Abstract: A method of making a slow wave inductive structure includes depositing a first dielectric layer over a first substrate. The method further includes forming a first conductive winding in the first dielectric layer. The method further includes bonding a second substrate to the first dielectric layer, wherein the second substrate is physically separated from the first conductive winding, and the second substrate has a thickness ranging from about 50 nanometers (nm) to about 150 nm. The method further includes depositing a second dielectric layer over the second substrate. The method further includes forming a second conductive winding in the second dielectric layer, wherein the second substrate is physically separated from the second conductive winding.

Abstract: A speaker grille for a vehicle includes a steel plate, an adhesive layer formed on the steel plate, and a metal sheet layer formed on the adhesive layer. The speaker grille is configured such that the steel plate, the adhesive layer, and the metal sheet layer are stacked in sequence. The speaker grille has a plurality of holes formed through the speaker grille, and the holes may be formed by punching. A method of method for manufacturing the speaker grille can include a step of manufacturing a stack by forming the adhesive layer on the steel plate and forming the metal sheet layer on the adhesive layer; and a step of forming the plurality of holes through the stack by perforating the stack.

Abstract: A method for repairing a light-emitting device, which comprises a plurality of light-emitting units disposed on a circuit substrate with at least one of the plurality of light-emitting units being damaged. The method for repairing a light-emitting device including the following steps is provided: removing the at least one damaged light-emitting unit from the circuit substrate to form an unoccupied position on the circuit substrate; providing a good light-emitting unit on a bottom of which a volatile adhesive material has been applied; using a pick and place module to place the good light-emitting unit at the unoccupied position on the circuit substrate; and melting and solidifying the volatile adhesive material so that the good light-emitting unit is affixed at the unoccupied position.

Abstract: A method for fabricating a substrate having an electrical interconnection structure is provided, which includes the steps of: providing a substrate body having a plurality of conductive pads and first and second passivation layers sequentially formed on the substrate body and exposing the conductive pads; forming a seed layer on the second passivation layer and the conductive pads; forming a first metal layer on each of the conductive pads, wherein the first metal layer is embedded in the first and second passivation layers without being protruded from the second passivation layer; and forming on the first metal layer a second metal layer protruded from the second passivation layer. As such, when the seed layer on the second passivation layer is removed by etching using an etchant, the etchant will not erode the first metal layer, thereby preventing an undercut structure from being formed underneath the second metal layer.

Abstract: A method for crimp mounting a high-frequency (HF) electrical crimp connecting device to an electrical cable includes the steps of crimping a ferrule into a mounting state wherein its maximum diameter is fixed, and arranging the ferrule in its mounting state over an exposed shielding conductor of the cable. A terminal is crimped onto an inner conductor of the cable, and a shielding contact sleeve is placed over the cable and crimped, at least in the area of the ferrule. A target impedance or impedance range of the resulting cable is set according to at least one of a dimension of at least one crimping tool used to perform the crimping steps, or at least one dimension of at least one of the resulting crimps performed by the at least one crimping tool.

Abstract: A method is provided that integrated a unique set of structural features for concealing self-powered sensor and communication devices in aesthetically neutral, or camouflaged, packages that include energy harvesting systems that provide autonomous electrical power to sensors, data processing and wireless communication components in the portable, self-contained packages. Color-matched, image-matched and/or texture-matched optical layers are formed over energy harvesting components, including photovoltaic energy collecting components. Optical layers are tuned to scatter selectable wavelengths of electromagnetic energy back in an incident direction while allowing remaining wavelengths of electromagnetic energy to pass through the layers to the energy collecting components below.

Abstract: The technology relates to a memory insertion machine for inserting memory modules into memory sockets on a circuit board. The memory insertion machine may include one or more insertion rods moveably mounted to one or more vertical guides and an insertion controller. The insertion controller may be configured to apply an insertion force to a memory module in a memory socket by controlling the movement of the one or more insertion rods on the one or more vertical guides. The movement of the one or more insertion rods may have a gradually decreasing deceleration as the insertion rods move towards the memory socket.

Abstract: The present disclosure is directed to methods for low-cost, high-volume production of strain gages having substantially uniform gage-to-gage resistances. Strain gages in accordance with the present disclosure are sculpted from a device layer of a semiconductor-on-insulator wafer using deep reactive ion etching, thereby enabling well-controlled electrical properties and physical dimensions of the strain gages. In some embodiments, groups of fully fabricated strain gages are physically connected to handling frames via sprues to facilitate handling, automated assembly, and/or tracing of individual gages from the beginning of fabrication through final packaging. In some embodiments, sprues are configured to mitigate accidental separation of the gages from their frames while simultaneously enabling their removal in response to specific forces applied by a handling tool.

Abstract: A method for aligning interconnects that includes trimming and forming a frame of strips of interconnects. The frame of strips of interconnects includes interdigitated pins. The method also includes removing siderails from the frame of strips of interconnects to provide an array of strips of interconnects. The method includes aligning a first set of strips of interconnects in the array of strips of interconnects such that pins of the first set of strips of interconnects are aligned with pins of a second set of strips of interconnects in the array of strips of interconnects. A strip of interconnects of the first set of strips of interconnects are adjacent to a strip of interconnects of the second set of strips of interconnects to provide an aligned array of strips of interconnects. The method further includes singulating the aligned array of strips of interconnects.

Abstract: Discussed is a substrate chuck for allowing one surface of a substrate to be in contact with a fluid, the substrate chuck including a first frame having a hole at a central portion thereof; a second frame having a hole at a central portion thereof and disposed to overlap the first frame; and a frame transfer part configured to vertically move the second frame with respect to the first frame, wherein the first frame includes: a bottom portion at which the hole is formed; and a sidewall portion formed on a peripheral edge of the bottom portion, and wherein a height of the sidewall portion is greater than a depth at which the substrate is placed into the fluid.

Abstract: A manufacturing method of fan stator structure includes the steps of providing a fan stator; providing a plurality of coil lead wire holders at an end of the fan stator; and winding lead wires on the fan stator to form coils, and setting and connecting a front end and a back end of each of the lead wires to the coil lead wire holders. The above method eliminates the drawbacks of the conventional fan stator coil winding operation, such as requiring manual twisting and trimming of the lead wire front ends and back ends and leaking of tin solder occurred during welding of the lead wires to a circuit board.

Abstract: A method for manufacturing an electric machine having a stack of magnetic laminations including a stack of green blanks. A first green blank of the stack is printed. A separating layer is applied to the first green blank. At least a second green blank of a magnetic lamination is printed onto the first green blank with the separating layer. The green blanks are jointly sintered.

Abstract: Disclosed is a method of manufacturing a core sheet. The core sheet has an annular core back portion and a plurality of tooth portions extending from the core back portion toward a radial center thereof. The method includes a blanking step, a rolling step and a removing step. In the removing step, an insulation coating, which is on a region of a grain-oriented magnetic steel sheet for forming a band-shaped core back portion, on a band-shaped core back portion of a sheet piece or on the core back portion of the core sheet, is at least partially removed.

Abstract: A cable processing device (20) for processing a cable (15), which comprises a first positioning mechanism (30) comprising a first positioning drive (35) for vertically positioning a tool mounting (22) relative to the cable conveying direction (F) of a cable conveying mechanism (100), and a control mechanism (50), which is connected to the first positioning drive (35) for exchanging first control data. A second positioning mechanism (40), comprising a second positioning drive (45) for at least vertically positioning a first cable stop (25) relative to the cable conveying direction (F) of the cable conveying mechanism (100), is also present. The second positioning drive (45) is connected to the control mechanism (50) for exchanging second control data. The invention also relates to computer-implemented methods, a computer program product, as well as a computer readable storage medium.

Abstract: Devices, apparatus, systems, and methods for providing and retrofitting sprinkler heads. with a solid one-piece Teflon saddle and a stainless steel washer to replace a Beryllium washer with Teflon tape on both sides in sprinkler heads. The Teflon saddle can be formed from one piece of Teflon having a cylindrical base and an upper cylindrical section having a raised cylindrical rim, the upper cylindrical section having a wider diameter than the cylindrical base, and narrow depth central opening in the upper cylindrical section. The upper cylindrical section can have a bottom edge having an incline between approximately 10 degrees to approximately 20 degrees running from an outer perimeter to an inner end.

Abstract: Methods of fabricating tamper-respondent sensors with random three-dimensional security patterns are provided. The methods include establishing a security circuit pattern for a security circuit of a tamper-respondent sensor to enclose, at least in part, one or more components of a circuit board within a secure volume. The establishing includes determining in three-dimensions boundaries for the security circuit of the tamper-respondent sensor. The boundaries define a sensor volume which the security circuit is to fill in three dimensions. The establishing also includes generating at least one trace configuration for the security circuit pattern. The at least one trace configuration defines a random, three-dimensional security pattern to fill the sensor volume, and the at least one trace configuration establishes, at least in part, the security circuit pattern. The process further includes fabricating the tamper-respondent sensor based on the established security circuit pattern.

Abstract: A positioning fixture including a shielding member and a driving member is provided. The shielding member includes a sliding part slidably connected to a functional module, a guiding part, and a shielding part. The sliding part and the shielding part respectively extend from two opposite ends of the guiding part. The driving member is movably disposed on the functional module corresponding to the shielding member. The driving member includes a base part, a driving part that contacts the guiding part, and a pillar part, which protrudes from the base part and is adapted to pass through the guiding groove. When the functional module is positioned on the circuit board, the base part of the driving member is pushed by the electronic component, and the guiding part is pushed by the driving part, so that the shielding member slides and the shielding part shields a screw hole of the circuit board.

Abstract: A control device configured to control a component pickup and mounting operation of a component mounting machine; and multiple devices configured to execute the component pickup and mounting operation are provided. A device out of the multiple devices is attachably and detachably attached to the component mounting machine and includes a field programmable gate array that operates each function of the device by communicating with the control device. The field programmable gate array has a clock gating function of reducing an electric current flowing into the attachable and detachable device by stopping processing on a function that is not used, out of individual functions of the attachable and detachable device, when the attachable and detachable device is in a state capable of being removed by an operator.

Abstract: The present disclosure provides a mini or micro hand-held, portable, battery-powered 2-3 ton crimp tool capable of crimping conductors ranging between #22 AWG and #2 AWG to a termination. The crimp tool has a C-shaped head portion that uses linear motion to perform the crimp operation.

Abstract: In a preparatory process of a method of manufacturing a multilayer substrate, an insulating substrate is prepared, with a conductor pattern formed only on one surface of the insulating substrate. At that time, the conductor pattern is constituted of the Cu element, a Ni layer is formed on the surface of the conductor pattern that is on the side of the insulating substrate. In a first forming process, a via hole having the conductor pattern as the bottom thereof is formed in the insulating substrate. At that time, the Ni layer that is in the area of the bottom is removed. In a filling process, a conductive paste is filled in the interior of the via hole. In a second forming process, a stacked body is formed by stacking a plurality of the insulating substrates. In a third forming process, the stacked body is heated while being subjected to pressure.