Abstract: A system has a first temperature sensor located at a first location. A second temperature sensor is located at a second location. A control is configured to determine a difference between voltages indicated of a temperature sensed by each of the first and second sensors. A method is also disclosed.

Abstract: A system and method for inspecting a surface of a structure for defects includes an inspection apparatus having a heating device for heating a section of the surface of the structure, an infrared camera for receiving infrared radiation from the surface in response to heating, a controller configured to generate thermographs from the received infrared radiation, and a communication device. A training system includes an expert system module configured to determine correlations between a set of thermographs generated by a thermal simulation of modeled structural elements with defects, and parameters of the modeled structural elements. A computer system communicatively coupled to the training system and the inspection apparatus, is adapted to receive thermographs received from the inspection apparatus and to detect quantitative parameters of defects in the structure using the correlations obtained from the training system.

Abstract: A probe comprises a resistive element configured to be brought into thermal contact with an entity to be sensed. A measurement system applies a plurality of heating pulses to the resistive element by driving an electrical current through the resistive in element and measures an electrical response of the resistive element to the heating pulses in order to determine information about either or both of the composition and state of the entity. The measurement system generates an output signal using the measured electrical response, wherein the output signal is generated by progressively offsetting the measured electrical response such that, in the event of an average temperature of the resistive element changing between different heating pulses due to a drift in the average temperature of a portion of the entity being sensed, a variance over the plurality of heating pulses of a value of the output signal at a predetermined common reference point within each heating pulse is reduced.

Abstract: A diode voltage from a diode circuit can be combined with a proportional to absolute temperature (PTAT) voltage generated by a PTAT circuit to determine a temperature sensor voltage. This temperature sensor voltage may correspond to a temperature of a circuit or a localized temperature. By determining the temperature sensor voltage using a combination of a PTAT voltage and diode voltage, it is possible to remove or a PTAT circuit used to generate a bandgap voltage, which may shrink the temperature sensor and increase the accuracy of the temperature sensor circuit.

Abstract: A method of measuring a junction temperature of a SiC MOSFET can be provided by applying a gate-source voltage to an external gate loop coupled to a gate of the SiC MOSFET, detecting a first time when the gate-source voltage exceeds a first value configured to disable conduction of a current in a drain of the SiC MOSFET, detecting, after the first time, a second time when a voltage across a common source inductance in a package of the SiC MOSFET indicates that the current in the drain is greater than a reference value, defining a time interval from the first time to the second time as a turn on delay time of the SiC MOSFET and determining the junction temperature for the SiC MOSFET using the turn on delay time.

Abstract: In an embodiment a method includes determining, for each capacitor element of a plurality of capacitor elements of a capacitor, an increase of a capacitance of a capacitor element caused by a decrease of a temperature of the capacitor and deriving a dew point from a temperature at which the increases of the capacitances or values corresponding to the increases of the capacitances exceed a predefined limit by generating a set of binary digits, each of the binary digits corresponding to one of the capacitor elements and indicating whether the capacitance of the capacitor element is within a predefined range, comparing sets of binary digits generated at different temperatures and determining a number of capacitor elements for which the corresponding binary digits of the sets are different and repeating the comparison for a sequence of sets generated at decreasing temperatures.

Abstract: Various embodiments of the teachings herein include a sealing device for sealing a cold-end part of a thermocouple wire arrangement based on a mineral-insulated cable, the sealing device comprising: a sealing element including an electrically insulating material, the sealing element defining a through-hole for passing through a respective thermocouple wire of the mineral-insulated cable; a sealing ring arranged at an outer rim of the sealing element for fixing the sealing device to a sheath or a support tube of the mineral-insulated cable; and an electric temperature sensing element for sensing an absolute temperature of the cold-end part. The temperature sensing element has at least one temperature-dependent electrical property.

Abstract: This application relates to methods and apparatus for temperature monitoring for integrated circuits, and in particular to temperature monitoring using a locked-loop circuits, e.g. FLLs, PLLs or DLLs. According to embodiments a locked-loop circuit includes a controlled signal timing module, wherein the timing properties of an output signal (SOUT, SFB) are dependent on a value of a control signal and on temperature. A controller compares a feedback signal (SFB) output from the timing module to a reference signal (SREF) and generates a control signal (SC) to maintain a desired timing relationship. A temperature monitor monitors temperature based on the value of the control signal. For FLLs and PLLs the signal timing module may be a controlled oscillator.

Abstract: A gas burner assembly includes a gas burner. A grate with a plurality of fingers is positioned above the gas burner. The plurality of fingers includes a sensor finger. A temperature sensor is mounted to the sensor finger of the plurality of fingers of the grate at a first end portion of the sensor finger. The temperature sensor is thermally isolated from the grate.

Abstract: A bubbler device and method of its operation are disclosed. The bubbler device includes a bubbler tube that provides bubbles to a molten material in a furnace; a protective layer disposed on the bubbler tube; and a wire that is electrically coupled to the protective layer. The wire extends through the bore, and the protective layer and the wire partially form an electrical circuit for measuring integrity of the bubbler device based on at least one of conductivity or resistance in the electrical circuit. Sometimes, an inner protective material may be disposed on an inside surface of the tube and coupled to the protective layer, and the wire can be coupled to the inner protective material or multiple wires may be used. The use of dissimilar materials in these components may be used to form a thermocouple junction to measure the temperature of the molten material in a furnace.

Abstract: A device comprises a plurality of temperature sensing elements and a control module. The plurality of temperature sensing elements are each arranged proximal to a respective current carrying blade of an electrical plug. The control module receives, from the plurality of temperature sensing elements, a plurality of temperature signals that each indicate a temperature associated with the respective current carrying blades of the electrical plug. The control module also determines a temperature condition of the electrical plug based on the plurality of temperature signals. The control module also communicates an indication of the temperature condition of the electrical plug via an electrical power carrying conductor that supplies electrical power via the electrical plug.

Abstract: A temperature sensor configured to generate an output signal corresponding to a sensed and/or measured temperature includes: a diode including a cathode coupled to a ground node; a first capacitor including a first end coupled to the ground node; a switch circuit configured to connect a second end of the first capacitor to a positive voltage node or an anode of the diode according to a control signal; switch control circuitry configured to generate the control signal based on a reference voltage with a voltage of the anode; and an output signal generator configured to generate the output signal corresponding to the sensed temperature based on a frequency of the control signal.

Abstract: A method for determining a temperature of an object includes contacting the object with a first electrical conductor. A difference in electronegativity between the object and the first electrical conductor is greater than a predetermined value. The method also includes contacting the object or a substrate on which the object is positioned with a second electrical conductor. A difference in electronegativity between the object or the substrate and the second electrical conductor is less than the predetermined value. The method also includes connecting the first and second electrical conductors together. The method also includes measuring the temperature of the object using the first and second electrical conductors. The first and second electrical conductors form at least a portion of a thermocouple.

Abstract: An on-chip temperature sensor for generating a digital output signal representing a temperature value includes: a proportional to absolute temperature (PTAT) buffer for alternately generating a first voltage signal representing a first temperature of the PTAT buffer and a second voltage signal representing a second temperature of the PTAT buffer; an analog to digital (A/D) converter, coupled to the PTAT buffer, for converting the first voltage signal to a first digital voltage signal and for converting the second voltage signal to a second digital voltage signal; and a digital output generating block, for receiving the first digital voltage signal and the second digital voltage signal, and comparing a difference between the first digital voltage signal and the second digital voltage signal with a digital voltage reference signal to generate the digital output signal.

Abstract: A deep body thermometer that includes a body temperature measurement unit having a thermal resistor layer formed of a thermal resistor having a predetermined thermal resistance value, four temperature sensors arranged in a thickness direction of the thermal resistor layer, and a wiring substrate on which a processing circuit for processing an output signal of each of the four temperature sensors is mounted. Moreover, the thermometer includes an upper exterior body made of a foamed material of a closed cell or a semi-closed cell having a waterproof property to accommodate the body temperature measurement unit, and a lower exterior body formed of a non-foamed resin film having a waterproof property, in which peripheral edge portions of the upper exterior body and the lower exterior body are fixed in a close contact manner.

Abstract: A temperature measuring device includes an electrical temperature measuring instrument configured to measure the temperature of a temperature sensitive section electrically; a heat transfer part formed of an elastomer in which the temperature sensitive section is embedded; and a heat insulation part formed of an elastomer covering a single surface of the heat transfer part. The heat transfer part has a thermal conductivity that is greater than a thermal conductivity of the heat insulation part. A mounting section is formed at the heat insulation part, and is to be mounted at a mounting location.

Abstract: Described is a differential scanning calorimeter (DSC) instrument capable of performing analyses of multiple samples at the same time. Some embodiments of DSC instruments described herein include a thermal substrate that provides a substantially uniform temperature across a surface of the substrate. A plurality of DSC units is in thermal communication with the substrate, for example, by mounting the units directly to the surface of the substrate. Each DSC unit includes a second thermal substrate for further thermal isolation, and a reference platform and sample platform to receive a reference cell and a sample cell, respectively. A thermoelectric device is disposed between each platform and the second thermal substrate. Optionally, the reference and sample cells may be disposable chips that can be discarded after measurement are performed, thereby reducing or eliminating the need to clean instrument components to prevent cross-contamination for subsequent instrument operation.

Abstract: A temperature measurement apparatus. The temperature measurement apparatus may include a temperature sensor body, the temperature sensor body having a substrate support surface; and a heat transfer layer, disposed on the substrate support surface, the heat transfer layer comprising an array of aligned carbon nanotubes.

Abstract: The disclosure concerns a sensor device for determining the thermal capacity of a natural gas. The sensor device comprises a substrate, a recess or opening arranged in the substrate, a first heating component and a first sensing component. The first heating component comprises a first heating structure and a temperature sensor and the first sensing component comprises a temperature sensor. The sensor device is configured to measure the thermal conductivity of the natural gas at a first measuring temperature and at a second measuring temperature. The sensor device is configured to determine a first, in particular a constant, and a second, in particular a linear temperature coefficient of a temperature dependency function of the thermal conductivity and to determine the thermal capacity of the natural gas based on a fitting function. The fitting function is dependent on the first and the second temperature coefficient.

Abstract: Provided is a thermal analyzer, with which a sample can be observed even under a state in which a heat sink is cooled to a room temperature or lower. The thermal analyzer includes: the heat sink, in which a measurement sample container and a reference sample container are placed; a heat sink cover configured to cover the heat sink; a heat sink window provided in the heat sink; a heat sink cover window provided in the heat sink cover; an imaging device configured to image the sample in the heat sink through the heat sink window and the heat sink cover window; a purge gas introduction portion, through which a purge gas is introduced into the heat sink; and a discharge port, through which the purge gas is allowed to flow from one of the heat sink window and the heat sink to a space inside the heat sink cover.