Abstract: A clip is adapted for securing a heat sink on a printed circuit board (PCB). The clip includes a linking portion, an operating portion, a handle, and a pressing portion. The linking portion is located at a lateral side of the heat sink. The operating portion pivotally engages with the linking portion and the heat sink. The handle connects the operating portion. The pressing portion connects the linking portion. A fastener mounted on the PCB extends through the heat sink and the pressing portion. The pressing portion is slidable from a first position to a second position. When the pressing portion is in the second position the handle is operable to drive the operating portion to move upwardly and urge the pressing portion to move along the fastener until the pressing portion abuts against a top portion of the fastener and simultaneously presses the heat sink.

Abstract: A storage device testing system that includes at least one rack, test slots housed by each rack, and at least one air mover in pneumatic communication with the test slots. Each test slot includes a test slot housing having an entrance and an exit, with the entrance configured to receive a storage device. The at least one air mover is configured to move air exterior to the racks into the entrance of each test slot housing, over the received storage device, and out of the exit of each test slot housing.

Abstract: An exemplary embodiment of the present invention provides a computer system. The system includes an enclosure configured to house a plurality of electronic devices. The system also includes a fan coupled to the enclosure and configured to provide a flow of cooling air through the enclosure to cool the electronic devices. The system also includes a first airflow path configured to allow the cooling air to exit the enclosure and attenuate noise generated in the enclosure. The system also includes an auxiliary outlet configured to provide a second airflow path if the first airflow path is obstructed.

Abstract: A power device package controls heat generation of a power device using a semi-permanent metal-insulator transition (MIT) device instead of a fuse, and emits heat generated by the power device through a small-sized heat sink provided only in one region on the power device, thereby ensuring excellent dissipation of heat. Therefore, the power device package can be usefully applied to any electric/electronic circuit that uses a power device.

Abstract: The invention discloses a fastening device for fasten a heat sink onto a base board. The fastening device comprises a first fastening member, a second fastening member and a third fastening member. When assembling the fastening device to the base board, the second fastening member has to be pivoted with the third fastening member first. Afterwards, the first fastening member is attached to the base board. Finally, the second and third fastening members, which have been assembled, are engaged with the first fastening member, so as to press the heat sink tightly. Accordingly, the heat sink will be fastened on the base board easily and stably.

Abstract: A cooling system for an outdoor electronic enclosure, with separate compartments for electronics and batteries, includes separate cooling devices for each compartment so that optimal temperatures are provided to each compartment. The batteries are cooled by a thermo-electric type air-conditioner, while the electronics are cooled by direct air cooling device or a heat exchanger.

Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.

Abstract: A cooling device for dissipating heat for an electronic device includes a shell to absorb heat generating from a heat generating element in the electronic device, and a number of fins. The shell bounds a heat exchanging space and defines an air intake and an air outlet. The number of fins extends into the heat exchanging space. The shell guides air outside the shell to enter into the shell through the air intake and to exit from the shell through the air outlet after exchanging heat in the heat exchanging space.

Abstract: By providing thermoelectric elements, such as Peltier elements, in a semiconductor device, the overall heat management may be increased. In some illustrative embodiments, the corresponding active cooling/heating systems may be used in a stacked chip configuration to establish an efficient thermally conductive path between temperature critical circuit portions and a heat sink of the stacked chip configuration.

Abstract: A circuit board case including: a cover that includes a cover front wall and a rise wall connected to the cover front wall, the cover being attachable to an attaching object at a position on the rise wall opposite the cover front wall; and a case that houses a circuit board and includes a case front wall and a first wall surface oriented toward a direction opposite the case front wall, the case being housed in the cover such that the case front wall opposes the cover front wall. A fitting that engages the first wall surface is formed in the rise wall of the cover so as to urge the case toward the cover front wall and thus hold the case within the cover.

Abstract: A heat sink device mounted on a circuit board including an electronic component includes a heat sink to dissipate heat generated by the electronic component and a shielding member electrically connecting the circuit board and the heat sink to prevent the electronic component from electromagnetic interference (EMI). The heat sink includes a base, a plurality of heat fins extending upwardly from the base, and a plurality of receiving grooves defined in the base. The plurality of receiving grooves are arranged in rows around the plurality of heat fins. The shielding member includes a plurality of contact plates abutting against the circuit board and a plurality of receiving plates received in the plurality of receiving grooves.

Abstract: A test slot cooling system for a storage device testing system includes a storage device transporter having first and second portions. The first portion of the storage device transporter includes an air director and the second portion of the storage device transporter is configured to receive a storage device. The test slot cooling system includes a test slot housing defining an air entrance and a transporter opening for receiving the storage device transporter. The air entrance is in pneumatic communication with the air director of the received storage device transporter. The test slot cooling system also includes an air mover in pneumatic communication with the air entrance of the test slot housing for delivering air to the air director. The air director directs air substantially simultaneously over at least top and bottom surfaces of the storage device received in the storage device transporter.

Abstract: An interior cooling structure according to the present invention includes a frame in which a plurality of circuit board modules are stacked, with electronic components mounted on the plurality of circuit board modules by being classified by function; an external housing which covers the frame together with the plurality of circuit board modules; a plurality of cooling devices which reduce temperature rises in the external housing caused by heat produced by the plurality of circuit board modules; and a heat generating region a partitioned in such away as to enclose a circuit board module which has the highest total power consumption out of the plurality of circuit board modules, wherein the plurality of cooling devices are arranged in such away as to reduce temperature rises in the heat generating region by displaying capacity higher than capacity of each of the cooling devices.

Abstract: A docking system is disclosed. The docking system includes a portable electronic device capable of operating in multiple orientations including vertical and horizontal. The docking system also includes a docking station configured to mechanically accept and operatively interface with the portable electronic device in any of its multiple orientations including vertical and horizontal.

Abstract: A power module package including a fully enclosed package comprising sidewalls; wherein at least one of said sidewalls includes a conductive substrate; wherein circuit elements are mounted on said conductive substrate on a first side comprising an inner side of said enclosed package; and, wherein a majority area of a second side of said conductive substrate is exposed, the power package has an improved interconnection configuration and compact power I/O terminals, offering low electrical parasitics, a plurality of individual power module packages can be attached seamlessly and positioned in a liquid coolant with multiple top portion open channels, as well as attached to a laminar power connector (busbar) to form various electrical power conversion topologies, the module offers low thermal resistance and low electrical parasitics, in addition to small volume, light weight and high reliability.

Abstract: An air volume control module for use with a vehicular air conditioning apparatus includes a circuit board including a control circuit for controlling the rotational speed of the blower of the vehicular air conditioning apparatus, a heat sink connected to the circuit board and including a fin for radiating heat generated by the circuit board, and a base housing surrounding the circuit board, the heat sink being inserted in the base housing with the fin projecting from the base housing. The base housing is mounted on the heat sink only by a locking finger. Either one of the base housing and the fin of the heat sink has a protective projection having a heightwise dimension greater than that of the locking finger.

Abstract: A flat panel display including a base frame, a display panel module, and a heat-conductive structure is provided. The base frame includes a control unit. The display panel module is disposed in the base frame and includes a back bracket, a first heating element, and a second heating element. The first heating element and the second heating element are disposed in the back bracket and electrically connected to the control unit. A first distance is formed between the back bracket and the base frame to define a first air passage, a second distance is formed between the back bracket and the base frame to define a second air passage, and the first distance is shorter than the second distance. The heat-conductive structure is disposed in the first air passage, and the position of the heat-conductive structure is corresponding to the position of the first heating element.

Abstract: According to one embodiment, a data center comprises a first data center section comprising one or more equipment element elements. Each computer element has one or more heat generating sources. A second data center section comprises a heat exchanger, the second data center section being substantially segregated from the first section. A heat transfer element is thermally coupled to at least some of the heat generating sources and is further thermally coupled to the heat exchanger.

Abstract: A substrate for power electronics mounted thereon, comprises a middle ceramic layer having a lower surface and an upper surface, an upper metal layer attached to the upper surface of the middle ceramic layer, and a lower metal layer attached to the lower surface of the middle ceramic layer. The lower metal layer has a plurality of millichannels configured to deliver a coolant for cooling the power electronics, wherein the millichannels are formed on the lower metal layer prior to attachment to the lower surface of the middle ceramic layer. Methods for making a cooling device and an apparatus are also presented.

Abstract: There is provided a motor controller that can easily reduce the size and manufacturing cost of a motor controller by reducing the size of a heat sink without increasing the number of parts much. The motor controller includes a heat sink, a plurality of power semiconductor modules that is in close contact with the heat sink, a substrate (6) that is electrically connected to the plurality of power semiconductor modules, and a fan (8) that generates the flow of external air and supplies cooling air to the heat sink. The heat sink is formed by the combination of two kinds of heat sinks that include a first heat sink (9) and a second heat sink (10), and at least one of the power semiconductor modules is in close contact with each of the first and second heat sinks (9) and (10).