Abstract: A assembly apparatus for attaching decorative pieces to electronic devices includes a seat, a first cover, a second cover, and a transmitting member. The seat includes a disengaging portion and an attaching portion. The disengaging portion has a recess, a protrusion and at least one positioning column in the recess. The attaching portion defines a receiving room for receiving a shell. The first cover is detachable mounted on the disengaging portion and defines at least one first through hole. The second cover is detachable mounted on the attaching portion and defines a second through hole. The transmitting member includes a latching portion. The latching portion is inserted in the first through hole to attract a decorative piece, and is inserted in the second through hole to release the decorative piece on the shell.
Type:
Grant
Filed:
January 5, 2009
Date of Patent:
August 9, 2011
Assignees:
Shenzen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
Abstract: A method and device for making an electrically conductive connection between two electrically conductive tracks present on two opposite sides of a dielectric substrate. The method: a) provides the substrate, with at least one first electrically conductive track present on one side thereof and at least one second electrically conductive track present on the other side of the substrate opposite the one side, b) forms a through hole through the substrate and through two opposite parts of a first track and a second track, respectively, and c) makes an electrically conductive connection via the through hole between the first track through which the through hole has been formed and the second hole through which the through hole has been formed.
Type:
Grant
Filed:
December 5, 2006
Date of Patent:
August 9, 2011
Assignee:
Meco Equipment Engineers B.V.
Inventors:
Augustinus Cornelis Maria Van De Ven, Rik Franciscus Jozef Peter Rozeboom
Abstract: A method of producing capacitor structure includes, in at least one aspect, arranging first layer, adjacent first and second polarity conducting strips, the first layer conducting strips arranged as respective piecewise “S” shaped paths; arranging second layer, adjacent first and second polarity conducting strips, the second layer conducting strips arranged as respective piecewise “S” shaped paths, the second layer second polarity conducting strip is arranged overlying and electrically separated from the first layer first polarity conducting strip, and the second layer first polarity conducting strip is arranged overlying and electrically separated from the first layer second polarity conducting strip; electrically connecting the first layer first polarity conducting strip with the second layer first polarity conducting strip; and electrically connecting the first layer second polarity conducting strip with the second layer second polarity conducting strip.
Abstract: The capacitor forming method utilizes a plurality of metal sheet manipulating rollers and a glass supply, which, in combination, make a metal-glass laminate and glass or devitrifying glass dielectric to form a capacitor. Several embodiments of the method manufacture ferroelectric crystal dielectrics by utilizing heat-treatment and annealing to form and devitrify glass while the glass is in a metal-glass spool or flat form.
Abstract: A method for mounting permanent magnets that form magnetic poles on a permanent magnet support surface of the rotor of an electric machine includes the steps of forming a mold by the placement of a mold part against the support surface in such a way that the mold cavity of the mold is bounded on one side by the support surface inserting a permanent magnet into the mold so that the inserted permanent magnet is held in the mold in a desired position with respect to the support surface, and filling the mold with a thermosetting adhesive in such that the adhesive bonds the permanent magnet with the support surface and completely fills any spaces formed between the permanent magnet and the wall of the mold cavity.
Abstract: A wireless-enabled tightening system for fasteners is disclosed. The system includes a visual designator configured to project an indicator onto a workpiece. The system also includes a torque wrench comprising a wireless transmitter and a means for identifying whether the correct torque has been applied to a fastener on the workpiece and configured to provide a feedback for a user. The system also includes a camera configured to capture an image of the workpiece when an appropriate amount of torque has been applied to the fastener. The system further includes a microprocessor for determining sequence of the fastener and identifying the tightened fastener.
Type:
Grant
Filed:
November 17, 2006
Date of Patent:
July 26, 2011
Assignee:
General Electric Company
Inventors:
Lynn Ann DeRose, Janet Sue Bennett, James Nelson Bratton, Michael Orlando Cimini, Douglas Roy Forman, Brandon Stephen Good, Morgan Frederic Intrator, Lee Roy LaPierre, Gregory Alan Richardson, Craig Douglas Young
Abstract: An apparatus tool for filling vias in a product greensheet and/or repairing vias in a product greensheet. The apparatus tool utilizes a transfer greensheet having filled vias in a fixed array, which vias are punched into the product greensheet to either repair or fill the via of the product greensheet. The apparatus tool employs position determining means such as a camera, a punch head and a corresponding punch die and an activating means to activate the punch head to punch the transfer greensheet via to fill the product greensheet via. The transfer greensheet has a fixed array of filled vias and a transfer greensheet station employs a fixed plate having a plurality of vacuum ports positioned in the non-via areas of the transfer greensheet which secures the transfer greensheet during the repair or fill method. The product greensheet is held by a vacuum plate.
Type:
Grant
Filed:
July 2, 2008
Date of Patent:
July 26, 2011
Assignee:
International Business Machines Corporation
Abstract: The present invention carries out the vacuum deposition by setting a deposition angle between a single mask set including a shadow mask having a plurality of slits and a deposition source to form a lower terminal layer, a dielectric layer, an inner electrode layer, and an upper terminal layer at once under a vacuum state generated once, or adjusts slit patterns by relatively moving upper and lower mask sets that respectively include shadow masks having a plurality of slits and face each other to form a lower terminal layer, a dielectric layer, an inner electrode layer, and an upper terminal layer at once under a vacuum state generated once.
Abstract: A nozzle unit includes a rotating body and a driving source. The rotating body includes a plurality of nozzles for holding a component using a negative pressure and rotates the plurality of nozzles. The driving source drives the rotating body in a non-contact state.
Abstract: A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas.
Abstract: The present invention relates to a method for manufacturing products comprising transponders. The method comprises introducing a web comprising on its surface sequential structural modules comprising an impedance matching element and an integrated circuit electrically connected to the impedance matching element, the structural modules having a first distance between each other; cutting the web in such a manner that the sequential structural modules are separated from each other; attaching the structural modules to a product substrate, the sequential structural modules having a second distance between each other, the second distance being longer than the first distance; and attaching the impedance matching elements to antennas, the impedance matching elements and the antennas forming an electrical connection.
Type:
Grant
Filed:
May 12, 2006
Date of Patent:
July 5, 2011
Assignee:
Confidex OY
Inventors:
Marko Hanhikorpi, Lari Kytola, Jarkko Miettinen, Matti Ritamaki, Juha Ikonen, Heikki Ahokas
Abstract: One embodiment includes a method that includes positioning a first substantially planar electrode including material defining a first aperture into a capacitor stack in alignment with a second substantially planar electrode such that a first non-aperture portion of the second substantially planar electrode at least partially overlays the first aperture and joining the first substantially planar electrode to the second substantially planar electrode proximal the material defining the first aperture and the first non-aperture portion of the second substantially planar electrode.
Abstract: The invention concerns a method for making smart cards capable of operating with or without contact called mixed cards and contactless smart cards. In order to avoid the risk of deteriorating the antenna the method consists in producing an antenna comprising at least two turns, on a support sheet, said antenna having its turns located outside the connecting pads, and in providing an insulating bridge so as to connect each of the antenna ends to a connection pad respectively.
Type:
Grant
Filed:
April 7, 2000
Date of Patent:
June 14, 2011
Assignee:
Gemalto S.A.
Inventors:
Stephane Ayala, Gerard Bourneix, Christine Beausoleil, David Martin, Laurent Oddou, Philippe Patrice, Michael Zafrany
Abstract: A vacuum bonding tool method for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions.
Abstract: In a manufacturing method of a thin and small RFID tag, an antenna metal pattern is formed on a substrate, going once around a dielectric plate, and a recess is formed on the substrate to house an IC chip. A strap on which the IC chip is mounted is connected and fastened to the substrate in the position and orientation in which the IC chip is housed in the recess.
Type:
Grant
Filed:
February 5, 2007
Date of Patent:
June 7, 2011
Assignee:
Fujitsu Limited
Inventors:
Hiroshi Kobayashi, Naoki Ishikawa, Takayoshi Matsumura, Shunji Baba
Abstract: A method of forming and connecting an antenna to a feedthrough member of a housing. The method comprising a step of: positioning the feedthrough member and an antenna template relative to each other. A step of connecting the first portion of at least one electrically conducting wire to the feedthrough member. An additional step of winding the wire at least once around the antenna template, and a further step of connecting a second portion of each wire to said feedthrough member.
Type:
Grant
Filed:
December 8, 2004
Date of Patent:
May 31, 2011
Assignee:
Cochlear Limited
Inventors:
Andy Ho, Niki Eder, David Walker, Katherine Meagher, Peter Schuller
Abstract: Disclosed is an integrated device which can peel a protective film from a board assembly and mount the board assembly on a backlight unit. The integrated peeling and mounting device includes: an index rotary unit having a shaft for rotating heads facing in different directions; an alignment calibration unit for calibrating an aligned state of the board assembly and the backlight unit; and a mounting unit for mounting a board assembly adsorbed to a first head of the index rotary unit on the backlight unit.
Type:
Grant
Filed:
July 15, 2009
Date of Patent:
May 31, 2011
Assignees:
LG Display Co., Ltd., LG Electronics Inc.
Inventors:
Sungmin Kim, Yongjin Kim, Byungsu Chae, Youngjin Lee
Abstract: A method of manufacturing a can assembly of a coreless AC linear motor is provided. The method includes the steps of providing a workpiece and gouging out material from the workpiece to form a deep groove in the workpiece. The workpiece having the deep groove forms a can. The method also includes providing a plurality of coreless coils and arranging the plurality of coreless coils in a straight line. The method also includes forming the plurality of coreless coils into a flat plate-shaped block using resin or adhesive. The flat plate-shaped block forms a coil assembly. The method also includes inserting the coil assembly into the deep groove of the can. The can assembly comprises the can and the coil assembly.
Abstract: A method for making a magnetic linear motor shaft including thermal treatment to temporarily change the dimensions of various shaft components to allow tight interference fit assembly. The magnetic motor includes a core piece, annular magnets and pole pieces.
Type:
Grant
Filed:
March 31, 2010
Date of Patent:
May 24, 2011
Assignee:
Moog Inc.
Inventors:
Paul M. Lindberg, Philip G. Hollingsworth, James Carl Ellard, Leonard N. Wedman
Abstract: An assembly-target-object-and-assembly-component carrier pallet carries thereon a target object (semi-finished product) 2 and a plurality of assembly components arranged, as viewed in plane, on a straight line which passes through a predetermined attachment position on the target object where the predetermined assembly component is to be attached. This allows a minimum of moving parts in the attaching device which attaches the assembly components to the assembly target object. Therefore, the structure of an assembling apparatus is simplified and mechanical errors and assembly time are reduced, thereby improving assembling accuracy.