Patents Examined by Michael P McFadden
  • Patent number: 11721488
    Abstract: A multilayer ceramic capacitor is disclosed including a first external terminal disposed along a first end of the capacitor, a second external terminal disposed along a second end of the capacitor opposite the first end, an active electrode region containing alternating dielectric layers and active electrode layers, and a shield electrode region including at least two shield electrodes that are spaced apart by a shield layer gap in the longitudinal direction. The distance from the active electrode region to the shield electrode region may range from about 4% to about 20% of a thickness of the capacitor between a top surface and a bottom surface opposing the top surface. The shield layer gap may range from about 3% to about 60% of an external terminal gap between the first external terminal and second external terminal in the longitudinal direction on at least one of the top or bottom surfaces.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: August 8, 2023
    Assignee: KYOCERA AVX Components Corporation
    Inventors: Jeffrey A. Horn, Marianne Berolini
  • Patent number: 11721484
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer, and first and second internal electrodes configured to be layered in a third direction with the dielectric layer interposed therebetween and having first and second connection portions, respectively, and including first, second, third, fourth, fifth and sixth surfaces; a first external electrode disposed on the fifth surface of the body; and a second external electrode disposed on the fifth surface of the body. The first internal electrode is exposed to the third surface and the fifth surface of the body through the first connection portion, and the second internal electrode is exposed to the fourth surface and the fifth surface of the body through the second connection portion.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: August 8, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Sun Cheol Lee
  • Patent number: 11721491
    Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers; and external electrodes disposed on the body. One of the internal electrodes includes interfacial portions disposed at interfaces thereof with two of the dielectric layers, between which the one of the internal electrodes is disposed, and a central portion disposed between the interfacial portions, and one of the interfacial portions has a Mn content higher than an average Mn content of the central portion and an average Mn content of one of the dielectric layers which is in contact with the one of the interfacial portions.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: August 8, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Il Song, Sang Won Choi, Seung Heui Lee, Su Min Shin
  • Patent number: 11715597
    Abstract: A multilayer ceramic capacitor includes a multilayer body and two external electrodes. The multilayer body includes a multilayer main body including an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides in a width direction, main surfaces on opposite sides in the stacking direction, side surfaces on opposite sides in the width direction, and end surfaces respectively provided on opposite sides in a length direction. The two external electrodes are provided at the end surfaces, each including a foundation electrode layer in contact with the multilayer body, and a conductive resin layer on the foundation electrode layer. An end region of the internal electrode layers in contact with the foundation electrode layer is thicker than other regions of the internal electrode layers.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: August 1, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Mitsuru Ikeda
  • Patent number: 11715596
    Abstract: A multilayer ceramic capacitor includes a ceramic body including first and second surfaces opposing each other, and third and fourth surfaces connecting the first and second surfaces, a plurality of internal electrodes disposed inside the ceramic body, exposed from the first and second surfaces, and having an end exposed from the third surface or the fourth surface, and a first side margin and a second side margin respectively disposed on the first and second surfaces, from which end portions of the plurality of internal electrodes are exposed. The first and second side margins include a base material powder of a barium titanate-based base powder and a subcomponent. The subcomponent includes terbium (Tb) as a first subcomponent including a lanthanide rare earth element, and a content ratio of the terbium (Tb) to a content of the first subcomponent (RE) excluding the terbium (Tb) satisfies 0.110?Tb/RE?2.333.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: August 1, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Sung Park, Jeong Ryeol Kim, In Tae Seo, Jong Han Kim, Hyung Soon Kwon, Hee Sun Chun
  • Patent number: 11715602
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately stacked therein in a stacking direction; and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes 94.0 to 99.6 wt % of Ni and 0.4 to 6.0 wt % of Cu.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: August 1, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Jung Cho, Byung Kun Kim, Su Ji Kang, Yu Hong Oh
  • Patent number: 11710601
    Abstract: A ceramic electronic device includes a multilayer chip in which a plurality of dielectric layers of which a main component is ceramic and a plurality of internal electrode layers are stacked. The plurality of internal electrode layers include Ni, Sn and Au.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: July 25, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Kazuki Yamada, Kotaro Mizuno, Yoichi Kato, Hidetoshi Masuda
  • Patent number: 11705280
    Abstract: A multilayer ceramic capacitor may include a monolithic body and interleaved first and second pluralities of electrodes extending from the first and second ends, respectively, of the monolithic body towards opposite ends of the monolithic body. A first margin distance and a second margin distance may be formed, respectively, between the electrodes and the opposite ends of the monolithic body. First and second external terminations may be respectively disposed along the first end and second end of the monolithic body and respectively connected with the first and second plurality of electrodes. A margin ratio between a length of the monolithic body and the first margin distance and/or second margin distance may be less than about 10. At least one of the first external termination or the second external termination may include a conductive polymeric composition.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: July 18, 2023
    Assignee: KYOCERA AVX Components Corporation
    Inventors: Frank Hodgkinson, Elaine Boyle
  • Patent number: 11705285
    Abstract: A chip component includes a substrate that has a first surface and a second surface on a side opposite to the first surface, a plurality of wall portions that are formed on a side of the first surface by using a part of the substrate, that have one end portion and one other end portion, and that are formed of a plurality of pillar units, a support portion that is formed around the wall portions by using a part of the substrate and that is connected to at least one of the end portion and the other end portion of the wall portions, and a capacitor portion formed by following a surface of the wall portion, in which each of the pillar units includes a central portion and three convex portions that extend from the central portion in three mutually different directions in a plan view and in which the wall portion is formed by a connection between the convex portions of the pillar units that adjoin each other.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: July 18, 2023
    Assignee: ROHM CO., LTD.
    Inventor: Keisuke Fukae
  • Patent number: 11705283
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer, wherein the first coating layer may include an alkyl(meth)acrylate-based polymer.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: July 18, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyo Yeol Lee, Seung Hun Han, In Young Kang, Jung Min Kim, Jeong Ryeol Kim
  • Patent number: 11705271
    Abstract: A coil component includes a body and a coil conductor embedded in the body. The body includes a magnetic layer and a non-magnetic layer. The magnetic layer is formed of a composite material including a metal particle and a resin material, and the non-magnetic layer is arranged not to extend through a winding portion of the coil conductor or not to entirely extend through the body.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: July 18, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noriko Shimizu, Gota Shinohara, Mikito Sugiyama, Mari Yonemura
  • Patent number: 11699555
    Abstract: A hard start capacitor replacement unit has a plurality of capacitors in a container sized to fit in existing hard start capacitor space. The capacitors are 4 metallized film capacitors wound in a single cylindrical capacitive element. The container has a common terminal and capacitors value terminals for the plurality of capacitors, which may be connected singly or in combination to provide a selected capacitance. An electronic or other relay connects the selected capacitance in parallel with a motor run capacitor. The hard start capacitor replacement unit is thereby adapted to replace a wide variety of hard start capacitors.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: July 11, 2023
    Assignee: AmRad Manufacturing LLC
    Inventor: Richard W. Stockman
  • Patent number: 11699552
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer containing strontium (Sr) and first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; and a first external electrode and a second external electrode connected to the first and second internal electrode, respectively, in which the dielectric layer includes a first region parallel to and adjacent to the first internal electrode or the second internal electrode and having a thickness of 50 nm or less, and a second region parallel to and adjacent to the first region, and the first region has an average content of strontium (Sr) greater than 0.1 mol % and less than 9.3 mol %, and the second region has a lower average content of strontium (Sr) than that of the strontium of the first region.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: July 11, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Suji Kang, Dongjin Kim, Jinkyung Park
  • Patent number: 11699554
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and an external electrode formed outside the ceramic body. The external electrode includes an electrode layer, and a thickness T1 of the electrode layer corresponding to a central region of the ceramic body in a thickness direction is 5 ?m or more and 30 ?m or less, a thickness T2 of the electrode layer corresponding to a region in which an outermost internal electrode is located is 5 ?m or more and 15 ?m or less, and a thickness T3 of the electrode layer corresponding to a corner portion of the ceramic body is 0.1 ?m or more and 10 ?m or less.
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: July 11, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Jin Soo Park, Ji Hong Jo, Myung Jun Park, Hyun Hee Gu, Jong Ho Lee
  • Patent number: 11694845
    Abstract: A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes a functional unit including internal electrodes laminated in a first direction, and a pair of covers that covers the functional unit from both sides in the first direction, the multi-layer unit satisfying a relationship of (2*t2)/t1?0.6, where t1 represents a dimension of the functional unit in the first direction and t2 represents a dimension of each of the pair of covers in the first direction. The side margin covers the multi-layer unit in a second direction orthogonal to the first direction.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: July 4, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Yusuke Kowase
  • Patent number: 11694846
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween; and a first external electrode connected to the first internal electrodes and a second external electrode connected to the second internal electrodes, wherein the dielectric layer includes silicon (Si), each of the first and second internal electrodes includes Si and a conductive metal, and a ratio (B/A) of an average content (B) (wt %) of Si included in each of the first and second internal electrodes to an average content (A) (wt %) of Si included in the dielectric layer is 0.99 or more and 1.41 or less.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: July 4, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Joon Oh, Yun Jeong Cha, Hyo Min Kang, Jun Oh Kim, Ji Eun Oh, Jeong Ryeol Kim
  • Patent number: 11688560
    Abstract: A supporting-terminal-equipped capacitor chip includes a capacitor chip, and first and second supporting terminals that are electrically conductive and hold the capacitor chip therebetween. A portion of the capacitor chip other than a first connection portion and the first supporting terminal are separated from each other. A portion of the capacitor chip other than a second connection portion and the second supporting terminal are separated from each other. The first connection portion is located on the first main surface adjacent to a first end surface. The second connection portion is located on the first main surface adjacent to a second end surface.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: June 27, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shinobu Chikuma, Tadateru Yamada
  • Patent number: 11688557
    Abstract: According to an embodiment, a capacitor includes a conductive substrate, a conductive layer, a dielectric layer therebetween, and first and second internal electrodes. The substrate has first and second main surfaces. One partial region of the first main surface is provided with first recesses. A region of the second surface corresponding to a combination of the one partial region and another partial region is provided with second recesses. The conductive layer covers the main surfaces and side walls and bottom surfaces of the recesses. The first internal electrode is provided on the one partial region and electrically connected to the conductive layer. The second internal electrode is provided on the another partial region and electrically connected to the substrate.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: June 27, 2023
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kazuhito Higuchi, Kazuo Shimokawa, Susumu Obata, Mitsuo Sano
  • Patent number: 11682528
    Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively connected to the third surface and the fourth surface of the capacitor body to be respectively connected to the first internal electrode and the second internal electrode. The first and second side portions include an acicular second phase including a glass including aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P).
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: June 20, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sim Chung Kang, Yong Park, Woo Chul Shin, Ki Pyo Hong
  • Patent number: 11682529
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween and disposed in point-symmetry with each other; first and second connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the first internal electrode; third and fourth connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the second internal electrode; first and second external electrodes disposed on both surfaces of the body and connected to the first and second connection electrodes; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the third and fourth connection electrodes, and the first and second internal electrodes include a region in which an electrode is not disposed.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: June 20, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Taek Jung Lee, Min Gon Lee, Jea Yeol Choi, Jin Man Jung, Jin Kyung Joo