Abstract: A system is disclosed to detect failure of a diode that is connected in series with a battery and a contactor or other switch configured to connect the battery to a load when the contactor or other switch is in a closed position and to isolate the battery from the load when the contactor or other switch is in an open position. In various embodiments, the system includes a high value resistor connected between the anode terminal of the diode and ground, the connection to the anode terminal being on a load side of the contactor or other switch; and a voltage meter configured to measure a voltage across the high value resistor at least during a test in which a voltage is applied to a bus associated with the load while the contactor or other switch is in the open position.

Abstract: Systems and methods to investigate multi-pipe structures for detection of corrosion and quantitative assessment of thickness in the multiple pipes can be implemented in a variety of applications. Systems can include a set of transmitters and multiple receivers arranged on a tool structure with variable distances to the transmitters of the set of transmitters, where the receivers are arranged to measure electromagnetic responses from a multi-pipe structure to excitation of the set of transmitters with the tool structure disposed in the multi-pipe structure. The electromagnetic responses may include responses correlated to a near field zone, a transition zone, and a far field zone, where the electromagnetic responses can be processed to recover individual thicknesses of each pipe of the multi-pipe structure. Additional apparatus, systems, and methods are disclosed.

Abstract: Methods, systems, and apparatus for testing semiconductor devices.

Abstract: A three-dimensional (3D) signal transfer structure of a probe card device includes a transfer plate, a supporting frame, and a guiding plate. The transfer plate has a first surface and a second surface that is opposite to the first surface. The transfer plate includes a plurality of signal circuits each having a signal contact arranged on the first surface. The supporting frame is abutted against and fixed onto the first surface of the transfer plate. A portion of the first surface abutted against the supporting frame is arranged outside the signal contacts. The guiding plate has a plurality of thru-holes and is disposed on the supporting frame. The guiding plate, the supporting frame, and the transfer plate jointly and surroundingly define a receiving space, and the signal contacts of the transfer plate are arranged in the receiving space.

Abstract: A superconducting quantum interference devices (SQUID) comprises a superconducting inductive loop with at least two Josephson junction, whereby a magnetic flux coupled into the inductive loop produces a modulated response up through radio frequencies. Series and parallel arrays of SQUIDs can increase the dynamic range, output, and linearity, while maintaining bandwidth. Several approaches to achieving a linear triangle-wave transfer function are presented, including harmonic superposition of SQUID cells, differential serial arrays with magnetic frustration, and a novel bi-SQUID cell comprised of a nonlinear Josephson inductance shunting the linear coupling inductance. Total harmonic distortion of less than ?120 dB can be achieved in optimum cases.

Abstract: An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.

Abstract: Fluxgate based current transducer for measuring a primary current flowing in a primary conductor, comprising a fluxgate magnetic field detector and a measuring circuit. The fluxgate magnetic field detector includes an excitation coil driven by an oscillating excitation current (Ifluxgate) supplied by the measuring circuit. The measuring circuit is configured to provide a first and a second measurement output of the oscillating excitation current. The transducer further comprises a signal output processing unit for comparing in real-time the first and second measurements outputs, wherein the signal output processing unit is configured to send an error signal output if the difference between said first and second measurements outputs exceeds a tolerance value.

Abstract: A metal detector (1) has a drive coil (L61) and at least one detection coil (L62, L63) that detect fluctuations in a magnetic field generated by the drive coil, caused by metallic particles present in an inspected object. A multi-frequency transmitter unit (10) has a converter (4) with a plurality of drive switches (S41, S42; S43, S44) driven by a drive controller (2). The drive switches alternately conduct a drive current through the drive coil to generate an electromagnetic field with two or more different frequency components. A waveform of the drive current is determined, as is at least one pulse-modulated (PXM) signal corresponding to the determined waveform. The determined PXM-signal is determined online or is stored in a memory module (231; 232). The determined PXM-signal is generated and applied to control the drive switches. The drive current can be applied to the drive coil through an admittance unit (5).

Abstract: A closed-loop current transducer comprising a magnetic circuit core made of a material with a low magnetic reluctance to conduct magnetic flux and concentrate a magnetic field, a magnetic field detector positioned in a magnetic circuit gap of the magnetic circuit core, and a compensation coil assembly comprising a compensation coil and a compensation coil support comprising a coil support bobbin, the compensation coil being wound around the coil support bobbin. The magnetic circuit comprises a first longitudinal branch, a second longitudinal branch, and first and second end branches interconnecting the first and second longitudinal branches such that the branches surround a central opening configured to receive one or more primary conductors therethrough, the magnetic circuit being formed of first and second parts assembled together from opposed ends of the compensation coil support.

Abstract: Disclosed are a reliability test fixture and an online test device for a flexible display component. The fixture comprises a support and a rotating shaft rotatably mounted on the support. An engagement recess for fixing a flexible display component is provided in an axial direction on the surface of the rotating shaft. A test module used to detect an electrical parameter of an internal circuit of the flexible display component is disposed inside the rotating shaft. The test module has a test contact for electrically connecting to the flexible display component. During a test, the flexible display component is fixed in the engagement recess and is electrically connected to the test module.

Abstract: The present disclosure relates to ensuring contact between core halves of a current transformer. For example, a current transformer (CT) may include a split core comprising a first core half having a first plurality of faces and a second core half having a second plurality of faces. Each face of the first core half may contact a corresponding face of the second core half to allow magnetic flux to flow through the split core to induce current on windings of the CT. The CT may include a first housing that houses the first core half and a second housing that the second core half. The CT may include a biasing element that biases the second core half towards the first core half to ensure that each face of the second core half contacts the corresponding face of the first core half.

Abstract: A switch group selectively outputs a signal input from IC terminals and a reference voltage. Another switch group selectively outputs a signal input from IC terminals and a reference voltage. A differential amplifier amplifies a differential voltage between a signal output from the switch group and a signal output from the another switch group. The switch group and the another switch group include the same number of switches. When to select any of signals input from the IC terminals in the switch group, a reference voltage is selected in the another switch group. When to select any of signals input from the IC terminals in the another switch group, a reference voltage is selected in the switch group.

Abstract: A probe pin includes a first contact part and a second contact part; a middle part located between the first contact part and the second contact part; a first flexible part configured to move the first contact part relative to the middle part in the first arrangement direction; and a movable part configured to move the second contact part relative to the middle part in a direction intersecting with the first arrangement direction.

Abstract: A system and method for defect localization in embedded memory are provided. Embodiments include a system including automated testing equipment (ATE) interfaced with a wafer probe including a diagnostic laser for stimulating a DUT with the diagnostic laser at a ROI. The ATE is configured to simultaneously perform a test run at a test location of the DUT with a test pattern during stimulation of the DUT. Failing compare vectors of a reference failure log of a defective device are stored. A first profile module is configured to generate a first 3D profile from each pixel of a reference image of the defective device. A second profile module is configured to generate a second 3D profile from each pixel of the ROI of the DUT. A cross-correlation module is configured to execute a pixel-by-pixel cross-correlation from the first and second 3D profiles and generate an intensity map corresponding to a level of correlation between the DUT and defective device.

Abstract: A detection circuit module for use with a household appliance door to detect when the door is closed and/or locked, the detection circuit module having a first and a second contact configured for electrical connection with the household appliance door so as to be operable with the household appliance door, the detection circuit module including: a door closing switch arranged electrically in series between the first connecting contact and an actuator; a door locking switch arranged electrically in series between the actuator member and the second connecting contact; and a diode arranged in series with the actuator and the second connecting contact and the diode being arranged electrically in parallel with the door locking switch.

Abstract: A method includes loading the semiconductor structure on a stage; providing a detector disposed above the semiconductor structure and the stage; applying a voltage to the semiconductor structure; identifying a portion of the semiconductor structure at a temperature substantially greater than a predetermined threshold by the detector; rotating the stage and recording a rotation of the stage after identifying the portion of the semiconductor structure; and deriving a position of the portion of the semiconductor structure based upon the rotation of the stage.

Abstract: A device for the hot measuring, during rolling, of a transverse size of a metal profile (12) includes a transmission element with at least two sections distinct and spatially separated from each other and disposed along a nominal axis of feed of the metal profile, configured to generate an electromagnetic field with a desired profile of force lines, and a reception element disposed along the nominal axis in a position comprised in the overall longitudinal bulk of the transmission element (14) and configured to detect a signal relating to the variations of the electromagnetic field due to the passage of the metal profile.

Abstract: A magnetic flow meter includes electrode sensors generating a sensor signal indicative of flow of a liquid through a conduit. A noise identification module identifies a noise level in the sensor signal and a contaminant identification module uses the noise level to determine whether there is a contaminant in the liquid in the conduit.

Abstract: A method for the hot measuring of a transverse size of a metal profile to obtain a diameter and/or a mean thickness includes providing power with a sinusoidal current having at least two frequencies, a transmission element having at least two sections distinct and spatially separated from each other and disposed along a nominal axis of feed of the metal profile, generating an electromagnetic field with a desired profile of the force lines, and detecting a signal relating to the variations of the electromagnetic field due to the passage of the metal profile through the sections of the transmission element using a reception element having one or more sections distinct and spatially separated from each other and disposed along the nominal axis in a position of the transmission element.

Abstract: A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.