Abstract: A multilayer capacitor includes: a body including a stack structure in which a first internal electrode and a second internal electrode are stacked on each other interposing a dielectric layer therebetween; and first and second external electrodes disposed on the body to be respectively connected to the first internal electrode and the second internal electrode. One of the first internal electrode and the second internal electrode includes a recess portion disposed in one surface thereof, and providing a deviation in a distance between the first and second internal electrodes, TD indicates a thickness of a portion of the dielectric layer, based on a portion positioned on the one surface and not in the recess portion, TR indicates a recession depth of a portion positioned on the one surface and recessed by the recess portion, and (TR/TD) is greater than zero and less than (½).

Abstract: A multilayer capacitor includes: a capacitor body including first and second internal electrodes alternately stacked with a dielectric layer interposed therebetween, and having first to six surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, the second internal electrode being exposed through the fourth, fifth, and sixth surfaces; first and second side portions disposed on the fifth and sixth surfaces of the capacitor body; and first and second external electrodes. The capacitor body includes upper and lower cover portions disposed on an upper surface of an uppermost internal electrode and a lower surfaces of a lowermost internal electrode, respectively, in a stacking direction of the first and second internal electrodes. The first and second side portions and the upper and lower cover portions include zirconium (Zr).

Abstract: A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers including Ba and Ti and each of a plurality of internal electrode layers including Ni and Sn are alternately stacked. A discontinuity is formed in at least one of the plurality of internal electrode layers, the discontinuity being a break in a cross section including a stacking direction of the multilayer structure. An Sn high concentration portion, of which an Sn concentration is higher than an average Sn concentration of the one of the internal electrode layers, is formed on a part of a surface of the at least one of the internal electrode layers, the part of the surface being exposed to the discontinuity.

Abstract: A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, and first to sixth surfaces, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface; first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body; first and second external electrodes; a first step-compensating portion disposed on a margin portion in a width direction on the second dielectric layer on which the second internal electrode is formed on the first internal electrode; and a second step-compensating portion disposed on another margin portion in the width direction on the first dielectric layer on which the first internal electrode is disposed on the second internal electrode.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes having the dielectric layer interposed therebetween in a first direction and external electrodes disposed on the body and connected to the internal electrodes, wherein the internal electrodes include nickel (Ni) and dysprosium (Dy) and 0.02 at %?C0?5 at % in which C0 is an atomic percentage (at %) calculated by dividing a number of atoms of Dy by a sum of a number of atoms of Ni and Dy included in the internal electrode.

Abstract: A stacked capacitor includes a body having opposing faces, first side faces in a first direction, and second side faces in a second direction. The body includes a first insulation margin without a first metal film and a second insulation margin without a second metal film. The first metal film includes a metal film edge overlapping the second insulation margin. The second metal film includes a metal film edge overlapping the first insulation margin. The first and second metal films each include multiple sub-films separated by multiple first slits. A first slit includes a first portion extending from the first or second insulation margin along the first side faces and a second portion located in the metal film edge and extending at an angle with the first side faces. The second portion has a length in the first direction greater than or equal to an interval between adjacent first slits.

Abstract: Provided are a multilayer ceramic capacitor and a board having the same, the multilayer ceramic capacitor including: a capacitor body including an active region, which includes a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with respective dielectric layers interposed therebetween, and covers formed on and under the active region, respectively. The multilayer ceramic capacitor further includes external electrodes disposed on the capacitor body so as to be connected to the internal electrodes. Among the internal electrodes, an internal electrode disposed adjacently to one of the covers has at least one cutaway portion within a portion of the internal electrode connected to the external electrode, and the cutaway portion is (at least partially) filled with a dielectric material.

Abstract: A ceramic electronic device includes a multilayer structure in which each of a plurality of internal electrode layers and each of three or more of dielectric layers of which a main component is ceramic are alternately stacked. The three or more of dielectric layers include Sn. A dielectric layer having a smaller Sn concentration is closer to an outermost end in a stacking direction than a dielectric layer having a larger Sn concentration and being located on a center side of the stacking direction, in a relationship of at least two of the three or more of dielectric layers.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers, and external electrodes electrically connected to the internal electrode layers. A difference of about 3 ?m or less exists between a maximum thickness of a center portion of the external electrode and a thickness of a peripheral portion of the external electrode, and in a range of a field of view of about 50 ?m square centered at a point located farther inward by about 15% than a peripheral end portion of the external electrode, an angle ? of about 4 degrees or less is defined by a straight line connecting two points of intersection of a surface of the external electrode and a sectional line defining the range of the field of view of about 50 ?m square and a perpendicular line to a vertical line passing through one of the two points of intersection.

Abstract: A multilayer ceramic capacitor includes first and second main surfaces opposite to each other in a thickness direction, first and second side surfaces opposite to each other in a width direction, first and second end surfaces opposite to each other in a longitudinal direction, an element body including dielectric layers and internal electrode layers stacked in the thickness direction, and a pair of external electrodes on the first and second end surfaces and electrically connected to the internal electrode layers, in which the dielectric layers include, as a main component, a perovskite oxide including barium and titanium, and the dielectric layers include an inner portion that is in contact with the internal electrode layer and includes an interface layer including a non-perovskite oxide including tin, barium, and titanium.

Abstract: The present disclosure provides supercapacitors that may avoid the shortcomings of current energy storage technology. Provided herein are supercapacitor devices, and methods of fabrication thereof comprising the manufacture or synthesis of an active material on a current collector and/or the manufacture of supercapacitor electrodes to form planar and stacked arrays of supercapacitor electrodes and devices. Prototype supercapacitors disclosed herein may exhibit improved performance compared to commercial supercapacitors. Additionally, the present disclosure provides a simple, yet versatile technique for the fabrication of supercapacitors through masking and etching.

Abstract: A coil component includes a body, a support substrate embedded in the body and having one end surface exposed to an external surface of the body, a coil portion disposed on the support substrate to be embedded in the body and having one end portion exposed to the external surface of the body together with the one end surface of the support substrate, and an external electrode disposed on the external surface of the body to be connected to the one end portion of the coil portion. The external electrode has an opening exposing at least a portion of the one end surface of the support substrate.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes and external electrodes disposed on the body and connected to the internal electrodes, wherein the external electrodes include a first electrode layer disposed on the body and including Cu and glass, a second electrode layer disposed on the first electrode layer and including Ni and Cu, and a third electrode layer disposed on the second electrode layer and including Ni and glass.

Abstract: A dielectric composition includes a main phase and segregation phases each including RE (at least one rare earth element). The main phase includes a main component having a perovskite crystal structure of ABO3 (A is one or more selected from Ba, Sr, and Ca, and B is one or more selected from Ti, Zr, and Hf). The segregation phases are classified into first segregation phases whose atomic ratio of Si to RE is 0 or more and 0.20 or less and second segregation phases whose atomic ratio of Si to the RE is more than 0.20. 0?S1/S2?0.10 is satisfied on a cross section of the dielectric composition, where S1 is an area ratio of the first segregation phases, and S2 is an area ratio of the second segregation phases. An atomic ratio of Si to RE in the second segregation phases is 0.80 or less on average.

Abstract: A dielectric ceramic composition that contains an oxide of A, R, and B and an oxide of Mn. The A is at least one selected from the group consisting of K and Na. The R is at least one selected from the group consisting of La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and Sc. The B is at least one selected from the group consisting of Nb and Ta. The molar ratio of the A:R:B:Mn is 2?x:1+x/3:5+y:z. The x, y, and z satisfy ?0.3?x?0.6, ?0.5?y?0.5, and 0.001?z?0.5, respectively.

Abstract: A ceramic electronic component includes a body including a dielectric layer and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a grain boundary disposed between adjacent grains, and GB1/G1 is 5 or more in mass ratio, where G1 is a content of Si of one of the plurality of grains and GB1 is a content of Si of the grain boundary.

Abstract: A multilayer ceramic capacitor includes a multilayer body, a first outer electrode on a first main surface closer to a first end surface, a second outer electrode on the first main surface closer to a second end surface, a third outer electrode on the first main surface between the first outer electrode and the second outer electrode, a first inner electrode layer connected to the first outer electrode and the second outer electrode via a first lead electrode and a second lead electrode, and a second inner electrode layer connected to the third outer electrode via a third lead electrode. When a length of the first lead electrode and a length of the second lead electrode in the length direction are each denoted by a, and a length of the third lead electrode in the length direction is denoted by b, b/a is about 0.5 to about 0.83.

Abstract: A broadband multilayer ceramic capacitor can include at least one active electrode layer including a first active electrode and a second active electrode. The first active electrode can have a central portion extending away from a base portion in a longitudinal direction. The second active electrode can include at least one arm extending away from a base portion towards the first end and overlapping the central portion of the first active electrode. A first shield electrode in a shield electrode region can have a central portion extending from a base portion. A second shield electrode can include an arm overlapping the central portion of the first shield electrode in the longitudinal direction. The shield electrode region can be spaced apart from the active electrode region by a shield-to-active distance that is greater than an active electrode spacing distance between respective active electrodes of the plurality of active electrodes.

Abstract: An electronic component includes an element body having a functional layer and an internal electrode layer, and an external electrode formed on a surface of the element body and connected to the internal electrode layer electrically. The chlorine concentration of the element body of the electronic component is 10 ppm or less.

Abstract: A ceramic electronic device includes an element body and an external electrode. The element body is formed by laminating a ceramic layer and an internal electrode layer. The external electrode is electrically connected to at least one end of the internal electrode layer. At least a part of a joint boundary between the electrode layer and the ceramic layer includes an interface protrusion on the external electrode side. The interface protrusion is made of an oxide.