Abstract: An apparatus includes a splitter configured to split a laser beam into a plurality of beamlets, a phase modulator array optically coupled to the splitter and operative to produce phase differences between the beamlets, phase modulation electronics operably coupled to the phase modulator and configured to control an operation of the phase modulator array, a multicore photonic crystal fiber amplifier, the multicore photonic crystal fiber amplifier configured to amplify the beamlets output by the phase modulator array, thereby producing an amplified laser beam at an output thereof, and a waveguide optically coupled between an output of the phase modulator array and an input of the multicore photonic crystal fiber amplifier.

Abstract: There are provide a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a multilayer body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side, inner electrodes formed in the multilayer body and formed to be spaced apart from the third side or the fourth side by a predetermined distance, groove portions formed on at least one of top and bottom surfaces of the multilayer body and formed parallel to the third or fourth side by a predetermined distance from the third side or the fourth side, and outer electrodes extended from the third side and the fourth side to the top surface or the bottom surface of the multilayer body to cover the groove portions.

Abstract: A method for joining and sealing two grooved-ended pipe segments without disassembling a coupling is disclosed. The coupling has a housing with upper and lower arcuate housing segments and left and right bridge segments. Each bridge segment has at least one set of dihedrally angled faces that engage corresponding faces each in the upper and lower housing segments. Drawing the upper and lower segments inwardly together along a first axis, presses each bridge segment inward along a second axis roughly tangential to the first axis. All segments are loosely pre-assembled into a coupling which has a one-piece circular sealing gasket that has an inward circumferential and centrally positioned pipe stop that has an inner diameter smaller than an outer diameter of the pipes to be joined.

Abstract: An apparatus for removing a semiconductor chip from a board may include: a laser configured to irradiate the board with a laser beam to heat bumps mounting the semiconductor chip on the board; a picker configured to separate the semiconductor chip from the board; a vacuum portion configured to provide a vacuum to the picker; and an intake. If solder pillars, that are residues of the bumps, are melted by the laser beam, the intake removes the solder pillars using the vacuum provided from the vacuum portion. An apparatus for removing a semiconductor chip from a board may include: a stage configured to support the board on which the semiconductor chip is mounted by bumps; a laser configured to irradiate the board with a laser beam to heat the bumps mounting the semiconductor chip on the board; and a picker configured to separate the semiconductor chip from the board.

Abstract: An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head.

Abstract: An electrical transmission line repair apparatus comprising a first end section, a second end section and a link member. The first and second end sections are spaced apart from each other and each configured to receive and releasably retain a conductor thereacross. The link member is positioned on one side of the first and second end sections, so that the first and second end sections can be coupled to a conductor on either side of a link member, suspension or other device from below, and without decoupling or de-energizing the transmission line. In addition, the installation of the same and the clamping can be achieved from below the conductor upon positioning. That is, the link member or members do not straddle the transmission line, requiring dismantling of the dead end configuration, or the disassembly of the link member from the first and second end section.

Abstract: A method of assembling a capacitor assembly comprises positioning a plurality of capacitors in respective sockets formed in a non-conductive matrix by vibrating the plurality of capacitors and disposing the array of capacitors and the non-conductive matrix between a positive terminal plate and a negative terminal plate. The capacitors are electrically coupled with the positive terminal plate and the negative terminal plate and mechanically secured between the positive terminal plate and the negative terminal plate. The array of capacitors includes a void cooperating with a first opening in the positive plate and a second opening in the negative plate to form a passage. The void includes a location where at least one capacitor is omitted from the array.

Abstract: A method of mounting a capacitor to a bracket is provided. The method includes the step of providing a capacitor with an outer shell, a capacitor member disposed within the shell and a conductor member disposed within the outer shell and thermally coupled to the capacitor member. A collet is arranged having a first opening sized to slidingly engage the conductor member. A sleeve is provided having a second opening sized to receive a first end of the collet. The collet is slid onto the conductor member. The collet is pressed into the sleeve.

Abstract: A method for manufacturing a gravure plate includes, setting a certain measurement area on a surface of the gravure plate, finding at least one of a spatial volume that is the total of the volume of a space formed by a plurality of cells located in the measurement area and an average depth obtained by dividing the spatial volume by a surface area of the measurement area, and adjusting, based on a relationship between at least one of the spatial volume and the average depth and an application thickness of a printing material after printing, at least one of the spatial volume and the average depth so as to fall within at least one of a specified value range for the spatial volume and a specified value range for the average depth determined in accordance with a target value range for the application thickness.

Abstract: An apparatus terminates and winds coils of a core of a dynamo electric machine. The coils are formed from at least an electric wire and the core has a longitudinal axis. The apparatus includes a wire dispenser which translates and rotates with respect to a core to wind the coils. At least a stretch of wire extends from the coil; and the stretch of wire includes a portion for a termination connection to a termination structure of the core, such as a tang terminal. The core has a groove at an end to receive at least a wire in the path of the wire to terminate the coils. The apparatus comprises a wire deflector positioned adjacent the end of the core, where the groove is located, in order to intercept and align the wire with the groove. The apparatus avoids waste cut wire.

Abstract: A method of transferring semiconductor devices to a product substrate includes positioning a surface of the product substrate to face a first surface of a semiconductor wafer having the semiconductor devices thereon, and actuating a transfer mechanism to cause the transfer mechanism to engage a second surface of the semiconductor wafer. The second surface of the semiconductor wafer is opposite the first surface of the semiconductor wafer. Actuating the transfer mechanism includes causing a pin to thrust against a position on the second surface of the semiconductor wafer corresponding to a position of a particular semiconductor device located on the first surface of the semiconductor wafer, and retracting the pin to a rest position. The method further includes detaching the particular semiconductor device from the second surface of the semiconductor wafer, and attaching a particular semiconductor device to the product substrate.

Abstract: A grooved-ended resilient expansion joint is disclosed. The expansion joint has a resilient expansion member with a central resilient portion and two resilient axially disposed cylindrical ends. Each cylindrical end has a radially outwardly raised distal cylindrical gasket portion with at least one inside shoulder having an inner diameter sized substantially the same as an outer diameter of a pipe to be joined. Each cylindrical end also has a neck portion between the central portion and the gasket portion that is sized to receive a grooved-ended pipe nipple.

Abstract: A method for mounting an electronic component onto a circuit board. The method may include preparing a mounting device including a rotatable mounting head, a holding means to hold the electronic component, a component recognition camera, a memory device, and a microcomputer, the electronic component being mounted onto the circuit board based on a result of performing recognition processing with respect to an acquired image, determining a mid-operation instruction action mode at start of a production operation, executing an instruction of obtaining an offset value relative to a rotation center of the rotatable mounting head and storing the offset value in the memory device at a time interval according to the determined mid-operation instruction action mode, and executing the instruction at a longer time interval when the instruction has continuously met a required accuracy more than once.

Abstract: A method of connecting an electric cable to a connector terminal includes arranging a connector terminal in a lower die so that an end portion of the electric cable in which a core wire is exposed from an outer cover is arranged in a barrel portion of the connector terminal, pressing a crimper to the barrel portion to crimp the barrel portion, overlapping the lower die with an upper die to form an injection space around the barrel portion and the end portion of the electric cable, and injecting a resin in an injection space, thereby forming a resin mold that covers and waterproofs the barrel portion and the end portion of the electric cable.

Abstract: A plurality of electrically conductive material layers and a plurality of dielectric layers are alternately stacked on a second substrate. The plurality of electrically conductive material layers comprise first and second patterns. The first pattern comprises at least a first pair of overlaying areas free of the electrically conductive material, and the second pattern comprises at least a second pair of overlaying areas free of the electrically conductive material. The first pair of areas overlay areas of the second pattern having the electrically conductive material and the second pair of areas overlay areas of the first pattern having the electrically conductive material. The plurality of electrically conductive material layers are electrically isolated from one another by the dielectric layers.

Abstract: A method of fabricating an electric machine stator includes inserting one or more electrical coils into a form and partially curing the one or more electrical coils. The method also includes populating the electric machine stator with the one or more electrical coils and curing the electric machine stator with one or more electrical coils.

Abstract: A method for assembling a rotor used in connection with an interior permanent magnet (IPM) rotary machine, the rotor having an axis of rotation and comprising a rotor yoke having bores and a plurality of permanent magnet segments disposed in the bores of the rotor yoke, each permanent magnet segment consisting of a plurality of magnet pieces. The method comprises the steps of: inserting the plurality of magnet pieces in each bore of the rotor yoke, with each of the magnet pieces for each of the magnet segments being kept loose from each other, for axially stacking the magnet pieces in the bore, and fixedly securing the stacked magnet pieces in the bore of the rotor yoke.

Abstract: The application discloses a one or two dimensional array of electromagnetic scatterers n scatterers (ED), whereby the aforementioned scatterers (ED) are arranged aperiodically on a curved line or surface (S). Further, the application describes a reflectarray antenna comprising at least one such array of electromagnetic scatters (ED) and at least one receiving and/or transmitting feed (F), cooperating with said array to generate an antenna beam A method for designing and manufacturing sais array and said antenna is explained. The method optimizes in a several stages all degrees of freedom in order improve the performance of reflectarrays, increase the flexibility thereof and/or the conformity thereof with design specifications (radio pattern) and/or allowing said specifications to be satisfied with a smaller number of scatters.

Abstract: A method of assembling a starter/generator in a gas-turbine engine, including coupling a rotor and a stator of the starter/generator such that the rotor is rotatable with respect to the stator to drive the rotor when the starter/generator is electrically powered and to produce electrical power when the rotor is rotated, securing the stator to a bearing support, coupling the starter/generator to a low pressure shaft of the engine by installing the bearing support over a bearing assembly secured to an end of the low pressure shaft, inserting the low pressure shaft through a high pressure shaft of the engine with the end of the low pressure shaft protruding therefrom and positioning the starter/generator in proximity of an end of the high pressure shaft, and drivingly engaging the rotor to the high pressure shaft.

Abstract: A laminated ceramic capacitor that includes a ceramic laminated body having a stacked plurality of ceramic dielectric layers and a plurality of internal electrodes opposed to each other with the ceramic dielectric layers interposed therebetween, and external electrodes on the outer surface of the ceramic laminated body and electrically connected to the internal electrodes. The internal electrodes contain Ni and Sn, a proportion of the Sn/(Ni+Sn) ratio is 0.001 or more in molar ratio is 75% or more in a region of the internal electrode at a depth of 20 nm from a surface opposed to the ceramic dielectric layer, and the proportion of the Sn/(Ni+Sn) ratio is 0.001 or more in molar ratio is less than 40% in a central region in a thickness direction of the internal electrode.