Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes and external electrodes disposed on the body and connected to the internal electrodes, wherein the external electrodes include a first electrode layer disposed on the body and including Cu and glass, a second electrode layer disposed on the first electrode layer and including Ni and Cu, and a third electrode layer disposed on the second electrode layer and including Ni and glass.

Abstract: A dielectric composition includes a main phase and segregation phases each including RE (at least one rare earth element). The main phase includes a main component having a perovskite crystal structure of ABO3 (A is one or more selected from Ba, Sr, and Ca, and B is one or more selected from Ti, Zr, and Hf). The segregation phases are classified into first segregation phases whose atomic ratio of Si to RE is 0 or more and 0.20 or less and second segregation phases whose atomic ratio of Si to the RE is more than 0.20. 0?S1/S2?0.10 is satisfied on a cross section of the dielectric composition, where S1 is an area ratio of the first segregation phases, and S2 is an area ratio of the second segregation phases. An atomic ratio of Si to RE in the second segregation phases is 0.80 or less on average.

Abstract: A dielectric ceramic composition that contains an oxide of A, R, and B and an oxide of Mn. The A is at least one selected from the group consisting of K and Na. The R is at least one selected from the group consisting of La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and Sc. The B is at least one selected from the group consisting of Nb and Ta. The molar ratio of the A:R:B:Mn is 2?x:1+x/3:5+y:z. The x, y, and z satisfy ?0.3?x?0.6, ?0.5?y?0.5, and 0.001?z?0.5, respectively.

Abstract: A ceramic electronic component includes a body including a dielectric layer and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a grain boundary disposed between adjacent grains, and GB1/G1 is 5 or more in mass ratio, where G1 is a content of Si of one of the plurality of grains and GB1 is a content of Si of the grain boundary.

Abstract: A multilayer ceramic capacitor includes a multilayer body, a first outer electrode on a first main surface closer to a first end surface, a second outer electrode on the first main surface closer to a second end surface, a third outer electrode on the first main surface between the first outer electrode and the second outer electrode, a first inner electrode layer connected to the first outer electrode and the second outer electrode via a first lead electrode and a second lead electrode, and a second inner electrode layer connected to the third outer electrode via a third lead electrode. When a length of the first lead electrode and a length of the second lead electrode in the length direction are each denoted by a, and a length of the third lead electrode in the length direction is denoted by b, b/a is about 0.5 to about 0.83.

Abstract: A broadband multilayer ceramic capacitor can include at least one active electrode layer including a first active electrode and a second active electrode. The first active electrode can have a central portion extending away from a base portion in a longitudinal direction. The second active electrode can include at least one arm extending away from a base portion towards the first end and overlapping the central portion of the first active electrode. A first shield electrode in a shield electrode region can have a central portion extending from a base portion. A second shield electrode can include an arm overlapping the central portion of the first shield electrode in the longitudinal direction. The shield electrode region can be spaced apart from the active electrode region by a shield-to-active distance that is greater than an active electrode spacing distance between respective active electrodes of the plurality of active electrodes.

Abstract: An electronic component includes an element body having a functional layer and an internal electrode layer, and an external electrode formed on a surface of the element body and connected to the internal electrode layer electrically. The chlorine concentration of the element body of the electronic component is 10 ppm or less.

Abstract: A ceramic electronic device includes an element body and an external electrode. The element body is formed by laminating a ceramic layer and an internal electrode layer. The external electrode is electrically connected to at least one end of the internal electrode layer. At least a part of a joint boundary between the electrode layer and the ceramic layer includes an interface protrusion on the external electrode side. The interface protrusion is made of an oxide.

Abstract: A multilayer capacitor includes an element body, and a pair of side surfaces and a pair of main surfaces; and a pair of external electrodes. The element body includes an inner layer portion in which a plurality of internal electrodes and a plurality of dielectric layers are alternately stacked in a second direction where the pair of main surfaces face each other, and a pair of outer layer portions disposed outside the inner layer portion in the second direction. On at least one of the pair of end surfaces, the internal electrode of the inner layer portion protrudes outward in the first direction from the outer layer portion by a predetermined protrusion amount. A ratio of the protrusion amount to a dimension of the element body in the second direction ranges from 11,000 ppm to 16,000 ppm.

Abstract: A conductive paste includes a conductive metal powder and a curable resin. The conductive metal powder includes Ag, Cu, and Ni. In the conductive metal powder, a mass ratio of Ag is about 3.0 wt % or more and about 10.0 wt % or less, a mass ratio of Cu is about {(1?mass ratio of Ag/100)×70} wt % or more and about {(1?mass ratio of Ag/100)×95} wt % or less, and a mass ratio of Ni is about {(1?mass ratio of Ag/100)×5} wt % or more and about {(1?mass ratio of Ag/100)×30} wt % or less.

Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body, wherein each of the first and second external electrodes includes a conductive resin layer including a resin, a plurality of metal particles, and a conductive connection portion connecting portions of the plurality of metal particles to each other, and in the conductive resin layer, a volume ratio of metal particles spaced apart from the conductive connection portion, among the plurality of metal particles, to a sum of the plurality of metal particles and the conductive connection portion is greater than 0% and less than 4.9%.

Abstract: A multilayer ceramic capacitor includes first and second external electrodes, each including a Ni-plated layer and a Sn-plated layer on the Ni-plated layer. The Sn-plated layer includes an intermetallic compound that penetrates the Sn-plated layer in a thickness direction, and allows hydrogen to pass therethrough more easily than Sn.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes respectively disposed on the body, wherein the external electrode includes: a first electrode layer connected to the internal electrode; and a second electrode layer disposed on the first electrode layer, and including a conductive portion including an silver (Ag)-tin (Sn) alloy and a resin, and a ratio of an area of the Ag—Sn alloy to an area of the conductive portion satisfies 3 to 50% in at least a portion of a cross-section of the second electrode layer.

Abstract: A multilayer ceramic capacitor includes a multilayer body, and external electrodes on a portion of a side surface portion including four side surface of the multilayer body, and on a portion of a first main surface of the multilayer body. The first main surface includes first regions covered with the external electrodes and a second region exposed from the external electrodes. The first regions of the first main surface each include recesses therein. The recesses in each of the first regions each include a spherical curved wall surface. The recesses in each of the first regions each have an average inlet size of about 0.3 ?m or more and about 10.5 ?m or less.

Abstract: A multi-layer ceramic electronic component includes (I) a ceramic body including (i) a protective portion that includes an end surface facing in a first direction, circumferential surfaces, and a ridge including a recess extending along the first direction and connects the circumferential surfaces, and (ii) a functional portion including internal electrodes laminated in a second direction, and (II) an external electrode including (i) a base film covering the end surface and including a first, second, and third covering portions formed on the end surface, on the circumferential surfaces, and on the recess, respectively, (ii) an intermediate film formed on the base film and continuously covering the first, second, and third covering portions, and (iii) a surface film formed on the intermediate film, wherein the recess is disposed outside end portions of the internal electrodes in a third direction orthogonal to the first and second directions.

Abstract: A power converter module has a switching device with a substrate with a first and a second DC voltage conductor track and a first and a second DC voltage terminal element connected in an electrically conducting manner with the correct polarity, and having a first and a second DC voltage connection element. The first DC voltage terminal element is connected to the first DC voltage connection element in an electrically conducting manner with the correct polarity by means of a first materially-bonded connection, wherein the second DC voltage terminal element is connected to the second DC voltage connection element in an electrically conducting manner with the correct polarity by means of a second materially-bonded connection.

Abstract: A printed circuit board includes a first chip component, a second chip component, and a printed wiring board. The first chip component and the second chip component each has a length L2 in the longitudinal direction. A relationship of 0.894?L2/L1?1.120 is satisfied, where L1 represents a length of the first opening in the longitudinal direction. A relationship of 0.894?L2/L4?1.120 is satisfied, where length L4 represents a length of the second opening in the longitudinal direction. A relationship of 0.183?LOA/LiA?50.309 is satisfied, where LiA represents a length of the first land in the longitudinal direction, and LOA represents a thickness of solder on an end surface of the first electrode. A relationship of 0.183?LOB/LiB?0.309 is satisfied, where LiB represents a length of the second land in the longitudinal direction, and LOB represents a thickness of solder on an end surface of the second electrode.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode disposed on the body and connected to the internal electrodes. One of the internal electrodes includes Ni, and a lattice constant of Ni included in the one of the internal electrodes satisfies a range of 3.53 ? to 3.72 ?.

Abstract: Provided are capacitors of semiconductor devices, wherein the capacitors may be used in a high-frequency operation environment. A capacitor includes a first electrode layer, a dielectric layer on the first electrode layer, and a second electrode layer on the dielectric layer, wherein the dielectric layer includes a plurality of unit dielectric layers, and the unit dielectric layer includes first and second sub-dielectric layers that have different dielectric constants and conductivities from each other and are connected in series, and the first and second sub-dielectric layers have a conductivity difference so that the capacitance of the dielectric layer converges to the capacitance of the unit dielectric layer.

Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.