Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.

Abstract: A display device that includes a housing with at least one Printed Circuit Board (PCB) and a plurality of rollers disposed in the housing. The display device also includes a display unit which, in turn, includes a display panel and a module cover. The display device further includes a driving unit that is connected to the display panel and the module cover. The driving unit moves the display panel and the module cover between a first state and a second state. In the first state, the panel and module cover are wound around at least one of the plurality of rollers, and in the second state they are unwound from the at least one of the plurality of rollers and exposed by being drawn out from the housing.

Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).

Abstract: A multilayer ceramic capacitor includes first dielectric ceramic layers each with a thickness of about 0.48 ?m or more and about 0.50 ?m or less in the lamination direction, and additional dielectric ceramic layers each with a thickness of about 10 ?m or more and about 15 ?m or less in the width direction. A number of dielectric particles in each first dielectric ceramic layer in a thickness direction is three or more and six or less. A number of dielectric particles in each additional dielectric ceramic layer in a thickness direction is 100 or more and 150 or less. When the number of dielectric particles in each of first dielectric ceramic layer is NT, and the number of dielectric particles in each additional dielectric ceramic layer is NW, a ratio of NT to NW is about 1:23.08 or more and about 1:46.15 or less.

Abstract: A ceramic electronic component includes an element body, and first and second external electrodes formed on the element body. The element body has a dielectric, and first and second internal electrodes. The first external electrode includes a first base layer formed on the element body. The first base layer is connected to the first internal electrode and an edge of the first baser layer is present on a first surface of the element body. The first external electrode also includes a first plating layer formed on the first base layer. An edge of the first plating layer is present on the first surface of the element body at a position different from a position of the edge of the first base layer in a direction perpendicular to the first surface. The second external electrode has a similar structure to the first external electrode.

Abstract: A multilayer ceramic capacitor includes a multilayer body including the dielectric ceramic layers and the internal electrode layers which are laminated, and external electrodes connected to the internal electrode layers. The multilayer body includes segregation including Si as a main component in a vicinity of an end of the internal electrode layer in a width direction. An average particle size of the dielectric particles in the vicinity of the end of the internal electrode layer in the width direction in the dielectric ceramic layer is smaller than an average particle size of a dielectric particles in a central portion of the internal electrode layer in the width direction in the dielectric ceramic layer.

Abstract: A multilayer ceramic capacitor include: a ceramic body including first and second surfaces opposing each other and third and fourth surfaces connecting the first and second surfaces; a plurality of internal electrodes disposed inside the ceramic body and exposed to the first and second surfaces, the plurality internal electrodes each having one end exposed to the third or fourth surface; and first and second side margin portions disposed on sides of the internal electrodes exposed to the first and second surfaces. A dielectric composition of the first and second side margin portions is different from a dielectric composition of the ceramic body, and a dielectric constant of the first and second side margin portions is lower than a dielectric constant of the ceramic body.

Abstract: An electronic component including a component body, and an external electrode on a surface of the component body. The external electrode includes a layer having an alloy of at least one first metal and at least one second metal, the at least one first metal is selected from the group consisting of metals of Group 9 to Group 11 of the Periodic Table, the at least one second metal has a melting point higher than that of the at least one first metal. In the layer having the alloy, a concentration of the at least one second metal continuously changes in a thickness direction of the external electrode, at least one first portion has the concentration of the at least one second metal increasing in the thickness direction, and at least one second portion has the concentration of the at least one second metal decreasing in the thickness direction.

Abstract: A multilayer ceramic capacitor includes an element body. The element body includes a stack of first internal electrode layers, dielectric layers and second internal electrode layers. The element body has a first surface and a second surface opposite the first surface. The multilayer ceramic capacitor also includes a first external electrode formed on the first surface of the element body and a second external electrode formed on the second surface of the element body. The first internal electrode layer has a first current path extending in a first plane perpendicular to the first surface such that the first current path has a shorter component on the first plane in a first direction toward the first surface than in a second direction perpendicular to the first direction. The second internal electrode layer has a second current path that possesses a similar anisotropy to the first internal electrode layer.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers which are stacked and internal electrode layers which are stacked, and external electrodes, each connected to the internal electrode layers. The external electrodes each include a conductive resin layer and a plated layer on the conductive resin layer. The conductive resin layer includes a resin portion, conductive fillers dispersed in the resin portion, and metal particles dispersed unevenly in a distribution differing from that of the conductive fillers in the conductive resin layer. An abundance ratio of the metal particles to the resin portion is higher on a side of the plated layer of the conductive resin layer than on a side of the conductive resin layer close to the multilayer body.

Abstract: In a multilayer ceramic capacitor, a proportion of a glass component in a first side surface-side base electrode layer is about 60% or more in a first range from a tip in a vicinity of a second end surface of the first side surface-side base electrode layer to a position of a length which is about 10% of a dimension in a length direction of the first side surface-side base electrode layer, and a proportion of a glass component in a second side surface-side base electrode layer is about 60% or more in a second range from a tip in a vicinity of a first end surface of the second side surface-side base electrode layer to a position of a length which is about 10% of a dimension in a length direction of the second side surface-side base electrode layer.

Abstract: A multi-layer ceramic capacitor includes: a multi-layer unit including ceramic layers laminated in a first direction and electrodes disposed between the ceramic layers, positions of end portions of the electrodes falling within a range of 0.5 ?m in a second direction; and side margins each containing manganese or magnesium and silicon and facing each other in the second direction. When each margin is equally divided into an inner region and an outer region, a total concentration of manganese and magnesium in the outer region is higher than a total concentration of manganese and magnesium in the inner region and higher than a total concentration of manganese and magnesium in the ceramic layers, and a concentration of silicon in the inner region is not less than a concentration of silicon in the outer region and higher than a concentration of silicon in the ceramic layers.

Abstract: A multilayer ceramic electronic component includes a body including a dielectric layer, first and second internal electrodes, a stacked portion including first and second surfaces opposing each other in a stacking direction of the first and second internal electrodes, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and a coating layer disposed on the first to sixth surfaces of the stacked portion and having first and second connection portions; and first and second external electrodes connected to the first and second internal electrodes, respectively, and arranged on the third and fourth surfaces of the body, wherein the first and second internal electrodes are respectively connected to the first and second external electrodes through the first and second connection portions.

Abstract: In some examples, an isolation transformer can include a first wire having a first insulation thickness and a second wire having a second insulation thickness that is different than the first insulation thickness. The isolation transformer can further include a plurality of magnetic cores of magnetic material that can be configured to surround portions of each of the first and second wires along respective circumferences of the first and second wires to provide the isolation transformer.

Abstract: A multilayer ceramic electronic component includes a multilayer capacitor including a capacitor body, and first and second external electrodes disposed on both side surfaces of the capacitor body, respectively; first and second metal frames disposed on both side surfaces and upper and lower surfaces of the multilayer capacitor; and an exterior insulating portion disposed to surround upper surfaces of the multilayer capacitor and the first and second metal frames. A shortest distance from an upper end of the exterior insulating portion to the external electrodes is defined as G1, a shortest distance from a lower end of the exterior insulating portion to the external electrodes is defined as G2, a maximum distance from upper ends of the external electrodes to lower ends is defined as T, and G1, G2, and T satisfy G1?G2?T/2.

Abstract: A multi-layer ceramic electronic component includes a multi-layer ceramic electronic component main body including a multi-layer body including stacked ceramic layers, stacked internal electrode layers, first and second main surfaces, first and second side surfaces, and first and second end surfaces, first and second external electrodes respectively on sides where the first and second end surfaces are located, and first and second metallic terminals respectively connected to the first and second external electrodes. The multi-layer ceramic electronic component main body and at least portion of the first and second metallic terminals are covered with an external material. The second main surface is connected to the metallic terminals. The first and second external electrodes cover a portion of the second main surface. A gap is provided between the multi-layer body and tips of the first and second external electrodes. The external material is in the gap.

Abstract: A multilayer electronic component includes an external electrode having a connection portion and a band portion. An organic layer is disposed between an electrode layer and a plating layer of the band portion of the external electrode, and a conductive resin layer is disposed between the electrode layer and the plating layer of the connection portion of the external electrode.

Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated, and external electrodes at two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface of the capacitor main body, and opposed and spaced apart from each other. The two interposers each include a first surface at or adjacent to the capacitor main body, and a second surface opposite to the first surface, the first and second surfaces being parallel or substantially parallel with each other, and the first surface is sloped with respect to the surface of the capacitor main body at a predetermined angle to be spaced from the surface of the capacitor main body toward a side at which the two interposers face each other.

Abstract: A multilayer ceramic electronic component includes a ceramic body includes: a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes disposed to be stacked in a third direction with the dielectric layer interposed therebetween, a margin portion disposed on both surfaces of the capacitance formation portion in a second direction, and a cover portion disposed on both surfaces of the capacitance formation portion in the third direction, and; and an auxiliary electrode spaced apart from the capacitance formation portion, and disposed to be in contact with one of the first and second external electrodes. The auxiliary electrode is spaced apart from first surface and the second surface of the ceramic body in a first direction.

Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).