Abstract: A voltage prediction method, a memory storage device and a memory control circuit unit are disclosed. The method includes: reading a plurality of memory cells in a rewritable non-volatile memory module by using a first read voltage level to obtain count information, and the first read voltage level is configured to distinguish a first state and a second state adjacent to each other in a threshold voltage distribution of the memory cells, and the count information reflects a total number of first memory cells meeting a target condition among the memory cells; and predicting a second read voltage level according to the count information, and the second read voltage level is configured to distinguish a third state and a fourth state adjacent to each other in the threshold voltage distribution.

Abstract: In addition to word line related short circuits within the blocks of the array structure of a non-volatile memory device, such as NAND memory, word line related shorts can also occur in the routing for supplying the word lines of the memory blocks. Depending on the layout of the routing, some shorts for the word lines associated with one block can affect other blocks of the memory array. In particular, if the routing of a pair of adjacent local supply lines are adjacent to a global supply line, a short between the pair of adjacent local supply lines for one block can lead, through the global supply line, to defects in another of the block. Techniques are presented for detecting these layout related problematic word lines.

Abstract: A semiconductor memory device includes: a memory cell region including a plurality of cell mats in each of which a plurality of rows are disposed, each row coupled to normal cells and row-hammer cells; a repair control circuit suitable for generating a pairing flag denoting whether a cell mat in which an active row corresponding to an active address is disposed, is repaired with another cell mat; and a refresh control circuit suitable for: selecting, when an active command is inputted, a sampling address based on first and second data read from the row-hammer cells of the active row, refreshing, when a target refresh command is inputted, one or more adjacent rows to a target row corresponding to the sampling address, and selectively refreshing, when the target refresh command is inputted, one or more adjacent rows to a paired row of the target row according to the pairing flag.

Abstract: A write operation assist circuit is provided, including: pre-charging circuit, a drive signal circuit, a programmable delay circuit, a charge pump, a write driving circuit and a column selector, wherein the pre-charging circuit has a pre-charging signal output terminal coupled to a pre-charging signal input terminal of the drive signal circuit, a first voltage output terminal coupled to a first bit line, and a second voltage output terminal coupled to a second bit line; the driving signal circuit has a first input terminal coupled to the first bit line, a second input terminal coupled to the second bit line, a first output terminal coupled to a first input terminal of the programmable delay circuit, and a second output terminal coupled to a second input terminal of the programmable delay circuit; the programmable delay circuit has an output terminal coupled to a first terminal of the charge pump.

Abstract: The present disclosure is directed to a sense amplifier architecture for a memory device having a plurality of memory cells. Groups of non-volatile memory cells store respective codewords formed by stored logic states, logic high or logic low, of the memory cells of the group. The sense amplifier architecture has a plurality of sense amplifier reading branches, each sense amplifier reading branch coupled to a respective memory cell and configured to provide an output signal, which is indicative of a cell current flowing through the same memory cell; a comparison stage, to perform a comparison between the cell currents of memory cells of a group; and a logic stage, to determine, based on comparison results provided by the comparison stage, a read codeword corresponding to the group of memory cells.

Abstract: A memory device standby procedure can include idling a first memory device in a low-power standby mode, the first memory device coupled to a memory interface that couples multiple memory devices to a host and includes a command line (CA) and a standby exit line (EX), and the first memory device can include a primary die coupled to multiple secondary dies using an intra-package bus. At the first memory device, the procedure can include waking receiver circuitry on the primary die in response to a state change on the standby exit line, and sampling the command line using logic circuitry on the primary die. When a wakeup message on the command line comprises a chip identification that corresponds to the first memory device, the procedure can include initiating a standby exit procedure for the first memory device.

Abstract: A method for calibrating a characteristic value of a signal processing device comprised in SerDes inside of an interface circuit of a memory controller includes: monitoring a current of a voltage of a test element to generate a process detection result by a monitor and calibration module; monitoring an environment temperature to generate a temperature monitored result by the monitor and calibration module; selecting a reference value subset from multiple reference value subsets as a preferred reference value subset for a calibration operation based on the process detection result and the temperature monitored result; and performing the calibration operation on the signal processing device by at least one calibration circuit of the monitor and calibration module according to the preferred reference value subset to adjust the characteristic value of the signal processing device.

Abstract: An operating method of a non-volatile memory device, the method including: receiving a program command from an external device; determining an operating mode in response to the program command; when the operating mode is a surface mount technology (SMT) mode, performing an initial program operation in which a plurality of memory cells are programmed through a plurality of steps to form a first threshold voltage distribution; and when the operating mode is a normal mode, performing a normal program operation in which the plurality of memory cells are programmed through a single step to form a second threshold voltage distribution, wherein the first threshold voltage distribution is narrower in width than the second threshold voltage distribution.

Abstract: Implementations described herein relate to performing a memory built-in self-test and indicating a status of the memory built-in self-test. A memory device may read one or more bits, associated with a memory built-in self-test, that are stored in a mode register of the memory device. The memory device may identify, based on the one or more bits, that the memory built-in self-test is enabled. The memory device may set a DMI bit of the memory device to a first value and perform the memory built-in self-test based on identifying that the memory built-in self-test is enabled. The memory device may set the DMI bit of the memory device to a second value based on a completion of the memory built-in self-test.

Abstract: A memory device includes pages each including memory cells arranged on a substrate. Voltages applied to first and second gate conductor layers and first and second impurity layers in each memory cell are controlled to retain a group of positive holes. In a page write operation, a voltage of the channel semiconductor layer is made equal to a first data retention voltage. In a page erase operation, the group of positive holes are discharged by controlling the voltages, the voltage of the channel semiconductor layer is made equal to a second data retention voltage, and erase and ground voltages are applied to selected and non-selected pages respectively. The first and second impurity layers and first and second gate conductor layers are connected to source, bit, plate, and word lines. The source, word, and plate lines are disposed parallel to the pages. The bit line is disposed perpendicular to the pages.

Abstract: In some aspects of the present disclosure, a memory device is disclosed. In some aspects, the memory device includes a plurality of memory cells arranged in an array, an input/output (I/O) interface connected to the plurality of memory cells to output data signal from each memory cell, and a control circuit. In some embodiments, the control circuit includes a first clock generator to generate a first clock signal and a second clock signal according to an input clock signal and a chip enable (CE) signal and provide the first clock signal to the plurality of memory cells. In some embodiments, the control circuit includes a second clock generator to generate a third clock signal according to the input clock signal and a DFT (design for testability) enable signal. In some embodiments, the control circuit generates an output clock signal according to the second clock signal or the third clock signal.

Abstract: A system includes a memory array having pattern cells and data cells. The pattern cells are configured to store only a first logic state. The data cells are configured to store the first logic state or a second logic state. Bias circuitry is configured to apply voltages to the pattern cells and data cells. Sensing circuitry is configured to read the pattern cells. A controller is configured to apply, using the bias circuitry, first voltages to the pattern cells; determine, using the sensing circuitry, that at least a portion of the pattern cells switch; determine, based on the portion of the pattern cells that switch, to refresh a codeword; and apply, using the bias circuitry, the refresh of the codeword.

Abstract: A block erase method for a flash memory is provided. The block erase method is to perform block erase on a block with a predetermined block size. The block erase method includes: performing an erase verification on bytes byte-by-byte in the block when performing the block erase; checking an erase step of the byte when the byte does not pass the erase verification; when the erase step of the byte exceeds a predetermined threshold value, performing the block erase with a partitioned block smaller than the predetermined block size, and returning to an erase verification stage to perform the erase verification; and when the erase step of the bytes does not exceed the predetermined threshold value, continuing to perform the block erase with the predetermined block size, and returning to the erasure verification stage to continue to perform the erase verification.

Abstract: A circuitry (30) for on-chip power regulation is provided. The circuitry (30) comprises a memory array (31) comprising a plurality of memory cell blocks (32) arranged in rows and columns, where the memory cell blocks are clustered into a defined number of memory cell blocks (33) along the row, each cluster (33) is connected to a respective local reference line (34). In addition, the circuitry (30) comprises a plurality of sense amplifiers (40) connected to the respective memory cell blocks (32). The circuitry (30) further comprises at least one dummy memory cell block (35) additionally arranged to each cluster of memory cell blocks (33), where the dummy memory cell block (35) is connected to a main reference line (36). Moreover, the circuitry (30) comprises at least one transistor (37) arranged in between the local reference line (34) of each cluster of memory cell blocks (33) and the main reference line (36).

Abstract: The signal generator includes the following: an oscillation generation circuit, configured to generate an initial oscillation signal based on an oscillation control signal; a duty cycle correction circuit, connected to an output end of the oscillation generation circuit and configured to adjust a duty cycle of the initial oscillation signal based on a duty cycle control signal, to generate an adjusted oscillation signal; an output interface, connected to an output end of the duty cycle correction circuit and configured to output the adjusted oscillation signal to an external test system; and an amplitude adjustment circuit, connected to the output end of the duty cycle correction circuit and configured to adjust an amplitude of the adjusted oscillation signal based on an amplitude control signal, to generate a test signal.

Abstract: Embodiments of the present disclosure relate to an address selection circuit and a control method thereof, and a memory. The address selection circuit includes an address receiving circuit, a row hammer address generation circuit, and a decoding circuit. The address receiving circuit is configured to output a first address output signal in response to a first selection signal, where the first address output signal includes a received regular refresh address signal or an active address signal. The row hammer address generation circuit is configured to: generate a second address output signal and a row hammer address redundancy identifier according to the first selection signal, an actual active address signal, and the first address output signal. The decoding circuit is configured to: generate a target address and the actual active address signal according to the second address output signal and the row hammer address redundancy identifier.

Abstract: A cache read method of a nonvolatile memory device including a plurality of page buffer units and cache latches, each page buffer units having a sensing latch and a sensing node line is provided. The method comprises performing a first on-chip valley search (OVS) read on a selected memory cell using a first sensing node line and a first sensing latch of a first page buffer unit of the plurality of page buffer units; storing first data sensed from the selected memory cell in the first sensing latch, the first data based on a result of the first OVS read; dumping the first data to sensing node lines of at least one page buffer unit, excluding the first page buffer unit, from among the plurality of page buffer units; and performing a second OVS read on the selected memory cell using the first sensing latch.

Abstract: Methods, systems, and devices for controlled and mode-dependent heating of a memory device are described. In various examples, a memory device or an apparatus that includes a memory device may have circuitry configured to heat the memory device. The circuitry configured to heat the memory device may be activated, deactivated, or otherwise operated based on an indication of a temperature (e.g., of the memory device). In some examples, activating or otherwise operating the circuitry configured to heat the memory device may be based on an operating mode (e.g., of the memory device), which may be associated with certain access operations or operational states (e.g., of the memory device). Various operations or operating modes (e.g., of the memory device) may also be based on indications of a temperature (e.g., of the memory device).

Abstract: Embodiments relate to the field of semiconductor technology, and proposes a semiconductor device and a memory. The semiconductor device includes a pull-up circuit integration region, a pull-down circuit integration region and a compensation circuit integration region not overlapped with one another. The semiconductor device further includes an output circuit, and the output circuit includes: a pull-up circuit, a pull-down circuit, and a compensation circuit. The pull-up circuit is connected to a signal output line, and the pull-up circuit is positioned in the pull-up circuit integration region. The pull-down circuit is connected to the signal output line, and the pull-down circuit is positioned in the pull-down circuit integration region. The compensation circuit is configured to enhance a drive capability of an output signal from the signal output line, and the compensation circuit is positioned in the compensation circuit integration region.

Abstract: A semiconductor device includes a multilevel receiver including a signal determiner receiving a plurality of multilevel signals and outputting a result of mutual comparison of the plurality of multilevel signals as an N-bit signal, where N is a natural number equal to or greater than 2. A decoder restores a valid signal among the N-bit signals from the signal determiner to an M-bit data signal, where M is a natural number less than N. A clock generator receives a reference clock signal, generates an input clock signal using the reference clock signal, inputs the input clock signal to the signal determiner, and determines a phase of the input clock signal based on an occurrence probability of an invalid signal not restored to the M-bit data signal among the N-bit signals.