Patents Examined by Michael V. Datskovskiy
  • Patent number: 9185792
    Abstract: A package substrate including a circuit board and a heat-dissipating element is provided. The circuit board has a through opening adapted for accommodating an electronic element. The heat-dissipating element is disposed at the circuit board and covers one side of the through opening. The heat-dissipating element includes a heat-dissipating plate, an adhesive layer and an antioxidation layer. The heat-dissipating plate has a first surface facing the through opening and a second surface opposite to the first surface. The adhesive layer is disposed on the first surface and the heat-dissipating plate adheres to the circuit board through the adhesive layer. The antioxidation layer is disposed on the second surface. An electronic assembly including the package substrate is also provided.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: November 10, 2015
    Assignee: MUTUAL-TEK INDUSTRIES CO. LTD.
    Inventor: Chih Ming Chang
  • Patent number: 8976525
    Abstract: An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and two or more synthetic jets operatively coupled to the bracket, where the two or more synthetic jets are arranged in a multi-dimensional array.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: March 10, 2015
    Assignee: General Electric Company
    Inventors: Hendrik Pieter Jacobus de Bock, William Earl Gross, Jr., Bryan Patrick Whalen, Robert Paul Meier
  • Patent number: 8854815
    Abstract: A first conduit is externally attached to one of two opposing sidewalls of electronic equipment and a second conduit is externally attached to the other of the opposing sidewalls. Each conduit has an open end, a closed end, and a side having a vent that is aligned with a vent in the sidewall of the electronic equipment to which that conduit is attached. The first conduit takes air in through its open end, channels the air in a direction substantially orthogonal to the direction of air flowing through the electronic equipment, and directs the air into the electronic equipment through its aligned vents. The second conduit receives air from the electronic equipment through its aligned vents, channels the air in a direction that is substantially orthogonal to the direction of air flowing through the electronic equipment, and exhausts the air through the open end of the second conduit.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: October 7, 2014
    Assignee: International Business Machines Corporation
    Inventor: Atul Tambe
  • Patent number: 8810998
    Abstract: A communication system is provided for a motor control center. The motor control center includes an enclosure and a plurality of subunits. The enclosure comprises a framework for dividing the enclosure into a plurality of compartments. The subunits are removably disposed within the compartments. The communication system includes a mounting bracket fixedly attached to the framework, within a corresponding one of the compartments, and a communication module mounted on the mounting bracket. The communication module includes a housing and a number of features such as, for example and without limitation, a DIP switch and electrical connector(s), disposed on the housing. Accordingly, when the subunit is removed from the compartment, the communication module remains, fixed to the enclosure framework. The mounting bracket includes a hinge that allows the communication module to pivot with respect to the compartment to provide access to the features.
    Type: Grant
    Filed: April 23, 2012
    Date of Patent: August 19, 2014
    Assignee: Eaton Corporation
    Inventors: Gerald Raymond Feldmeier, Edgar Yee, Robert Allan Morris
  • Patent number: 8498113
    Abstract: A disaster-proof data safe with multiple, insulated, surrounding solid structural metal walls for housing functioning digital electronic computing, data processing, data storage, communications and high power density blade server systems has one or more coaxial helical coil coolant tubes circulating a coolant liquid encircled around an interior hexahedral, housing space for removing heat generated in the housing space and insulating the housing space from sources of heat external to the safe. Features of the safe include a plurality of longitudinal heat sink bars thermally coupled to the encircling helical coil coolant tubes supported either by the helical coil coolant tubes or the interior structural metal sidewalls of the housing space. The helical coil coolant tubes and the heat sink bars are preferably composed from metals such as copper, aluminum and their alloys that have a high thermal conductivity and that retain structural integrity at temperature ranging up to 500° C.
    Type: Grant
    Filed: September 14, 2011
    Date of Patent: July 30, 2013
    Inventors: Henry Hung Tran, Quynh Anh Kim Nguyen, Michael Hai Tran
  • Patent number: 8339772
    Abstract: A thermally efficient electrical enclosure includes a busbar, a metallic heat sink, and an electrical insulator. The busbar is positioned entirely within the enclosure and electrically insulated from the enclosure. The metallic heat sink is attached to a wall of the enclosure. The electrical insulator physically contacts the busbar and is at least partially wrapped around at least two non-parallel surfaces of a portion of the metallic heat sink such that the metallic heat sink is electrically insulated from the busbar. The metallic heat sink is configured to transfer thermal energy or heat from the busbar to the enclosure such that the thermal energy is lost or transferred to the surrounding environment, which reduces the temperature of the busbar and the amount of copper needed for the busbar without reducing the rating of the enclosure.
    Type: Grant
    Filed: November 8, 2010
    Date of Patent: December 25, 2012
    Assignee: Schneider Electric USA, Inc.
    Inventors: Hildegard Peralta, Ezequiel Salas, Mauricio Diaz
  • Patent number: 8264849
    Abstract: An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate, and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus include an at least one stiffener layer that is integral to the coreless substrate and the stiffener layer is made of overmold material, underfill material, or prepreg material.
    Type: Grant
    Filed: June 23, 2010
    Date of Patent: September 11, 2012
    Assignee: Intel Corporation
    Inventor: John S. Guzek
  • Patent number: 8116072
    Abstract: According to an aspect of the present disclosure, an electrical power meter, is disclosed. The electrical power meter includes a housing for containing electrical circuitry therein, the housing including at least one of voltage and current inputs, the housing including passages extending entirely therethrough, wherein the passages are configured to receive a CT lead therethrough, and wherein the CT leads are not electrically connected to the electrical circuitry therein; and a face plate operatively supported on a surface of the housing, wherein the face plate includes at least one of displays, indicators and buttons. It is envisioned that the through passages are located along a side of the housing.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: February 14, 2012
    Assignee: Electro Industries/Gauge Tech
    Inventors: Erran Kagan, Tibor Banhegyesi, Avi Cohen
  • Patent number: 8035968
    Abstract: A display unit is disclosed. A display apparatus includes a panel unit displaying images, a circuit unit provided a rear surface of the panel unit, a chamber surrounding the circuit unit, the chamber forming a predetermined space and at least one ventilation fan ventilating air inside the chamber along a circulation path passing beyond the circuit unit. According to a display apparatus according to the present invention, parts which are mounted in the display apparatus may be protected from external moisture or dust. Furthermore, heat radiation may be performed efficiently in the display apparatus according to the present invention even if environments of heat exchanging with an outside may not be formed enough in a structure of the display apparatus.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: October 11, 2011
    Assignee: LG Electronics Inc.
    Inventors: Oh Kwan Kwon, Jae Min Hyun, Kyung Won Lee, Soon Koo Park
  • Patent number: 8023266
    Abstract: An AC photovoltaic module includes a DC photovoltaic module for converting solar energy to DC electrical power, and an inverter for converting DC electrical power to AC electrical power, the inverter being adapted for connection to a frame portion of the module and being sized and configured, and provided with arrangements of electrical components thereof, to dispense heat from the inverter, whereby to prolong operational life and reliability of the inverter.
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: September 20, 2011
    Assignee: GreenRay Inc.
    Inventors: Miles Clayton Russell, Gregory Allen Kern, Ruel Davenport Little, Zachary Adam King
  • Patent number: 8018722
    Abstract: Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: September 13, 2011
    Assignee: Tanima Holdings, LLC
    Inventor: Thomas W. Lynch
  • Patent number: 8014149
    Abstract: A fan module is disposed in an electrical device. The electrical device has a main board and a casing. The fan module includes a vane module, a fan motor, a circuit board and a fan housing. The vane module has a hub and a plurality of vanes disposed around the edge of the hub. The fan motor is disposed in the hub. The circuit board is used to control the fan motor, so that the vanes rotate related to an axis of the hub for generating an air flow. The fan housing has a main body portion, a protruding portion and a fixing portion, wherein the protruding portion is located in a side of the main body portion, the vane module and the fan motor are disposed in the main body portion and the circuit board is disposed in the protruding portion.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: September 6, 2011
    Assignee: Compal Electronics, Inc.
    Inventors: Ifeng Hsu, Jenq-Haur Pan, Chang-Yuan Wu
  • Patent number: 8009417
    Abstract: In accordance with at least some embodiments, a computer system include a chassis and a main airflow channel within the chassis. The computer system also includes multiple processors and multiple memory banks positioned in the main airflow channel. The computer system also includes a removable airflow guide assembly installed in the main airflow channel, wherein the removable airflow guide assembly divides the main airflow channel into a processor-side airflow channel and a memory-side airflow channel.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: August 30, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Tom J. Searby, Robert L. Crane
  • Patent number: 8004838
    Abstract: An electronic unit includes: a circuit board that has a device mounting surface mounted with circuit devices and that is supported in a condition that the device mounting surface is arranged in a direction of gravity; an opposed member that is disposed in opposition to the circuit board so that a passage space through which a refrigerant for cooling the circuit devices passes is formed between the opposed member and the device mounting surface; an exhaust unit that is disposed in opposition to the circuit devices disposed on the circuit board and that exhausts the refrigerant having passed through the passage space; and a protruding member that is provided in an upper portion of the exhaust unit in the direction of gravity and that protrudes from the opposed member toward the circuit devices.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: August 23, 2011
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Michiaki Yoshida, Koichi Tanaka
  • Patent number: 8004827
    Abstract: Described herein are various embodiments of a fuse module for fused electrical devices. According to one exemplary embodiment, a fuse module is mounted to the housing of a fused electrical device. The fused electrical device can include at least one power output displaced along the power distribution housing with the at least one power output electrically couplable to at least one power input. The fuse module can be electrically coupled to the at least one power input and electrically couplable to the at least one power outputs. Further, the fuse module can comprise at least one fuse holder that is movable between a first position in which a fuse held by the fuse holder is electrically couplable to the at least one power output and a second position in which a fuse held by the fuse holder not electrically couplable to the at least one power output and is exposed to allow access to the fuse.
    Type: Grant
    Filed: June 21, 2010
    Date of Patent: August 23, 2011
    Assignee: Server Technology, Inc.
    Inventors: Carrel W. Ewing, Brandon W. Ewing, Andrew J. Cleveland, James P. Maskaly
  • Patent number: 8004848
    Abstract: Provided are a high reliability stack module fabricated at low cost by using simplified processes, a card using the stack module, and a system using the stack module. In the stack module, unit substrates are stacked with respect to each other and each unit substrate includes a selection terminal. First selection lines are electrically connected to selection terminals of first unit substrates disposed in odd-number layers, pass through some of the unit substrates, and extend to a lowermost substrate of the unit substrates. Second selection lines are electrically connected to selection terminals of second unit substrates disposed in even-number layers, pass through some of the unit substrates, and extend to the lowermost substrate of the unit substrates. The selection terminal is disposed between the first selection lines and the second selection lines.
    Type: Grant
    Filed: May 23, 2008
    Date of Patent: August 23, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-Duk Baek, Mitsuo Umemoto, Kang-Wook Lee
  • Patent number: 8000087
    Abstract: Each integral unit is structured by arranging partial units (I), (II), and (Ill) side by side, while line-side devices are branched from positions between the partial units adjacent to each other. Each of the partial units is structured by connecting a current transformer and a disconnector in sequence to each of upper and lower outlets horizontally drawn out from a lateral face of a vertical-type circuit breaker in the same direction. Any two partial units positioned adjacent to each other are connected in series by connecting the disconnectors included therein with a connection bus. The line-side devices are positioned to oppose the circuit breakers while the disconnectors are interposed therebetween. The switchgear includes a plurality of integral units. Two ends of each of the integral units are respectively connected to two main buses that are provided in an upper position and a lower position while the disconnectors are interposed therebetween.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: August 16, 2011
    Assignee: Mitsubishi Electric Corporation
    Inventors: Daisuke Fujita, Takuya Otsuka, Hitoshi Sadakuni
  • Patent number: 8000107
    Abstract: A carrier with embedded components comprises a substrate and at least one embedded component. The substrate has at least one slot and a first composite layer. The embedded component is disposed at the slot of the substrate. The first composite layer has a degassing structure, at least one first through hole and at least one first fastener, wherein the degassing structure corresponds to the slot, the first through hole exposes the embedded component, and the first fastener is formed at the first through hole and contacts the embedded component. According to the present invention, the degassing structure can smoothly discharge the hydrosphere existing within the carrier under high temperature circumstances and the first fastener is in contact with the embedded component, which increases the joint strength between the embedded component and the substrate.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: August 16, 2011
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Yung-Hui Wang, In-De Ou, Chih-Pin Hung
  • Patent number: 7995329
    Abstract: A modular power distribution system comprises a chassis; and a backplane including a power input, and a plurality of module connection locations. A plurality of modules are mounted in the chassis, each module mounted to one of the module connection locations. Each module includes: (i) an OR-ing diode; (ii) a circuit protection device; (iii) a microprocessor controlling the circuit protection device; and (iv) a power output connection location. A circuit option switch is located on each module for setting the current limits for each module. A control module is provided connected to the backplane.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: August 9, 2011
    Assignee: ADC Telecommunications, Inc.
    Inventors: Joseph C. Coffey, Bradley Blichfeldt
  • Patent number: 7995344
    Abstract: A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to extend away from the heat sink to enable deformation of the convex foil construction as a result of contact with a top surface of an electronic component mounted opposite the foil construction.
    Type: Grant
    Filed: January 9, 2007
    Date of Patent: August 9, 2011
    Assignee: Lockheed Martin Corporation
    Inventors: Charles H. Dando, III, Jon Larcheveque, David L. Vos