Abstract: A tridimensional antenna includes a radiating body, a feeding foot, a grounding foot, and a supporting foot. The feeding foot and the grounding foot are connected to the radiating body. The supporting foot includes a supporting portion, at least one groove and a bent portion. The bent portion connects the radiating body and the supporting portion. The groove is defined in the supporting portion and adjacent to the bent portion. The tridimensional antenna is mounted on a substrate by surface mounted technology (SMT). The feeding foot and the grounding foot are soldered on the substrate. The supporting foot is bent to break away the supporting portion at the groove after mounting of the tridimensional antenna.

Abstract: An assembling apparatus includes a chip transfer unit, a heating unit, a testing unit, and an output unit. The chip transfer unit mounts first semiconductor chip to a circuit board to form an electrical circuit. The heating unit heats a solder connection to electrically connect the semiconductor chip to the circuit board. The testing unit tests the semiconductor chip, and, when the testing unit determines that the first semiconductor chip is not functioning properly, the heating unit reheats the solder connection to remove the non-functioning semiconductor chip from the circuit board.

Abstract: The jig includes an upper jig part, a lower jig part, a support plate, a guide jig part, and a spring. The upper jig part has a pressure protrusion for press-fitting a rotating shaft, and applies pressing force to the rotating shaft. The lower jig part supports a rotor casing in a direction which is opposite the acting direction of the pressing force. The support plate is mounted to the lower jig part, and supports the rotor casing in a direction which is opposite that of the force for press-fitting the rotating shaft. The guide jig part supports the rotor casing in a direction which is opposite that of reaction force generated in the rotor casing by the support plate. The spring elastically biases the guide jig part towards the rotor casing.

Abstract: A method of repetitively accomplishing mechanical action of a tool member by drivingly engaging the tool member with one end of a compression spring, manually applying incrementally increasing force to the other end of the compression spring until the mechanical action of the tool member is completed, and utilizing an electronic measurement of the force level within the compression spring for repetitively reproducing the mechanical action.

Abstract: A workstation including a workstation body, a horizontal omni-directional moving carrier, a sensor mechanism, a grabbing device, and a control unit is provided. The horizontal omni-directional moving carrier carries the workstation body. The sensor mechanism includes an oscillating bar and a plurality of electrodes. The oscillating bar pivoted on the workstation body leans against an autonomous mobile device when the device enters the workstation. The electrodes, disposed on the oscillating bar, electrically connect the autonomous mobile device when the oscillating bar leans against the autonomous mobile device. The grabbing device is disposed on the workstation body. The control unit is electrically connected to the electrodes and the grabbing device.

Abstract: Some embodiments of the present disclosure provide a method of making a rotor of an electric brushless motor configured to be light weight and prevent vibrations generated during an operation of the motor to be transferred to the shaft of the rotor. The method includes providing a shaft elongated in a rotational axis, providing a single body magnet comprising alternately magnetized portions, and providing a vibration absorption portion interposed between the shaft and single body magnet. The vibration absorption portion absorbs vibrations generated during the operation of the motor and may include an elastic or a non-elastic material. The method further includes providing a non-elastic portion configured to inhibit the expansion of the vibration absorption portion when the vibration portion is elastic.

Abstract: A method of making a wound field for a brushless direct current motor, direct current generator, alternating current motor or alternating current generator, includes providing a base mold and a press mold. Next, a number of phases is determined. At least one strand of conductive material per phase is formed between the base mold and press mold into a conductive coil that has a shape that indicates the number of poles required. Each conductive coil is inserted into the stator core, and the stator core is installed into one of a brushless direct current motor, direct current generator, alternating current motor or alternating current generator.

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two or more substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). Adhesive films may be positioned between the surfaces of the substrates having the conductive pads, where the adhesive films include apertures located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The two or more substrates then may be pressed together to mechanically bond the two or more substrates via the adhesive films. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the conductive pads through the aperture in the adhesive films.

Abstract: A head gimbal assembly (HGA) connector pad alignment jig is disclosed. One embodiment provides an HGA testing jig for holding an HGA, the HGA testing jig including an opening at a location of the HGA connector pads. In addition, an HGA testing apparatus including a disk for testing the HGA and a controller with a plurality of pin connectors for providing control information to the HGA during a testing process. Thus, the present technology provides an alignment adjuster for adjusting the location of the pin connectors with respect to the connector pads to ensure a good electrical connection between the HGA connector pads and the pin connectors.

Abstract: A production line used to assemble and test some electronic elements includes a first assembly line used to assemble some electronic elements requiring a relatively high requirements of cleanliness factor, a second assembly line used to assemble some electronic elements requiring a relatively low requirements of cleanliness factor, a first testing line used to do some testing items with a relatively high requirements of lightness, a second testing line used to do some testing items with a relatively low requirements of lightness, and a third testing line do some testing items requiring a relatively high requirements of cleanliness factor, the first assembly line, the second assembly line, the first testing line, the second testing line, and the third testing line are located adjacent to each other and connected together in series.

Abstract: An object is to provide a rotor manufacturing method capable of reducing a rotor unbalance amount by controlling a magnet arrangement position in a rotor core and improving work efficiency when fixing a magnet to the rotor core by using resin. A lower surface of a rotor core is arranged in a lower mold. A magnet is arranged in a lower mold. A magnet is contained in each of magnet containing holes formed in the rotor core in such a manner that a predetermined space is assumed between an upper surface of the rotor core and an upper surface of the magnet. An upper mold is arranged on the upper surface of the rotor core. The upper mold and the lower mold apply a pressure to the rotor core and a molten resin is supplied with pressure from an internal diameter side via the predetermined space into the plurality of magnet containing holes from respective cylinder arranged in the upper mold. Thus, the magnets are molded by resin while pressing the magnets toward the outer diameter side of the magnet containing holes.

Abstract: The present invention relates to a bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The bonding device includes a support structure assembly and a first heater assembly arranged on the support structure assembly to be movable along a first path and configured to bond the flexible PCB to the printhead. A bending mechanism is arranged on the support structure and is configured to bend the bonded PCB. A second heater assembly is arranged on the support structure assembly to be movable along a second path and is configured to bond the bent PCB to the printhead carrier. A control system controls operation of the heater assemblies and the bending mechanism.

Abstract: A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum transfers chips or interposers to a moving web of electrical components by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web. According to another method, a primary drum removes chips or interposers from a carrier web having a first pitch, and transfers the chips or interposers to a variably rotating secondary drum which then places the chips or interposers onto an electrical component on a moving web having a second pitch.

Abstract: A method for compressing an intraluminal prosthesis provides a mesh tube having first and second longitudinally spaced tube ends and a hollow tube bore located therebetween. The intraluminal prosthesis is completely inserted into the hollow tube bore. The tube is stretched in a longitudinal dimension, which reduces the tube in a radial dimension and causes the intraluminal prosthesis to radially compress.

Abstract: A method and apparatus for mounting a light emitting element, enabling positioning on an object with precision with reference to the optic axis of a light emitting element, and mounting the element.

Abstract: Provided is a chip mounter for recognizing a Ball Grid Array (BGA) package through a chip mounter. The chip mounter includes a BGA package recognition apparatus which includes an image acquisition unit which acquires image information of a BGA package which includes a plurality of solder balls having n patterns (n?1), a pattern recognition unit which analyzes the image information and outputs information about the BGA package, and a storage unit which stores the information about the BGA package, wherein the pattern recognition unit recognizes the n patterns, selects n seeds respectively corresponding to the n patterns and performs a seed growing operation which groups solder balls which are continuously located adjacent to the seed and have the same pattern as the seed into the same group as the seed, with respect to each of the n seeds.

Abstract: A tool for installing compression connectors of various sizes and types on the end of a coaxial cable has a base mounting a pair of movable anvils for engaging two different lengths of connectors. The base further incorporates a fixed anvil for engaging a third length of connector. The movable anvils define an aperture which is shaped to permit easy entry and exit of a cable while still applying a suitable retention force to an inserted cable. A connector seating holder is formed in the front of the tool. A slidably mounted plunger cooperates with the anvils to compress a connector. The plunger has a push head and a slide rod. A lock nut is threaded on the push head and is engageable with the slide rod to prevent rotation of the push head.

Abstract: A method of fabricating a clamping device for a flexible substrate is provided. A carrier board is provided. A plurality of holes is formed in the carrier board. A fixed positioning assembly and a movable positioning assembly are respectively embedded in the plurality of holes.

Abstract: A multi-use tool for assembly of electrical connectors includes a main tool body having an electrical connector assembly holder. The holder includes first and second cavities. The first cavity includes spaced anvils and removably retains an electrical connector end cap between the anvils. A cutting ram is opposed to the first cavity and includes two cutting blades that are translatable between disengaged and engaged positions to trim and sever excess wire lengths from the electrical connector end cap. The second cavity removably retains the electrical connector end cap and a jack housing. A termination ram is opposed to the second cavity and movably mounted between disengaged and engaged positions to terminate the jack housing with the end cap. A trigger mechanism is operably connected to both the cutting ram and the termination ram.

Abstract: In a multilayer ceramic substrate having a built-in capacitor provided in a ceramic laminate including a plurality of ceramic layers laminated to each other, the built-in capacitor being formed of a first capacitor electrode, a second capacitor electrode, and one of the dielectric glass ceramic layers, the capacitance value of the built-in capacitor is adjusted by performing laser trimming of the first capacitor electrode. The one dielectric glass ceramic layer is made of a TiO2-based dielectric glass ceramic layer in which the amount of dielectric grains including TiO2 is about 10 percent to about 35 percent by volume.