Abstract: Methods for fabricating MEMS tuning fork gyroscope sensor system using silicon wafers. This provides the possibly to avoid glass. The sense plates can be formed in a device layer of a silicon on insulator (SOI) wafer or in a deposited polysilicon layer in a few examples.

Abstract: An electronic component mounting device is provided for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion. The electronic component mounting device comprises a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.

Abstract: A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.

Abstract: The invention relates to a method for producing an electrode stack from anodes (4) and cathodes (6) for a lithium-ion battery, in particular of an electrically driven motor vehicle, in which the cathodes (6) are provided in a first magazine (8) and are transported without grippers only in a first direction (R1) from the first magazine (8) into a chamber (12), in which the anodes (4) are provided in a second magazine (10) and are transported without grippers only in a second direction (R2) from the second magazine (10) into a chamber (12), wherein the cathodes (6) and anodes (4) are stacked alternately in the chamber (12), and in which the alternately stacked cathodes (6) and anodes (4) are aligned with one another, and pressed against one another, in the chamber (12). The invention also relates to an apparatus (16) for producing such an electrode stack (2).

Abstract: A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 ?m to 2 ?m on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.

Abstract: A method of manufacturing an electronic component includes preparing an unfired multilayer body, bonding one of first and second side surfaces of each unfired multilayer body to an adhesive sheet such that the unfired multilayer bodies are in at least one row, polishing the other side surface of each unfired multilayer body by rotating a polishing surface of a rotary polishing machine in contact with the other side surface of each unfired multilayer body, and forming a first insulating layer on the polished other side surface, wherein in the polishing the other side surface, at least one of the rotary polishing machine and the adhesive sheet is moved relative to the other to form a polish groove in the length direction, and the rotary polishing machine has a cylindrical shape and includes an outer circumferential surface that defines the polishing surface.

Abstract: A printed circuit board includes a printed wiring board including an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. A semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. Conductive members filled in the through-holes connect the element terminals and the wiring. The insulative substrate has elasticity in which an elongation percentage of the insulative substrate is 20% or more. The wiring is formed from a conductive polymer or an elastic conductive paste in which conductive particles are mixed into a resin material.

Abstract: A segmental calendering device includes a framework, a pair of left-rolling sliding guide mechanism, a pair of right-rolling sliding guide mechanisms, an upper-calendering roller and a supporting mechanism of the upper-calendering roller, a lower-calendering roller as well as a pressing mechanism. The upper-calendering roller is rotatably supported within the supporting mechanism of the upper-calendering roller and disposed above a position between a left wallboard and a right wallboard of the framework, and the supporting mechanism of the upper-calendering roller slides along the pair of left-rolling sliding guide mechanisms and the pair of right-rolling sliding guide mechanisms. The lower-calendering roller is disposed below the upper-calendering roller correspondingly and rotatably supported between the left wallboard and the right wallboard. The pressing mechanism is for applying a pressure on the supporting mechanism of the upper-calendering roller and for adjusting the pressure.

Abstract: The invention relates to an inspection unit intended for use in devices for transferring electronic components from a first substrate to a second substrate and/or for applying adhesive from a reservoir to the second substrate, comprising an image capturing unit, which is assigned an illumination unit, wherein the illumination unit is designed to direct light of different wavelengths onto a second holder, which in turn is designed to support an object located on the second substrate, which is to be captured by the image capturing unit, wherein a sixteenth, seventeenth, eighteenth and/or nineteenth conveying unit is designed to convey the respective image capturing unit and/or its associated optics, including focussing optics, a beam deflector and/or an illumination unit, along the second holder.

Abstract: A guide apparatus configured to transfer light-emitting devices in a liquid onto a substrate is provided. The guide apparatus includes a base configured to support the substrate; and a guide member configured to couple with the base to be seated on a mounting surface of the substrate in a state in which the substrate is supported on a surface of the base, wherein the guide member includes guide holes configured to respectively guide the light-emitting devices in the liquid to be disposed on the mounting surface of the substrate.

Abstract: A cable guiding device of a terminal applicator comprises a movable funnel portion defining a tapered opening sized to receive an end of a cable to be terminated, a funnel stop limiting motion of the movable funnel portion in a first direction, and a first elastic element biasing the movable funnel portion in the first direction.

Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.

Abstract: Provided is a method of manufacturing a laminated core by punching electrical steel strips including an insulation coating to obtain core single sheets and laminating the core single sheets, the method including: pressurizing two or more electrical steel strips using a guide roller to temporarily bond the electrical steel strips immediately before the punching; and obtaining the core single sheets by performing the punching after inserting the two or more electrical steel strips after the temporary bonding into a punching die.

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes for placing the semiconductor light-emitting diodes at predetermined positions on a substrate by using an electric field and a magnetic field, the substrate being accommodated in an assembly chamber accommodating a fluid, the device including a substrate chuck configured to dispose the substrate at an assembly position, wherein the substrate chuck includes a substrate support part configured to support the substrate on which an assembly electrode is formed, a rotating part configured to support the substrate support part, and a controller configured to control driving of the substrate chuck, wherein the substrate support part includes micro-holes for injecting a gas between the fluid and the substrate, and wherein the controller controls whether the gas is injected through the micro-holes according to whether the substrate is raised or lowered.

Abstract: The present invention relates to a metal card manufacturing method including the steps of: preparing a metal sheet having a given size capable of accommodating a plurality of individual cards; preparing a ferromagnetic insulating sheet made by containing epoxy in a ferrite to the same size capable of accommodating the plurality of individual cards as the metal sheet; preparing an inlay sheet on which antenna coils are printed to the same size as the insulating sheet and forming holes on at least one or more edges of stacked sheets formed by stacking a plurality of sheets inclusive of the insulating sheet and the inlay sheet; fitting the holes formed on the stacked sheets to pins located on a loading plate; placing the metal sheet on top of the stacked sheets; forming a metal card sheet through lamination among the metal sheet and the stacked sheets; and cutting the metal card sheet along individual card outlines of the plurality of individual cards.

Abstract: A pressing method operatively associated with a press apparatus includes: providing a first substrate connected with a flexible printed circuit board onto a stage; providing a second substrate onto the stage; arranging the flexible printed circuit board on the second substrate; pressing a pad electrode-free area of the flexible printed circuit board; and pressing first pad electrodes of the flexible printed circuit board and second pad electrodes of the second substrate.

Abstract: A flexible electronic circuit includes a plurality of leaves having a proximal section, a distal section, and an intermediate section. The plurality of leaves are bonded to each other within the distal section and loose within the intermediate section. The intermediate section also includes conductive connector pads for a wiring harness. A plurality of test connector pads are disposed on the plurality of leaves within the proximal section. The leaves within the proximal section may also be bonded to each other, for example in a ribbon or stepped configuration, in order to facilitate connection to testing apparatus. Once the circuit is tested, the proximal section can be severed from the intermediate section prior to installation of the circuit into a medical device, such as an intracardiac echocardiography catheter.

Abstract: A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond using a bond head having a first surface configured to couple to a chip that is to be bonded, and a second surface fixed to and disposed opposite the first surface. A first spring element having a first spring constant and a second spring element having a second spring constant are coupled to the second surface, where the first spring constant is different from the second spring constant.

Abstract: A method for manufacturing a fluid permeable heater assembly includes providing a heating element, and over-molding a cap on edge areas of one side of the heating element. The cap includes a hollow body having a first cap opening and a second cap opening. The first cap opening is opposite to the second cap opening, and the heating element is mounted on the cap such that the heating element extends across the first cap opening.

Abstract: A method of manufacturing a contact element for modelling electrical circuits, in which a sheet metal blank is stamped to obtain a hollow formed workpiece (1) having an inner hollow body (2) with a bottom (3), a shoulder (4), a support platform (5) for connecting wire, said support platform having sides (7) and (8), wherein an electroplated metal coating is applied onto the hollow formed workpiece (1), said hollow formed workpiece (1) is placed in an injection mold, an outer casing (9) is formed by filling the mold with a polymer material under pressure creating the outer casing (9) on the outside of the hollow body (2), and a permanent magnet (10) is pressed into the hollow (11) of the body (2).