Abstract: A subunit is provided for a motor control center including an enclosure, a number of compartments, a plurality of power lines, and a number of covers for covering the compartments. The subunit includes a housing removably disposed within a corresponding one of the compartments, a plurality of electrical contacts movably coupled to the housing, and an actuating assembly for moving the electrical contacts into and out of electrical contact with the power lines. The subunit further includes at least one of a locking assembly, a panel assembly, and a secondary disconnect assembly. The locking assembly locks the position of the electrical contacts and restricts access to the actuating assembly. The panel assembly is pivotable and translatable with respect to the subunit housing. The secondary disconnect assembly is independent from the actuating assembly in order that movement of the electrical contacts does not move the secondary disconnect assembly.

Abstract: An exemplary electronic device assembly includes a printed circuit board with an electronic component thereon, and a heat dissipation device. The heat dissipation device includes a heat sink mounted on the printed circuit board and a heat pipe pivotably engaged with the heat sink. The heat sink includes a main body defining a transverse channel therethrough and an injection aperture at a top of the main body to communicate the channel and an exterior of the main body. The heat pipe is pivotably engaging in the channel of the main body. A gap is defined between the heat pipe and the heat sink. Heat conductive grease is injected into the channel and filled in the gap between the heat pipe and the heat sink to thermally connect the heat sink with the heat pipe.

Abstract: A fan [36] and storage device [37] mounting assembly [1] for an electronic device comprises a base [2] having opposing front [4] and rear [5] walls. The rear wall [5] has a plurality of ventilation openings [11] provided therein. A support [16] has a fan [36] mount [32] arranged adjacent to the front wall [4] and substantially perpendicular thereto and a storage device [37] receiving opening [20] arranged between the fan mount [32] and the ventilation openings [11].

Abstract: A radiator having a radiator fin sandwiched between and joined to a top plate and a bottom plate is provided on an insulating substrate, which has a semiconductor element arranged on one face side thereof, on the other face side thereof. The radiator fin is a corrugated fin that includes a first region that includes a joint peak portion joined to the bottom plate and has a height in an amplitude direction which is substantially equal to a distance between the top plate and the bottom plate, and a second region that includes a non-joint peak portion separated from the bottom plate by a predetermined gap and has a height in the amplitude direction which is smaller than the distance between the top plate and the bottom plate.

Abstract: Use of vortex generators to improve efficacy of heat sinks used to cool telecommunications, electrical and electro-optical components.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves using multiple cold row encapsulation structures to cool the servers installed on the racks.

Abstract: The invention relates to an illumination device (1) comprising at least one preferably ceramic substrate plate (2), at least one luminous element (3) arranged on a front side (A) of the substrate plate (2) in particular at least one light emitting diode (LED) (3), and at least one preferably metallic heat sink (4) connected, in particular adhesively bonded and/or soldered, to a rear side (B) of the substrate plate (2) over a large area, wherein the coefficients of thermal expansion of substrate plate (2) and heat sink (4) differ at least by the factor 1.5, in particular by a factor greater than 2. The heat sink (4) has at least one preferably linear recess (6) on its side facing the rear side (B) of the substrate plate (2).

Abstract: A motor controller, which is inexpensive and has small size, is provided by reducing the size of a heat sink used in the motor controller and the number of all parts of the motor controller, wherein said motor controller includes a heat sink, a power semiconductor modules that is in close contact with the heat sink, a substrate (4) that is electrically connected to the power semiconductor module, and a fan (6) that generates the flow of external air and supplies cooling air to the heat sink, wherein said heat sink is formed by combining two kinds of heat sinks, which include a first heat sink (7) and a second heat sink (8), so as to conduct heat therebetween, and, wherein said power semiconductor module is in close contact with the second heat sink (8).

Abstract: A semiconductor module has switching semiconductor elements connected in parallel to each other and at least a free wheeling semiconductor element reversely connected in parallel to the switching semiconductor elements. The free wheeling semiconductor element is placed between the switching semiconductor elements. At both end parts of the semiconductor elements, each of the switching semiconductor elements is placed. A longitudinal side of each of the switching semiconductor elements and the free wheeling semiconductor element is placed in parallel to a short side of the semiconductor module. An electric-power conversion device has a plurality of arms. Each arm is composed of the semiconductor elements.

Abstract: A load center is equipped with a neutral phase conductive rail with breaker mounting and retention features providing automatic neutral connection for a plug-on mounted AFI and/or GFI circuit breaker. Breakers may be designed to have specific interfaces to the breaker mounting and retention features of the load center rails. The neutral rail may have two pieces including a breaker undercut positioning rail shorted to a standard neutral rail, or a neutral rail may be designed to have all mounting features integrated therewith. The new panel is compatible with non-AFI and non-GFI breakers.

Abstract: A subsea switchgear apparatus including a frame, at least one electrical power inlet mounted to the frame, at least one electrical power outlet mounted to the frame, a distribution chamber mounted to the frame, and at least one canister mounted to the frame. The at least one canister includes a chamber accommodating at least one high voltage circuit breaker. Electrical connections are arranged in the distribution chamber for electrically connecting a respective circuit breaker of a canister to an associated power inlet and power outlet of the switchgear apparatus. The chamber of the respective canister is separated from the distribution chamber by a pressure barrier.

Abstract: An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.

Abstract: An external heat dissipation device includes a housing, a circuit board placed in the housing, a fan electrically connected to the circuit board, and a wire electrically connected to the circuit board to power the fan. The housing includes an installation dock defining a receiving space for receiving the fan therein, and an insertion portion extending from the installation dock. A through hole is defined in the installation dock. An air passage is defined in the insertion portion. The fan includes a casing defining a first air hole communicating with the through hole and a second air hole communicating with the air passage.

Abstract: A cooling system includes a plurality of fans and a fan bracket accommodating the fans. Each fan comprises a fan intake and a fan outlet. The fan bracket defines a plurality of air inlets and a plurality of air outlets therein. The fan bracket is provided with a fan guard in each air outlet and a plurality of noise-reducing holes in the fan guard. The air inlets of the fan bracket communicate with the fan intakes and the air outlets of the fan bracket communicate with the fan outlets, respectively. Airflow generated by the fans through the fan outlets comprises a portion exiting through the noise-reducing holes.

Abstract: Cooling systems (1) suitable for cooling an electronic unit (2) or assembly. The cooling system is provided with a cooling channel (6). An electronic unit (2) rests over a heat-conducting cooler wall (7). A coolant guide apparatus (11) is provided in the cooling channel (6) and has insert conduit elements (13) for guiding the coolant onto the cooler wall indentations (12). The end of each insert conduit (13) opening to the cooling channel (6) may be provided with an inclined entry surface (19) and an inlet opening (20) towards the inner longitudinal channel (14). A plurality of such coolant guides (11) may be arranged in series so that, for example, the same cooling medium flows through a plurality of semiconductor modules in succession.

Abstract: A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.

Abstract: A light-emitting diode (LED) heat dissipation aluminum bar and electricity conduction device includes a heat dissipation aluminum bar having a structure formed of multiple sections each having multiple heat dissipation fins. The heat dissipation aluminum bar forms a LED circuit board receiving slot and power channels and each power channel receives therein an insulation that encloses an electrically conductive bars. When an LED circuit board is received and secured in the LED circuit board receiving slot by fasteners, the fasteners, which are made electrically conductive, penetrate the insulations to contact the electrically conductive bars so as to supply electricity to the LED circuit board at the same time of fixing the LED circuit board. The LED circuit board has a structure formed of multiple sections interconnected to each other to allow for adjustment of the overall length thereof.

Abstract: A heat transfer system is provided. The system includes a heat sink disposed proximate a first circuit. An air mover is adapted to provide airflow, and at least a portion of the airflow can flow through the heat sink along a flow path having a path length. A first portion of the airflow flows along the entire path length through the heat sink. A remaining portion of the airflow exits the heat sink prior to flowing the entire path length.

Abstract: A heat dissipating assembly includes a heat generating component, a heat sink, and a fan. The heat sink includes a base attached on the heat generating component and a plurality of fins attached on the base. The fan is attached to a top surface of the fins. The top surface of the fins is wider than the base. The fins incline inwardly from the top surface to the base for gathering cooling air from the fan to the base.