Abstract: A casting coil for a motor assembly, which is formed in a multi-layer structure, includes: a first coil formed to extend in one direction; a second coil bent to extend from an end of the first coil; a third coil bent to extend from an end of the second coil in a direction parallel to the first coil; and a fourth coil bent to extend from an end of the third coil in a direction parallel to the second coil. The first coil, the second coil, the third coil, and the fourth coil form one layer so that a hollow multi-layer structure is formed. A larger magnetic field can be formed by securing a slot filling factor of 50% or more of a stator in the same motor package.

Abstract: A bipolar forceps includes a mechanical forceps including first and second shafts each having a jaw member extending from a distal end thereof and a handle disposed at a proximal end thereof for effecting movement of the jaw members relative to one another about a pivot. A disposable housing is configured to releasably couple to at least one of the shafts and an electrode assembly is associated with the disposable housing. The electrode assembly includes electrodes releasably coupleable to the jaw members. At least one of the electrodes includes a knife channel configured to receive a knife blade therethrough to cut tissue grasped between the jaw members. A switch is configured to initiate delivery of electrosurgical energy from the source of electrosurgical energy to the electrodes. An actuation mechanism is configured to selectively advance the knife blade through the knife channel to cut tissue.

Abstract: The present disclosure is generally directed toward a method of assembling a plurality of rotor cores for an electric converter. The method includes placing, by a core robotic system employing force control feedback, a rotor core on a mandrel, and for each of the plurality of rotor cores, placing, a plurality of magnetizable inserts into a plurality of cavities in the rotor core by an insert assembly robotic (IAR) system employing force control feedback.

Abstract: A manufacturing method for a package substrate, the method including: forming a package substrate by a first dielectric layer formed by weaving at least fiberglass of a first width and a second dielectric layer formed by weaving at least fiberglass of a second width. The second width is different from the first width, and the weaving direction of the fiberglass in the first dielectric layer is 90° relative to the weaving direction of the fiberglass in the second dielectric layer.

Abstract: A system for inserting a wire into a semiconductor chip system includes positioning members for deploying and moving a length of the wire between a first end and a second end of a workspace. A handling device of the system is configured to handle the semiconductor chip, and is capable of placing the chip in an insertion position in which a groove of the chip is placed opposite the wire. A positioning member of the system is configured to arrange a longitudinal section of the wire along the groove, in forced abutment against a pad of the chip made of a bonding material having a melting point. A heating member of the system is configured to heat a zone comprising the pad to a processing temperature above the melting point to melt the pad and provoke insertion of the wire into the groove.

Abstract: A device for transferring heat from a device component to an environment includes a heat plate connected to a spring. A first fastener attaches the spring to the heat plate at a first location. A second fastener, such as a rivet, attaches the spring to the heat plate at each of a second and a third location. The second fastener includes a tab on and extending above the heat plate and corresponding tab slot on the spring. The spring is riveted to the heat plate at the first location and a second spring member accepts the tab at each of the second location and the third location. Ribs on a top surface of spring facilitate thermal coupling of the spring to the component when the device is assembled. One or more spring curvatures facilitate vertical deflection and horizontal extension of the spring during device assembly.

Abstract: A method is provided for fabricating a terminal electrode. The terminal electrode is applied on a multilayer ceramic capacitor (MLCC). The method prints inner electrodes on full area together with protective layers. The MLCC uses the thickness of thinned dielectric ceramic layers and the stacking of nickel inner-electrode layers. High capacitance is achieved at ends and sides with high electrode-to-ceramic ratios. Thus, the present invention uses a coating technology of ultra-low-temperature electrochemical deposition to fabricate low internal-stress MLCC terminal electrodes together with insulating protective layers for improving MLCC yield while cost reduced.

Abstract: A method of manufacturing a composite substrate that includes bonding a silicon (Si) wafer having an interstitial oxygen concentration of 2 to 10 ppma to a piezoelectric material substrate as a support substrate, and thinning the piezoelectric material substrate after the bonding. The piezoelectric material substrate is particularly preferably a lithium tantalate wafer (LT) substrate or a lithium niobate (LN) substrate.

Abstract: A method including an electric wire placing step for inserting a core-wire exposing portion of a terminal end of an electric wire between inner wall surfaces of a pair of piece portions of a terminal fitting that has a core wire connector composed of a bottom portion and the piece portions projected from two opposite ends of the bottom portion; and an electric wire holding-down step for holding down, by use of a holding-down jig made of a laser-transmissive material having a higher melting point than the core-wire exposing portion and the core wire connector have, the core-wire exposing portion from one sides of free ends of the piece portions and pressing the core-wire exposing portion against an inner wall surface of the bottom portion by use of the holding-down jig.

Abstract: A method for manufacturing a coil component includes preparing a wire; preparing a terminal electrode formed from a metal plate having a flat surface to which an end portion of the wire is to be connected, a low surface that is lower in a thickness direction of the terminal electrode than the flat surface, and a shift surface that connects the flat surface to the low surface and that increases a height in the thickness direction from the low surface to the flat surface; placing the end portion of the wire on the flat surface such that the wire is provided sequentially along the flat surface, the shift surface, and the low surface in this order from the end portion thereof; and thermally pressure-bonding the end portion of the wire to the flat surface such that the heated chip is pressed so that an edge thereof overlaps the low surface.

Abstract: An apparatus for manufacturing a stator includes a placement table, a supporting member and a resistance heating device. The placement table is configured to have a stator core, which has coil segments and insulators inserted in slots thereof, placed thereon. The stator core is formed of steel sheets that are laminated in an axial direction of the stator core. The coil segments together form a stator coil. The insulators are formed of a material that is foamable upon being heated. The supporting member is configured to support, in the axial direction of the stator core, distal end portions of teeth of the stator core so as to prevent gaps from being formed between the steel sheets forming the stator core. The resistance heating device is configured to heat, through energization of the stator coil, the insulators along with the stator coil and thereby cause the insulators to foam.

Abstract: A method of manufacturing a laminated steel plate capable of simplifying the manufacturing process. This is achieved by a method of manufacturing a laminated steel plate including a step of applying a mixture containing an oil and an adhesive composition for a laminated steel plate including at least one kind of a (meth)acrylate compound compatible with the oil and an organic peroxide to one side or both sides of a strip-like steel plate; and a step of punching a steel plate body from the strip-like steel plate with a punch portion of a press forming device, and laminating and bonding the steel plate bodies.

Abstract: A support pin arrangement determination assisting apparatus including a display unit which displays an image including a board image, the board image indicating a shape and an arrangement of a component on the board, a position input unit through which an arrangement position of the support pin is input, a display processing unit which causes the display unit to display a figure to be superimposed on the board image, the figure corresponding to the support pin of which the arrangement position is input, a storage unit which stores three-dimensional shape data of an electronic component and three-dimensional shape data of the support pin, an interference judging unit which judges whether or not one or some of the support pins of which arrangement positions input interfere an already mounted component, and an alarm unit which announces occurrence of interference if the interference judging unit judges the occurrence of interference.

Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.

Abstract: Provided is a method of manufacturing a wire with a terminal, the wire with a terminal including a wire, a metal terminal, and a sealing member obtained by curing an anti-corrosive material, the method using a manufacturing apparatus for the wire with a terminal including a transparent mold including a cavity portion, and a protruding portion that protrudes into the cavity portion, the method including an introducing step of placing, in the cavity portion, a non-sealed wire with a terminal before including the sealing member including the wire and the metal terminal, and introducing the anti-corrosive material into the cavity portion; and an irradiating step of irradiating the anti-corrosive material in the cavity portion with ultraviolet light through the transparent mold.

Abstract: A mounting apparatus for mounting a semiconductor chip on a mounting body includes a stage on which the mounting body is placed, a mounting head provided to be movable up and down above the stage and pressing the semiconductor chip against the mounting body, and a film disposition mechanism which interposes a belt-like cover film between the mounting head and the stage, and the film disposition mechanism includes a film feeding part having a feeding reel around which at least the cover film has been wound, a film recovery part having a recovery reel also winding up at least the fed cover film, and one or more relay shafts provided in the course of a path of the cover film from the feeding reel to the recovery reel and by which the cover film is folded back in order to bend a moving direction of the cover film.

Abstract: An assistant installation device, including a base, a carrier, and a handle, is provided. The base is adapted to be placed on a first object. The carrier is slidably disposed on the base and is adapted to carry a second object. The handle is connected to the base and the carrier. The handle is adapted to drive the carrier to move relative to the base, so that an assembling portion of the second object corresponds to an assembling portion of the first object.

Abstract: The present disclosure concerns a process for the blanking of metal parts (1) from a—layered basic material (51) composed of a number of mutually stacked individual layers (50) placed and clamped between a blanking die (80) and a blank holder (70) of a blanking device (100), wherein a blanking punch (31; 32) of the blanking device (100) is moved relative to the blanking die (80) to cut and separate the metal parts (1) from the basic material (51). According to the present disclosure, such multi-layer blanking process is carried out in two successive stages (I, II), whereof a first stage (I) entails the punching of holes (3) by a first blanking punch (31) without applying a counter punch and whereof a second stage (II) entails the blanking of the metal parts (1) by a second blanking punch (32) while being supported by a counter punch (40).

Abstract: The present invention provides an improved wedge connector removal tool for disconnecting a transmission or distribution line wedge tap connection and the methods of using such a tool. The tool may couple to a wedge connector around the transmission or distribution lines enabling a lineman's hands to be free from supporting the tool, and the wedge may be removed from the connection without the incorporation of powder charges.

Abstract: This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.