Abstract: The invention provides a memory apparatus including a memory cell array and a voltage generation circuit. The voltage generation circuit is electrically connected to the memory cell array and includes an active voltage circuit and a sensing circuit. The active voltage circuit is configured to output an operating voltage to the memory cell array when the memory apparatus is in an active mode. The sensing circuit is configured to sense the operating voltage when the memory apparatus is in a standby mode and briefly activate the active voltage circuit to pull up the operating voltage after the operating voltage drops below a threshold.

Abstract: A device includes a memory cell that randomly presents either a first logic state or a second logic state. The memory cell includes: a plurality of first nanostructures extending along a first lateral direction; a plurality of second nanostructures extending along the first lateral direction and disposed at a first side of the plurality of first nanostructures; a plurality of third nanostructures extending along the first lateral direction and disposed at a second side of the plurality of first nanostructures; a dielectric fin structure disposed immediately next to the plurality of first nanostructures along a second lateral direction, wherein a first sidewall of each of the plurality of first nanostructures facing toward or away from the second lateral direction is in contact with the dielectric fin structure; and a first gate structure wrapping around each of the plurality of first nanostructures except for the first sidewall.

Abstract: The present disclosure provides a multi-bit memory cell, an analog-to-digital converter, a device and a method. The multi-bit memory cell comprises: a spin-orbit coupling layer and a plurality of magnetic tunnel junctions disposed on the spin-orbit coupling layer, the plurality of magnetic tunnel junctions comprising a plurality of first magnetic tunnel junctions; the plurality of first magnetic tunnel junctions are sequentially arranged along a length direction of the spin-orbit coupling layer, and critical currents of reversals of the magnetizations of free layers of the plurality of first magnetic tunnel junctions are progressively increased or decreased in sequence along the length direction. The present disclosure provides a multi-bit memory unit with simple manufacturing process and structure.

Abstract: A memory device includes a first terminal and a second terminal; a magnetic tunnel junction coupled to the second terminal; wherein the magnetic tunnel junction comprises a magnetic free layer, and the magnetic tunnel junction is configured to be displaced by a plurality of distances from a center position of the device; a nonmagnetic metallic spin harvesting conductor coupled to the magnetic tunnel junction; wherein the nonmagnetic metallic spin harvesting conductor has a lateral dimension that is larger than that of the magnetic tunnel junction; an electrically insulating spin conductor coupled to the nonmagnetic metallic spin harvesting conductor; wherein the electrically insulating spin conductor has relatively less electrical conductivity than the nonmagnetic metallic spin harvesting conductor; wherein the nonmagnetic metallic spin harvesting conductor collects spin current from the electrically insulating spin conductor; and a spin orbit conduction channel coupled to the electrically insulating spin con

Abstract: Stochastic or near-stochastic physical characteristics of resistive switching devices are utilized for generating data distinct to those resistive switching devices. The distinct data can be utilized for applications related to electronic identification. As one example, data generated from physical characteristics of resistive switching devices on a semiconductor chip can be utilized to form a distinct identifier sequence for that semiconductor chip, utilized for verification applications for communications with the semiconductor chip or utilized for generating cryptographic keys or the like for cryptographic applications.

Abstract: A device includes a Magnetic Tunnel Junction (MTJ) memory element comprising, a reference layer, a free layer, and a magnetic tunneling layer between the reference layer and the free layer; and a pair of magneto-electric controlling layers, which have in-plane uniaxial anisotropy, wherein the pair of magneto-electric controlling layers are disposed below the free layer.

Abstract: A memory device includes first memory circuits and first memory controller. The first memory controller is configured to receive a first command from a first circuitry. When the first memory controller controls a first circuit in the first memory circuits to operate in an enable mode in response to the first command, the first memory controller is further configured to control remaining circuits in the first memory circuits to operate in a data retention mode in response to the first command.

Abstract: A memory cell includes a bottom electrode, a first dielectric layer, a variable resistance layer, and a top electrode. The first dielectric layer laterally surrounds the bottom electrode. A top surface of the bottom electrode is located at a level height lower than that of a top surface of the first dielectric layer. The variable resistance layer is disposed on the bottom electrode and the first dielectric layer. The variable resistance layer contacts the top surface of the bottom electrode and the top surface of the first dielectric layer. The top electrode is disposed on the variable resistance layer.

Abstract: Methods, systems, and devices for environmental condition tracking for a memory system are described. A memory system may include one or more sensors (e.g., temperature sensors) for identifying a temperature of a memory device. For example, the sensor(s) may identify a first temperature of the memory device when performing a write operation on a memory cell and may identify a second temperature of the memory device when performing a read operation on the memory cell. The memory system may determine a performance characteristic of the memory device based on a correlation between the first temperature and the second temperature and may transmit the performance characteristic to a server.

Abstract: A vertical 3D memory device may comprise: a substrate including a plurality of conductive contacts each coupled with a respective one of a plurality of digit lines; a plurality of word line plates separated from one another with respective dielectric layers on the substrate, the plurality of word line plates including at least a first set of word lines separated from at least a second set of word lines with a dielectric material extending in a serpentine shape and at least a third set of word lines separated from at least a fourth set of word lines with a dielectric material extending in a serpentine shape; at least one separation layer separating the first set of word lines and the second set of word lines from the third set of word lines and the fourth set of word lines, wherein the at least one separation layer is parallel to both a digit line and a word line; and a plurality of storage elements each formed in a respective one of a plurality of recesses such that a respective storage element is surrounded

Abstract: A processing device in a memory system maintains a counter to track a number of read operations performed on a data block of a memory device and determines that the number of read operations performed on the data block satisfies a first threshold criterion. The processing device further determines whether a number of scan operations performed on the data block satisfies a scan threshold criterion. Responsive to the number of scan operations performed on the data block satisfying the scan threshold criterion, the processing device performs a first data integrity scan to determine one or more first error rates for the data block, each of the one or more first error rates corresponding to a first set of wordlines of the data block, the first set comprising first alternating pairs of adjacent wordlines.

Abstract: A method of operating a nonvolatile memory device which includes at least one memory block is provided. The method includes providing a plurality of word-lines with a voltage during a word-line set-up period, precharging a plurality of driving lines with a voltage during a word-line development period, detecting a voltage drop of a sensing node during a sensing period, and detecting leakage based on the voltage drop.

Abstract: Methods, systems, and devices for error control for content-addressable memory (CAM) are described. A CAM may store bit vectors as a set of subvectors, which each subvector stored in an independent aspect of the CAM, such as in a separate column or array of memory cells within the CAM. The CAM may similarly segment a queried input bit vector and identify, for each resulting input subvector, whether a matching subvector is stored by the CAM. The CAM may identify a match for the input bit vector when the number of matching subvectors satisfies a threshold. The CAM may validate a match based on comparing a stored bit vector corresponding to the identified match to the input bit vector. The stored bit vector may undergo error correction and may be stored in the CAM or another memory array, such as a dynamic random access memory (DRAM) array.

Abstract: A resistive random access memory, including a first electrode layer and a second electrode layer disposed opposite to each other, a variable resistance layer located between the first electrode layer and the second electrode layer, an oxygen exchange layer located between the variable resistance layer and the second electrode layer, a vacancy-supplying layer surrounding a middle sidewall of the oxygen exchange layer; and a vacancy-driving electrode layer located on the vacancy-supply layer and surrounding an upper sidewall of the oxygen exchange layer, is provided. A method of fabricating the resistive random access memory is also provided.

Abstract: A semiconductor base material stands on a substrate in a vertical direction or extends in a horizontal direction. Between first and second impurity layers disposed at the ends of the semiconductor base material, first and second gate insulating layers and first and second gate conductor layers are disposed around the semiconductor base material. A memory write operation is performed where voltages are applied to the first and second impurity layers and the first and second gate conductor layers to cause an impact ionization phenomenon to occur in a channel region, and among generated groups of electrons and positive holes, the group of electrons are discharged from the channel region and some of the group of positive holes are retained in the channel region. A memory erase operation is performed where the retained group of positive holes are discharged via any of or both of the first and second impurity layers.

Abstract: A data device with a small circuit area and reduced power consumption is used. The data processing device includes a NAND memory portion and a controller. The memory portion includes a first string and a second string in different blocks. The first string includes a first memory cell, and the second string includes a second memory cell. On reception of first data and a signal including an instruction to write the first data, the controller writes the first data to the first memory cell. Then, the controller reads the first data from the first memory cell and writes the first data to the second memory cell.

Abstract: Methods, systems, and devices for reduced pin status register are described. An apparatus may include a first memory die and a second memory die each coupled with a data bus. The apparatus may further include a controller coupled with the first memory die and the second memory die via the data bus that is configured to transmit a first command associated with a first operation to the first memory die and a second command associated with a second operation to the second memory die. The controller may further transmit a third command concurrently to the first memory die and the second memory die, the third command requesting a first status of the first operation and a second status of the second operation. The controller may receive the first status and the second status concurrently via the data bus from the first memory die and the second memory die.

Abstract: Examples are disclosed that relate to a multi-port synchronous dynamic random access memory (SDRAM). One example provides a multi-port SDRAM comprising a first port, a second port, a first memory portion, and a second memory portion. At least the first memory portion is configured as shared such that the first memory portion is accessible at the first port and not the second port in a first mode, and the first memory portion is accessible at the second port and not the first port in a second mode. The multi-port SDRAM further comprises a mode controller controllable to selectively change the multi-port SDRAM between at least the first mode and the second mode.

Abstract: A method of adjusting operating conditions includes: a substrate; first conductive layers; a first semiconductor layers facing the first conductive layers; a second semiconductor layer connected to the first semiconductor layers; and an electric charge accumulating layer disposed between the first conductive layers and the first semiconductor layers. At a predetermined timing of a program operation, the second conductive layer which is one of the first conductive layers is supplied with a program voltage or a write pass voltage. The method executes: a first operation that supplies the second conductive layer with the write pass voltage and supplies a third conductive layer which is one of the plurality of first conductive layers with the program voltage; and a second operation that supplies the second conductive layer with a verify voltage and supplies the third conductive layer with a voltage.

Abstract: Disclosed herein are related to a memory cell including magnetic tunneling junction (MTJ) devices. In one aspect, the memory cell includes a first layer including a first transistor and a second transistor. In one aspect, the first transistor and the second transistor are connected to each other in a cross-coupled configuration. A first drain structure of the first transistor may be electrically coupled to a first gate structure of the second transistor, and a second drain structure of the second transistor may be electrically coupled to a second gate structure of the first transistor. In one aspect, the memory cell includes a second layer including a first MTJ device electrically coupled to the first drain structure of the first transistor and a second MTJ device electrically coupled to the second drain structure of the second transistor. In one aspect, the second layer is above the first layer.