Patents Examined by Michael P McFadden
  • Patent number: 11367570
    Abstract: A multilayer ceramic capacitor include: a ceramic body including first and second surfaces opposing each other and third and fourth surfaces connecting the first and second surfaces; a plurality of internal electrodes disposed inside the ceramic body and exposed to the first and second surfaces, the plurality internal electrodes each having one end exposed to the third or fourth surface; and first and second side margin portions disposed on sides of the internal electrodes exposed to the first and second surfaces. A dielectric composition of the first and second side margin portions is different from a dielectric composition of the ceramic body, and a dielectric constant of the first and second side margin portions is lower than a dielectric constant of the ceramic body.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: June 21, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Berm Ha Cha, Soo Kyong Jo, Hwi Dae Kim, Jong Ho Lee
  • Patent number: 11361905
    Abstract: A multilayer ceramic electronic component includes a ceramic body includes: a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes disposed to be stacked in a third direction with the dielectric layer interposed therebetween, a margin portion disposed on both surfaces of the capacitance formation portion in a second direction, and a cover portion disposed on both surfaces of the capacitance formation portion in the third direction, and; and an auxiliary electrode spaced apart from the capacitance formation portion, and disposed to be in contact with one of the first and second external electrodes. The auxiliary electrode is spaced apart from first surface and the second surface of the ceramic body in a first direction.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: June 14, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Young Jeong, Je Jung Kim
  • Patent number: 11361906
    Abstract: A multilayer ceramic electronic component includes a stacked body and external electrodes provided on two end surfaces of the stacked body. Each external electrode includes an underlying electrode layer including a conductive metal, a resin electrode layer including a resin and metal component, a resin layer including a resin and no metal component, and a metal layer. The underlying electrode layers extend from the two end surfaces to cover a portion of two main surfaces and two lateral surfaces. The resin electrode layers cover the underlying electrode layers provided on the two end surfaces. The resin layers are connected to the resin electrode layers and provided on the underlying electrode layers located on a portion of the two main surfaces and two lateral surfaces. The metal layers cover the surfaces of the resin electrode layers and resin layers.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: June 14, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yasuhiro Mishima
  • Patent number: 11361904
    Abstract: A multilayer electronic component includes a body, a protrusion disposed on at least one surface of the body, and an external electrode having an electrode layer disposed on a side surface of the body and extending to be in contact with a side surface of the protrusion and a conductive resin layer disposed on the electrode layer and extending to cover a portion of the protrusion.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: June 14, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Jung Kim, Seung Ryeol Lee, Ji Won Lee
  • Patent number: 11355287
    Abstract: A multilayer capacitor and a board on which the multilayer capacitor is mounted provide increased capacitor effective area. The multilayer capacitor includes a capacitor body having first and second dielectric layers each with first and second internal electrodes, first and second external electrodes disposed on a surface of the capacitor body, a first via electrode connecting the first internal electrodes to the first external electrode, and a second via electrode connecting the second internal electrodes to the second external electrode. The first and second dielectric layers are alternately stacked in the first direction such that the first internal electrode of the first dielectric layer overlaps the second internal electrode of the second dielectric layer in a first direction, and the second internal electrode of the first dielectric layer overlaps the first internal electrode of the second dielectric layer in the first direction.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: June 7, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jong Lee, Su Bong Jang, Hee Soo Yoon
  • Patent number: 11348740
    Abstract: The present disclosure provides supercapacitors that may avoid shortcomings of current energy storage technology. Provided herein are materials and fabrication processes of such supercapacitors. In some embodiments, an electrochemical system comprising a first electrode, a second electrode, wherein at least one of the first electrode and the second electrode comprises a three dimensional porous reduced graphene oxide framework.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: May 31, 2022
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Xiangfeng Duan, Yu Huang, Benjamin Papandrea, Xu Xu
  • Patent number: 11348732
    Abstract: A capacitor component includes a body including a dielectric layer, a first electrode and a second internal electrode, laminated in a first direction, opposing each other, and a first cover portion and a second cover portion, disposed on outermost surfaces of the first and second internal electrodes, each having a thickness of 25 ?m or less, a first electrode layer and a second electrode layer, respectively disposed on both external surfaces of the body in a second direction perpendicular to the first direction and respectively, and plating layers, respectively disposed on the first and second electrode layers. A metal oxide is disposed on a boundary between the first electrode layer and the plating layer and a boundary between the second electrode layer and the plating layer.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: May 31, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
  • Patent number: 11347270
    Abstract: A sturdy electronic device is provided. A reliable electronic device is provided. A novel electronic device is provided. An electronic device includes a first board, a second board, a display portion having flexibility, and a power storage device having flexibility. The first board and the second board face each other. The display portion and the power storage device are provided between the first board and the second board. The display portion includes a first surface facing the power storage device. The first surface includes a first region not fixed to the power storage device. The first region overlaps with a display region of the display portion.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: May 31, 2022
    Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
    Inventor: Masaaki Hiroki
  • Patent number: 11342125
    Abstract: A chip component includes a substrate that has a first surface and a second surface on a side opposite to the first surface, a plurality of wall portions that are formed on a side of the first surface by using a part of the substrate, that have one end portion and one other end portion, and that are formed of a plurality of pillar units, a support portion that is formed around the wall portions by using a part of the substrate and that is connected to at least one of the end portion and the other end portion of the wall portions, and a capacitor portion formed by following a surface of the wall portion, in which each of the pillar units includes a central portion and three convex portions that extend from the central portion in three mutually different directions in a plan view and in which the wall portion is formed by a connection between the convex portions of the pillar units that adjoin each other.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: May 24, 2022
    Assignee: ROHM CO., LTD.
    Inventor: Keisuke Fukae
  • Patent number: 11342123
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and an external electrode formed outside the ceramic body. The external electrode includes an electrode layer, and a thickness T1 of the electrode layer corresponding to a central region of the ceramic body in a thickness direction is 5 ?m or more and 30 ?m or less, a thickness T2 of the electrode layer corresponding to a region in which an outermost internal electrode is located is 5 ?m or more and 15 ?m or less, and a thickness T3 of the electrode layer corresponding to a corner portion of the ceramic body is 0.1 ?m or more and 10 ?m or less.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: May 24, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Jin Soo Park, Ji Hong Jo, Myung Jun Park, Hyun Hee Gu, Jong Ho Lee
  • Patent number: 11342137
    Abstract: A system and method for connecting supply power to motor control components includes use of a motor control center subunit with moveable supply power contacts. After a motor control center subunit is secured into a motor control center compartment, the supply power contacts may be advanced to engage supply power buses. For disconnection, the supply power contacts may be retracted and isolated from the buses before physical removal of the subunit.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: May 24, 2022
    Assignee: Eaton Intelligent Power Limited
    Inventors: Edgar Yee, Robert A. Morris, Scott E. McPherren, Neal Edward Rowe
  • Patent number: 11342118
    Abstract: A multilayer ceramic capacitor includes a laminated body including a plurality of dielectric layers and a plurality of internal electrodes that are alternately laminated, and a first external electrode and a second external electrode provided on the surface of the laminated body. The first external electrode is provided on a first end surface of the laminated body, and extends from the first end surface of the laminated body to form a portion of the first side surface and a portion of the second side surface. The plurality of internal electrodes includes a first internal electrode and a second internal electrode. The first internal electrode is exposed at the first side surface and the second side surface of the laminated body and electrically connected to the first external electrode, and is not exposed at the first end surface of the laminated body.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: May 24, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kenichi Togou, Shinsuke Uchida
  • Patent number: 11335505
    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer, a solder plating layer arranged to constitute an outermost layer of the external electrode, and an intermediate plating layer disposed between the conductive resin layer and the solder plating layer. The intermediate plating layer has better solder leach resistance than metal contained in the conductive resin layer. An opening is formed in the intermediate plating layer. The solder plating layer is formed on the conductive resin layer through the opening.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: May 17, 2022
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Yuichi Nagai
  • Patent number: 11328871
    Abstract: A composite electronic component includes a composite body including a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body and first and second external electrodes, and the ceramic chip is disposed below the multilayer ceramic capacitor and includes a second ceramic body having first and second terminal electrodes. The multilayer ceramic capacitor and the ceramic chip are coupled by solder disposed between the first and second external electrodes and the first and second terminal electrodes, and each angle (?) defined by inner side surfaces of the solder, respectively disposed on inner ends of bent portions of the first and second terminal electrodes disposed on an upper surface of the second ceramic body, and an upper plane of the second ceramic body of the ceramic chip satisfies 45 degrees or less.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: May 10, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Soo Hwan Son
  • Patent number: 11328867
    Abstract: A multilayer capacitor includes a capacitor body including first and second dielectric layers, a plurality of internal electrodes, and a plurality of second internal electrodes, and first and second external electrodes. First and second internal electrodes are disposed in one of the first dielectric layers to be spaced apart from each other. The first and second internal electrodes are disposed in one of the second dielectric layers to be spaced apart from each other. The first and second dielectric layers are alternately laminated in the first direction, such that the first internal electrode of the first dielectric layer and the second internal electrode of the second dielectric layer overlap each other in the first direction and the second internal electrode of the first dielectric layer and the first internal electrode of the second dielectric layer overlap each other in the first direction.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: May 10, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jong Lee, Su Bong Jang, Hee Soo Yoon
  • Patent number: 11322302
    Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween, and an external electrode disposed on the body and connected to the internal electrodes . An end portion of at least one of the internal electrodes in a longitudinal direction of the body is thicker than a central portion of the internal electrode, and a ratio t2/t1 of a thickness t2 of the end portion to a thickness t1 of the central portion satisfies 1.1?t2/t1?1.5.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: May 3, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Suji Kang, Yuhong Oh, Byung Kun Kim, Yun Hee Kim, Min Jung Cho
  • Patent number: 11322306
    Abstract: A composite electronic component includes a composite body including a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which dielectric layers and internal electrodes disposed to face each other with one of the dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on opposite end portions of the first ceramic body, respectively. The ceramic chip is disposed below the multilayer ceramic capacitor, and includes a second ceramic body including ceramic and first and second terminal electrodes disposed on opposite end portions of the second ceramic body, respectively, and connected to the first and second external electrodes, respectively. A ratio (T1/T2) of a thickness (T1) of the multilayer ceramic capacitor to a thickness (T2) of the ceramic chip satisfies 1.6?(T1/T2)?3.5.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: May 3, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Soo Hwan Son
  • Patent number: 11315735
    Abstract: Provided is a multilayer capacitor and a board on which the multilayer capacitor is mounted. The multilayer capacitor includes a capacitor body including first to six surfaces, first and second dielectric layers, and first and second internal electrodes; first and second external electrodes disposed on the first surface of the capacitor body; the first and second dielectric layers are alternately layered in a first direction such that the first internal electrode of the first dielectric layer overlaps the second internal electrode of the second dielectric layer in the first direction, and the second internal electrode of the first dielectric layer overlaps the first internal electrode of the second dielectric layer in the first direction.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: April 26, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jong Lee, Su Bong Jang, Hee Soo Yoon
  • Patent number: 11315734
    Abstract: A multilayer ceramic capacitor includes a capacitive element including ceramic layers and internal electrodes, and external electrodes on the capacitive element. The external electrodes include a Ni underlying electrode layer mainly made of Ni, a Cu plating electrode layer, and at least one second plating electrode layer. The Cu plating electrode layer includes a Ni diffused Cu plating electrode layer on a side closer to the Ni underlying electrode layer and including Ni diffused therein and a non-Ni diffused Cu plating electrode layer on a side closer to the second plating electrode layer and not including Ni diffused therein. The Cu plating electrode layer has a thickness of about 3 ?m or more and about 12 ?m or less and the non-Ni diffused Cu plating electrode layer has a thickness of about 0.5 ?m or more.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: April 26, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Taisuke Kanzaki, Satoshi Muramatsu, Kosuke Onishi
  • Patent number: 11315737
    Abstract: A multilayer ceramic capacitor includes a multilayer body and outer electrodes. The multilayer body includes first and second multilayer ceramic structures and an intermediate body between the first and second multilayer ceramic structures, first to fourth connection electrodes electrically connecting first inner electrodes, second inner electrodes, third inner electrodes, and fourth inner electrodes, respectively, a first connection wire electrically connecting the first connection electrode and one of the third connection electrode and the fourth connection electrode, and a second connection wire electrically connecting the second connection electrode and the other connection electrode. A current route from the first connection electrode via the first connection wire to the one connection electrode and a current route from the second connection electrode via the second connection wire to the other connection electrode have different lengths.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: April 26, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Hirao, Fumio Naruse, Tomohiro Kageyama