Abstract: A transferring method includes providing an adsorption device, using the adsorption device to attract and hold a plurality of light emitting diodes (LEDs), providing a target substrate with a plurality of spots of anisotropic conductive adhesive on a surface of the target substrate; moving the adsorption device or the target substrate wherein each of the plurality of LEDs adsorbed by the adsorption device becomes in contact with one of the plurality of spots of anisotropic conductive adhesive; and curing the plurality of spots of anisotropic conductive adhesive on the target substrate and moving away the adsorption device.

Abstract: An electronic component mounting device is provided for mounting a plurality of electronic components, the plurality of the electronic component being placed in a predetermined portion, on a plurality of attachments each arranged at a predetermined interval from one another. The electronic component mounting device includes a removal mechanism for removing some of the plurality of the electronic components having been placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components so that intervals between the electronic components adjacent to one another are, respectively, the predetermined interval before reaching the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.

Abstract: A method is for making an electronic device that includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

Abstract: One exemplary aspect relates to a process and apparatus for selectively changing adhesion strength between a flexible substrate and a carrier at specific locations to facilitate shipping and subsequent removal of the flexible substrate from the carrier. The process includes providing a flexible substrate comprising a plurality of integrated circuits thereon providing a carrier for the flexible substrate and adhering the flexible substrate to the carrier by creating an interface between the flexible substrate and the carrier. The process further includes changing the adhesion force between the flexible substrate and the carrier at selected locations by non-uniform treatment of the interface between the flexible substrate and the carrier with an electromagnetic radiation source (e.g. a laser, flashlamp, high powered LED, an infrared radiation source or the like) so as to decrease or increase the adhesion force between a portion of the flexible substrate and the carrier at the selected location.

Abstract: The disclosed robotic system may include (1) a drive subsystem that translates the robotic system along a powerline conductor and (2) a rotation subsystem coupled to the drive subsystem, where (a) the rotation subsystem is coupled to a container that defines an arcuate volume about an axis such that the container partially surrounds the powerline conductor when the axis aligns with the powerline conductor, (b) the container carries a segment of fiber optic cable coupled to the powerline conductor, and (c) the rotation subsystem, while the drive subsystem translates the robotic system along the powerline conductor, rotates the container about the powerline conductor while the axis is aligned with the powerline conductor such that the segment of fiber optic cable is wrapped helically about the powerline conductor. Various other systems and methods are also disclosed.

Abstract: A process for making a circuit board modifies a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. The catalytic laminate is subjected to a drilling and resin-rich surface removal operation to expose the catalytic particles, followed by an electroless plating operation which deposits a thin layer of conductive material on the surface. A photo-masking step follows to define circuit traces, after which an electro-plating deposition occurs, followed by a resist strip operation and a quick etch to remove electroless copper which was previously covered by photoresist.

Abstract: A terminal crimping device 1 comprises a terminal cutting device 260 configured to cut off a terminal 130 provided on a band-shaped terminal carrier 140 from the terminal carrier, a terminal carrying unit 270 configured to carry the terminal 130 separated from the terminal carrier 140 by the cutting unit 260 to a terminal crimping work unit 14, a cable carrier 210 for carrying the electric cable 110 to the terminal crimping work unit 14, a crimping device 280 configured to crimp the terminal 130 carried to the terminal crimping work unit 14 by the terminal carrying unit 210 to the tip end of the electric wire 112 of the electric cable 110 carried to the terminal crimping work unit 14 by the cable carrying unit 210.

Abstract: A method for manufacturing a rotor core includes detecting a height of a projecting portion formed on a lower die by a height detecting unit, and placing onto the lower die a core body in which a magnet insertion hole is formed such that the projecting portion is positioned in the magnet insertion hole when the height detecting unit has determined that the height of the projecting portion is within a set range. Additionally, the method includes bringing a permanent magnet in the magnet insertion hole into contact with an upper end of the projecting portion, and placing onto the core body a holding member after bringing the permanent magnet into contact with the upper end of the projecting portion. Melted resin is injected into the magnet insertion hole in which the permanent magnet has been inserted after placing the holding member onto the core body.

Abstract: A method for forming a circuit board having a dielectric core, a foil top surface, and a thin foil bottom surface with a removable foil backing of sufficient thickness to absorb heat from a laser drilling operation to prevent the penetration of the thin foil bottom surface during laser drilling utilizes a sequence of steps including a laser drilling step, removing the foil backing step, electroless plating step, patterned resist step, electroplating step, resist strip step, tin plate step, and copper etch step, which provide dot vias of fine linewidth and resolution.

Abstract: A capacitor unit formed by a capacitor integrated structure is provided. The capacitor integrated structure is cut to form capacitor units separated from each other, and each of the capacitor units includes: a substrate; an isolation layer located on the substrate; a capacitor stacked structure located on the isolation layer, wherein the isolation layer electrically isolates the substrate from the capacitor stacked structure; and two electrode connectors located on the capacitor stacked structure and being exposed.

Abstract: A pressing tool for plastically deforming a tubular workpiece, and particularly a fitting is described. The pressing tool comprises a pressing jaw receptacle for coupling a pressing jaw assembly to the pressing tool. The pressing tool further comprises a drive which is adapted to drive a coupled pressing jaw assembly in order to apply force to a workpiece, and a sensor system which is adapted to identify a pressing jaw assembly and to provide corresponding sensor data, wherein a control is adapted to control the drive based on the sensor data. Also described are related methods, pressing jaw assemblies, and workpieces.

Abstract: A component mounting system for mounting a component on a substrate, the mounting system comprising a component supplying unit configured to supply the component; a substrate holding unit configured to hold the substrate in an orientation such that a mounting face for mounting the component on the substrate is facing vertically downward; a head configured to hold the component from vertically below; and a head drive unit that, by causing vertically upward movement of the head holding the component, causes the head to approach the substrate holding unit to mount the component on the mounting face of the substrate.

Abstract: A component supply device includes a tape feeder configured to feed a tape including a storage configured to store a component and a cover tape configured to cover an upper side of the storage, and a press including a columnar protrusion configured to press an upper surface of a portion of the cover tape that covers the storage.

Abstract: An electronic device manufacturing system includes a mainframe that includes a first transfer chamber and facets defining first side walls of the first transfer chamber. The facets include a first facet that has a first number of substrate access ports, a second facet that has a second number of substrate access ports, and a third facet that has the second number of substrate access ports. The second number of substrate access ports is different than the first number of substrate access ports.

Abstract: A die attach system is provided. The die attach system includes a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The die attach system also includes an imaging system for determining an alignment of the plurality of die with the verification substrate by imaging each of the plurality of die with respective ones of the plurality of substrate reference markers.

Abstract: A laminated core has a plurality of steel plates that are laminated in a thickness direction. The laminated core has a line shaped welding mark connecting a plurality of steel plates. The welding mark extends over the plurality of steel plates at the end face where the plurality of steel plates are exposed. The welding mark has a welding depth which fluctuates with a wavelength that is longer than the thickness of the steel sheet. The welding mark has a continuous portion in which the welding depth extends over a plurality of steel plates without fluctuation. Furthermore, the welding mark has a fluctuation portion in which the welding depth periodically fluctuates over a plurality of steel plates. The depth in the continuous portion is substantially equal to the depth in the fluctuation portion.

Abstract: A unit cell alignment apparatus that includes a base member, on the upper surface of which unit cells constituting an electrode assembly are stacked parallel thereto, a first guide member located at one side of the base member, the first guide member being disposed so as to be perpendicular to the upper surface of the base member, a second guide member located at the base member, the second guide member being disposed so as to be perpendicular to the upper surface of the base member while being at right angles to the first guide member, and an inclination adjustment member configured to adjust the inclination of the base member.

Abstract: A robotic surgical tool is disclosed. The robotic surgical tool can comprise an end effector comprising a firing member; a drive system responsive to a motor-driven input; and a proximal housing comprising a retraction mechanism. The retraction mechanism can comprise a control responsive to a manual input. The control can be rotatable in a first direction through a retraction motion and rotatable in a second direction through a reset motion. The retraction mechanism can further comprise a clutch coupled to the control. The clutch can be configured to drivingly engage the drive system as the control rotates through the retraction motion to supply a proximal retraction stroke to a firing bar and drivingly disengaged from the drive system as the control rotates through the reset motion to prevent any displacement of the firing bar by the retraction mechanism until the control is reset for a subsequent retraction motion.

Abstract: A wire stripping die is configured to be coupled to a crimping tool. The stripping die includes a die body, a first ridge, and a second ridge. The die body includes a first side, a second side, and a groove extending at least partially between the first side and the second side. The groove extends along an axis. The first ridge protrudes from a surface of the groove toward the axis by a first distance. The first ridge extends along at least a portion of the perimeter of the groove and extends at least partially around the axis. The second ridge protrudes from the surface of the groove toward the axis, and the second ridge extends parallel to the axis along at least a portion of the groove.

Abstract: A system for performing a direct transfer of a semiconductor device die includes a first conveyance mechanism to convey a first substrate, and a second conveyance mechanism to convey a second substrate with respect to the first substrate. The first substrate includes a first side and a second side, and the semiconductor device die is disposed on the first side of the first substrate. The second conveyance mechanism includes a first portion and a second portion to clamp the second substrate adjacent to a first side of the first substrate. The first portion of the second conveyance mechanism has a concave shape and the second portion of the second conveyance mechanism has a convex counter shape corresponding to the concave shape of the first portion. The system also includes a transfer mechanism disposed adjacent to the first conveyance mechanism to effectuate the direct transfer.