported by the lower surface of the case, a second plate located on the first plate so as to be spaced apart from the first plate, a third plate located on the second plate so as to be spaced apart from the second plate, a rotary plate covering the opening in the case and rotatably mounted to the third plate, and a transceiver located inside the case and coupled to the rotary plate. The display device includes a head including a display panel, and the head exchanges information with the transceiver.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: January 2, 2024
    Assignee: LG ELECTRONICS INC.
    Inventors: Gihyung Lee, Sangmoon Hwang, Joonsub Bae, Seokwoo Kwon, Yonghan Kim
  • Patent number: 11860462
    Abstract: An electronic display assembly and a double-sided display are provided. The electronic display assembly comprises a case with an opening, a display panel, an air-interchange device and a flow generator. The air-interchange device is arranged in the opening of the case. The flow generator generates airflow through a pathway within the case. The direction of a first portion of the pathway near the air-interchange device is not parallel to a normal of the opening.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: January 2, 2024
    Assignee: DYNASCAN TECHNOLOGY CORP.
    Inventors: Tsun-I Wang, Ching-Chun Wu, Chia-Liang Yang
  • Patent number: 11846994
    Abstract: According to one embodiment, an electronic device includes a housing unit including a surface at least on a side on which the housing unit is placed, the housing unit including an attachment portion, the attachment portion including a groove and a protrusion, and a support unit that supports the housing unit. The support unit is provided continuously from one end side to the other end side of the surface. Rigidity of an intermediate portion located between the one end side and the other end side is made lower than rigidity of both end portions on the one end side and the other end side by making a protrusion length of the protrusion at the intermediate portion shorter than a protrusion length of the protrusion at both the end portions.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: December 19, 2023
    Assignee: Dynabook Inc.
    Inventor: Tomomi Murayama
  • Patent number: 11847003
    Abstract: A folding device and a heat dissipation apparatus, where the folding device includes a heat collection element, including a heat collection plate and a first shaft sleeve, where a first end of the heat collection plate is in contact with a heat source in a first folding part, and a second end of the heat collection plate is coupled to an outer wall of the first shaft sleeve, the first shaft sleeve is sleeved on a rotating shaft, and a third end of the cooling element is in contact with the rotating shaft, and a fourth end of the cooling element is in contact with a heat dissipation device in a second folding part.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: December 19, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Guo Yang, Tao Huang, Wenming Shi, Teng Long, Wei Li, Jianliang Wang, Zhiguo Zhang
  • Patent number: 11836020
    Abstract: A temperature regulating mount for portable electronic devices is provided that includes a temperature control unit for preventing portable electronic devices from reaching critical temperatures during operation to avoid undesired shut down of the electronic device. The mount is further accompanied by a protective perimeter casing for protecting the electronic device and allowing the device to mate with a universal mount. The perimeter casing leaves the back of the device open or exposed (e.g., through webbing) for temperature control. The protective perimeter casing includes grooves and indents for mating with guide rails and a movable clamping mechanism for securing the electronic device to the mount in a particular orientation to maximize the mount's ability to regulate the temperature of the electronic device.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: December 5, 2023
    Inventor: Darren Saravis
  • Patent number: 11829214
    Abstract: The description relates to devices and air cooling of devices. One example can include a heat generating component positioned in a housing and a temperature-based gas separation assembly configured to receive ambient air and to separate the ambient air into warmer air that is directed outside the housing and cooler air that is directed inside the housing to cool the heat generating component.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: November 28, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Chien Lung Yang, Matthew Gen, Todd Chiles
  • Patent number: 11822810
    Abstract: In one embodiment, a network switch for an information handling system includes: a central processing unit (CPU); and a fan module removably coupled to the network switch, the fan module including: a housing having a front end and a back end; a plurality of fans disposed within the housing proximate to the back end; a memory interface disposed within the housing proximate to the front end, the memory interface communicably coupled to the CPU; a memory device disposed within the housing proximate to the memory interface, the memory device storing information associated with the networking operations and communicably coupled to the memory interface, the memory device removably coupled to the fan module.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: November 21, 2023
    Assignee: Dell Products L.P.
    Inventors: Robert Neal Beard, Colin John Montgomery, Shree Ramakrishna Rathinasamy, Padmanabhan Narayanan
  • Patent number: 11809244
    Abstract: A controller and a rectangular parallelepiped power supply apparatus are coupled to a rear surface of a midplane, to which a plurality of storage media drives are coupled in a front surface of the midplane. A plurality of interface connectors arranged in a left-right direction are provided at a front end of a controller substrate. The rear surface of the midplane includes a plurality of connectors for controller, which are a plurality of connectors arranged in the left-right direction to which interface connectors of the controller are respectively coupled, and a connector for power supply, which are connectors to which a power supply apparatus set horizontally is coupled. A part of a row of the connectors for controller is present below the power supply apparatus coupled sideways to the connector for power supply.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: November 7, 2023
    Assignee: HITACHI, LTD.
    Inventor: Yuichi Saigan
  • Patent number: 11809245
    Abstract: A portable electronic device with a movable door cover including a host, at least one door cover pivoted to the host to be opened or closed relative to the host, at least one linking member connected to the door cover, a shape-memory alloy (SMA) spring connected between the linking member and the host, and a heat source disposed in the host is provided. The SMA spring is affected by heat generated from the heat source to form at least two stretching states, and drives the door cover through the linking member to form at least two states including said being opened or closed.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: November 7, 2023
    Assignee: Acer Incorporated
    Inventors: Hung-Chi Chen, Shun-Bin Chen, Huei-Ting Chuang
  • Patent number: 11797058
    Abstract: An intermittent lifting assembly, configured to drive a heat dissipation panel of the mobile terminal to open and close. The intermittent lifting assembly includes: a first driving piece that includes a first intermittent gear and a convex shoulder disposed on the first intermittent gear; a second driving piece that includes a second intermittent gear engaged with the first intermittent gear, where a position-limiting slot is disposed on the second intermittent gear, the position-limiting slot is configured to limit a position in which the convex shoulder rolls when teeth of the first intermittent gear and teeth of the second intermittent gear are out of an engaged state; and a gap for avoiding the second intermittent gear is disposed on the convex shoulder; and further includes a swing rod that is fastened to the second intermittent gear and configured to drive the heat dissipation panel to open or close.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: October 24, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yangming Lin, Hehui Yang, Tao Huang
  • Patent number: 11782281
    Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: October 10, 2023
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Michael Pope, Cameron Peter Jue, Rajat Mittal, Ryan Fleming, Boyd Drew Allin
  • Patent number: 11778771
    Abstract: Embodiments for providing cooling airflow through electronic in two different directions is described. An airflow control louver system in an electronic device provides for cooling airflow to be efficiently routed through the electronic device in the two different directions which in turn allows for multiple installation configurations for electronic devices with high powered heat sensitive components.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: October 3, 2023
    Assignee: Cisco Technology, Inc.
    Inventors: Vic Hong Chia, Wei Qi, Yong Hong Luo, Hua Yang
  • Patent number: 11775034
    Abstract: A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: October 3, 2023
    Assignee: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Chun-Chieh Wang, Shu-Hao Kuo