Abstract: A heat dissipating structure for an electronic component of the present invention includes a main board on which electronic components are mounted, a heat sink disposed facing the main board and contacting a plurality of the electronic components on the main board, a heat pipe disposed on the heat sink, an arm branching from the heat sink and elastically deformable in relation to the heat sink, and a cooling fan located at the end portion of the heat pipe.

Abstract: Various embodiments disclose a shielded or isolated heat dissipating system comprising a case, a heat sink base, and a circuit board comprising at least one electronic device for which heat dissipation is desired. The heat sink base is attached to the case and together with the shielding case defines an enclosed space within which electromagnetic interference is reduced. Both heat-dissipation function and electromagnetic shielding function may be achieved by the combination of the heatsink base and the case while maintain electrical isolation with one or more specially treated components. The space required for mounting the system may also be reduced without adversely affecting normal and stable operation of the electronic device.

Abstract: A cooling unit includes: a heat absorbing section which absorbs heat from a heat-producing element; a heat radiating section which defines a ventilation area and radiates the heat into air passing through the ventilation area; and a fan having a blowing opening and blowing air toward the ventilation area from the blowing opening. The blowing opening and the ventilation area are different in size and/or position in a direction intersecting a flow of the air. The cooling unit further includes a filter installed between the blowing opening and the ventilation area to remove foreign substances in the air blown to the ventilation area. The filter has a wall guiding the air to the ventilation area from the blowing opening by connecting the blowing opening and the ventilation area at a part of a portion that is a difference in size and/or position between the blowing opening and the ventilation area.

Abstract: Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic system having multiple different types of electronic components. The apparatus includes a container sized to receive the electronic system, a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container, and a manifold structure associated with the container. The manifold structure includes a coolant jet plenum with an inlet opening in fluid communication with the coolant inlet port, and one or more jet orifices in fluid communication with the coolant jet plenum. The jet orifices are positioned to facilitate cooling of at least one electronic component of the multiple different types of electronic components by jet impingement of coolant thereon when the electronic system is operatively positioned within the container for immersion-cooling thereof.

Abstract: A dampening mechanism for an electrical for an electrical switching apparatus, such as a draw-out circuit breaker, includes a mounting bracket coupled to the circuit breaker, a pivot member, at least one biasing element, and a damper. The circuit breaker is movable into and out of an installed position within a switchgear enclosure. The pivot member pivots between first and second positions corresponding to the circuit breaker not being fully installed and being disposed in the installed position, respectively. The biasing element biases the pivot member toward the first position. When the circuit breaker is moved toward the installed position, the second end of the pivot member engages at least one of a back panel and a ledge of the enclosure, thereby pivoting the pivot member toward the second position. When the pivot member is disposed in the second position, the damper is biased against the ledge of the enclosure to dampen undesired vertical motion of the circuit breaker.

Abstract: A heat-dissipating seat for exclusive use with notebook computers is provided. A cooling fan is provided in a base plate of the heat-dissipating seat. The base plate is bilaterally provided with retractable extension bars for expanding the base plate. Each of the extension bars has an end fixedly provided with a rotatable leg. The heat-dissipating seat has a compact, intricate design that allows easy portability.

Abstract: An electronic apparatus including a circuit board having multiple heat generating elements and a heat-dissipation module is provided. The heat-dissipation module includes a heat-dissipation plate and a heat pipe set. The heat-dissipation plate having a first surface and a second surface is disposed on the circuit board and having multiple contacting portions and at least one heat pipe protecting portion connecting the contacting portions. The contacting portions are used for receiving heat from the heat generating elements. A heat pipe accommodating groove passing through the heat pipe protecting portion is set on the first surface. The heat pipe set is disposed in the heat pipe accommodating groove of the heat-dissipation plate.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: A cover for an electronic device made of a transparent material and having a form factor that protects function buttons of the device from inadvertent actuation. The cover has an opening of a size, shape and location to afford access to an interface device for multi-way navigation with the cover in place. Protrusions in tabs at the sides of the cover snap into cutouts located midway along the side of the electronic device and may be used to hold the cover in place. The cover may be stored on the back of the device while the device is in use. The transparent nature of the cover affords viewing of a display screen with the cover in place.

Abstract: A mounting structure for a power module, in which a power module and a heat sink can be easily separated without additional labor and time and without requiring an extra disassembly space in a product and in which parts are not damaged during the disassembly. In the heat sink (5a), screw holes (7a) having female screw threads into which power module fixing screws (2a) are screwed are formed so as to penetrate a power module mounting surface (5c) of the heat sink (5a) and heat radiation fins (9a). The power module fixing screw (2a) is constructed such that, to mount the power module (3) on the heat sink (5a), the screw head of the power module fixing screw (2a) is tightened from the printed circuit board (4a) side with a tool (8a) and that, to remove the power module (3) from the heat sink (5a), the power module fixing screw (2a) is loosened with the tool (8a) from the heat radiation fin (9a) side on the opposite side of the screw head.

Abstract: A heat dissipation device is provided for dissipating heat from a heat source inside a notebook computer, and includes a hood, a bottom board, a thermal insulation layer, and at least one fan. The hood and the bottom board together define a heat dissipation channel. The bottom board integrally forms a plurality of fins and pegs. The bottom board is set above the heat source. The fan is set above the bottom board to efficiently expel heat from the inside to the outside. With the plurality of fins and pegs, the heat dissipation surface area of the bottom board and the heat source is increased and the overall heat dissipation performance is enhanced.

Abstract: A heat dissipation device includes a heat sink, a fan mounted on a top side of the heat sink, and a wire clip pivotally engaging with the heat sink and pressing the fan toward the heat sink. The heat sink includes a base, and a plurality of fins extending from the base. The fan includes a bracket. The clip includes a pivoting portion pivotally engaging with a fin of the heat sink, an engaging portion connecting with an end of the pivoting portion and an operating portion extending from another end of the pivoting portion. The operating portion is pressed downwardly to engage with the heat sink and to cause the engaging portion to rotate towards the fan and press the bracket of the fan toward the heat sink thereby securing the fan to the heat sink.

Abstract: An electrical switching apparatus mounting apparatus includes a base with a planar portion having a first side and an opposite second side. A number of first adjustable members are coupled to the opposite second side. Each of the first adjustable members includes a first end and an opposite second end. A number of second adjustable members are coupled transverse to the first adjustable members and include a first end and an opposite second end. At least one of the first end and the opposite second end of at least one of the first adjustable members and the second adjustable members is adjustable generally toward or generally away from the base. At least one of the first end and the opposite second end of the at least one of the first adjustable members and the second adjustable members is coupled to a number of walls of a switchgear enclosure.

Abstract: A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: A method of providing utilities to a computer data center is discussed. The method includes initially connecting one or more non-evaporative cooling units to a data center as primary cooling plants, obtaining a government-issued water permit, and after obtaining the government-issued water permit, transitioning primary cooling for the data center to one or more evaporative cooling towers.

Abstract: A heat dissipation structure includes an electronic device, and a cooling device mounted to the electronic device. The electronic device includes a housing, and a heat generating element mounted in the housing. The housing defines an opening. The cooling device comprises a shell abutting against the heat generating element through the opening, a number of fins extending from the shell, a fan mounted to the shell, an air intake, and an air outlet. The air intake and the air outlet are located outside the housing.

Abstract: An energy storage pack cooling system including upper and lower respective terminal heat sinks thermally connected to respective upper and lower terminals of energy storage cells above and below upper and lower ends of an enclosure of an energy storage cell pack; and a blower and cooling assembly that circulates a heat transfer fluid past the upper and lower respective terminal heat sinks outside of the enclosure to cool the energy storage cells without circulating the heat transfer fluid past energy storage cell bodies of the energy storage cells enclosed within the enclosure.

Abstract: A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).

Abstract: A power module assembly (400) with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate (410) with passageways or openings (414) for coolant that extend through the plate from a lower surface (411) to an upper surface (412). A circuit substrate (420) is provided and positioned on the spreader plate (410) to cover the coolant passageways. The circuit substrate (420) includes a bonding layer (422) configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer (422) may be solder material which bonds to the upper surface (412) of the plate to provide a continuous seal around the upper edge of each opening (414) in the plate. The assembly includes power modules (430) mounted on the circuit substrate (420) on a surface opposite the bonding layer (422). The power modules (430) are positioned over or proximal to the coolant passageways.