Abstract: In a described example, an integrated circuit (IC) includes a repairable memory system. A repair controller is coupled to the repairable memory system. The repair controller includes compression logic configured to encode memory repair code data for a respective instance of the repairable memory system and provide compressed repair data. A non-volatile memory controller is coupled to the repair controller and to non-volatile memory. The non-volatile memory controller is configured to transfer the compressed repair data to the non-volatile memory for storage.

Abstract: A semiconductor memory device having a flexible refresh skip area includes a memory cell array including a plurality of rows to store data, a row decoder connected to the memory cell array, a refresh area storage unit to store a beginning address and an end address of a memory area that is to be refreshed in which the memory area that is to be refreshed does not include a refresh skip area having a size is selectively and/or adaptively changed, and a refresh control circuit connected to the row decoder and the refresh area storage unit. The refresh control circuit controls a refresh operation for the area that is to be refreshed and not for the refresh skip area.

Abstract: An artificial neuron for a neuromorphic chip comprises a synapse with resistive memory representative of a synaptic weight. The artificial neuron comprises a read circuit, an integration circuit and a logic circuit interposed between the read circuit and the integration circuit. The read circuit is configured to impose on the synapse a read voltage independent of the membrane voltage and to provide an analogue value representative of the synaptic weight. The logic circuit is configured to generate from the analogue value a pulse having a duration. The integration circuit comprises an accumulator of synaptic weights at the terminals of which a membrane voltage is established and a comparator configured to emit a postsynaptic pulse if a threshold is exceeded by the membrane voltage. Moreover, it comprises a source of current controlled by the pulse to inject a current into the accumulator of synaptic weights during this duration.

Abstract: An apparatus includes a potential failure information generation circuit configured to generate potential failure inforrnation by detecting, based on first failure information on a first faded signal line and second failure information on a second faded signal line, whether the first failed signal line and the second faded signal line are adjacent to each other; and a flag generation circuit configured to generate a flag by comparing the potential failure information with redundancy repair information.

Abstract: The disclosure provides a memory device which includes a plurality of word lines grouped into a plurality of WL sets; and a plurality of redundant word lines grouped into M RWL sets; and a memory control circuit connected to the WL sets and the RWL sets and configured to replace a plurality of defective WL sets of the plurality WL sets by selecting from the RWL sets, wherein each of the plurality of defective WL sets comprises at least a defective word line, all of the M RWL sets are available for repairing the WL sets during a wafer stage, where M is an integer greater than 2, and N of M RWL sets is available for repairing the WL sets during the wafer stage, during a package stage and during a post package stage, where N is an integer less than M.

Abstract: A lateral transfer path within an adjustable-width signaling interface of an integrated circuit component is formed by a chain of logic segments that may be intercoupled in different groups to effect the lateral data transfer required in different interface width configurations, avoiding the need for a dedicated transfer path per width configuration and thereby substantially reducing number of interconnects (and thus the area) required to implement the lateral transfer structure.

Abstract: A semiconductor memory device includes a memory cell array, an error correction circuit, an error log register and a control logic circuit. The memory cell array includes a plurality of memory bank arrays and each of the memory bank arrays includes a plurality of pages. The control logic circuit is configured to control the error correction circuit to perform an ECC decoding sequentially on some of the pages designated at least one access address for detecting at least one bit error, in response to a first command received from a memory controller. The control logic circuit performs an error logging operation to write page error information into the error log register and the page error information includes a number of error occurrence on each of the some pages determined from the detecting.

Abstract: A method of operating a non-volatile memory device includes performing a first sensing operation on the non-volatile memory device during a first sensing time including a first section, a second section, and a third section. The performing of the first sensing operation includes applying a first voltage level, which is variable according to a first target voltage level, to a selected word line in the first section, applying a second voltage level, which is different from the first voltage level, to the selected word line in the second section, and applying the first target voltage level, which is different from the second voltage level, to the selected word line in the third section. The first voltage level becomes greater as the first target voltage level becomes greater.

Abstract: Methods, systems, and devices for direct testing of in-package memory are described. A memory subsystem package may include non-volatile memory, volatile memory that may be configured as a cache, and a controller. The memory subsystem may support direct access to the non-volatile memory for testing the non-volatile memory in the package using a host interface of the memory subsystem rather than using dedicated contacts on the package. To ensure deterministic behavior during testing operations, the memory subsystem may, when operating with a test mode enabled, forward commands received from a host device (such as automated test equipment) to a memory interface of the non-volatile memory and bypass the cache-related circuitry. The memory subsystem may include a separate conductive path that bypasses the cache for forwarding commands and addresses to the memory interface during testing.

Abstract: A memory system includes a memory device and a controller. The controller is coupled to the memory device through input/output (I/O) lines. The controller includes an interface component and a dummy power consumption component. The interface component performs a signal training operation for adjusting a timing of a clock signal, to which test data is synchronized. The dummy power consumption component performs a dummy power consumption operation while the signal training operation is performed.

Abstract: A buffer circuit includes a primary interface, a secondary interface, and an encoder/decoder circuit. The primary interface is configured to communicate on an n-bit channel, wherein n parallel bits on the n-bit channel are coded using data bit inversion (DBI). The secondary interface is configured to communicate with a plurality of integrated circuit devices on a plurality of m-bit channels, each m-bit channel transmitting m parallel bits without using DBI. And the encoder/decoder circuit is configured to translate data words between the n-bit channel of the primary interface and the plurality of m-bit channels of the secondary interface.

Abstract: An integrated circuit includes a test counting circuit, a test information storage circuit, a sequence control circuit and a driving circuit. The test counting circuit generates a counting address signal. The test information storage circuit stores a test control value and outputs the test control value based on the counting address signal. The sequence control circuit changes an output sequence of the test control value based on a sequence control signal and outputs a final test control value based on the test control value or a target control value. The driving circuit performs a pre-set test operation based on the final test control value.

Abstract: A corresponding value of a data state metric associated with each of a value of a plurality of values of a memory access operation parameter used in one or more memory access operation is measured. An optimal metric value based on the measured values of the predetermined data state metric is determined. An optimal value of the memory access operation parameter from the plurality of values of the memory access operation parameter is selected.

Abstract: Memory devices may have an array of elements in two or more dimensions. The memory devices use multiple access lines arranged in a grid to access the memory devices. Memory cells located at intersections of the access lines in the grid. Drivers are used for each access line and configured to transmit a corresponding signal to respective memory cells of the plurality of memory cells via a corresponding access line. The memory devices may use an address scrambler to determine a bit error rate for accessing memory cells and remap an address of a particular memory cell to have a bit error rate below a threshold. In this way, the address scrambler may distribute the bit error rates of multiple accesses of the array.

Abstract: A semiconductor memory device includes a memory cell array, an error correction code (ECC) circuit and a control logic circuit to control the ECC circuit. The memory cell array includes memory cells and a normal cell region and a parity cell region The ECC circuit, in a normal mode, receives a main data, performs an ECC encoding on the main data to generate a parity data and stores the main data and the parity data in the normal cell region and the parity cell region. The ECC circuit, in a test mode, receives a test data including at least one error bit, stores the test data in one of the normal cell region and the parity cell region and performs an ECC decoding on the test data and one of the main data and the parity data to provide a decoding result data to an external device.

Abstract: According to one embodiment, a memory system includes a non-volatile memory provided with a plurality of memory cells, and a memory controller. The memory controller reads data subjected to error-mitigation encoding from the non-volatile memory, the data including determination information indicating whether or not a value is changed by the error-mitigation encoding, executes error-mitigation decoding on the read data, re-executes the error-mitigation encoding on a decoding result obtained by the error-mitigation decoding, and compares the determination information included in the read data with determination information included in data obtained by re-executing the error-mitigation encoding and outputs a comparison result.

Abstract: The disclosure provides a novel system of storing information using a charged polymer, e.g., DNA, the monomers of which correspond to a machine-readable code, e.g., a binary code, and which can be synthesized and/or read using a novel nanochip device comprising nanopores; novel methods and devices for synthesizing oligonucleotides in a nanochip format; novel methods for synthesizing DNA in the 3? to 5? direction using topoisomerase; novel methods and devices for reading the sequence of a charged polymer, e.g., DNA, by measuring capacitive or impedance variance, e.g., via a change in a resonant frequency response, as the polymer passes through the nanopore; and further provides compounds, compositions, methods and devices useful therein.

Abstract: Methods, systems, and devices supporting an auto-power on mode for biased testing of a power management integrated circuit (PMIC) are described. A system may program a PMIC of a memory system to a specific mode. The mode may cause the PMIC to apply a bias to a memory device of the memory system upon receiving power and independent of a command to apply the bias to the memory device. The system may transmit power to the memory system while controlling one or more operating conditions (e.g., temperature, humidity) for a threshold time. The PMIC may apply a bias to the memory device during the threshold time based on the PMIC being programmed to the mode and the transmitted power. The system may identify a capability or defect of the memory device resulting from transmitting the power to the memory system while controlling the operating conditions for the threshold time.

Abstract: A memory device includes a latch circuit suitable for storing an input address as a first latch address in response to a first latch signal, and storing an address, selected between the input address and the first latch address, as a second latch address in response to a second latch signal, a test determining circuit suitable for determining whether a memory cell fail occurs, based on test data, and generating a detection signal corresponding to the determination result, in response to a test mode signal, and a control signal generation circuit suitable for comparing the input address to the first and second latch addresses in response to the detection signal, and selectively enabling the first and second latch signals according to the comparison result.

Abstract: Memory devices and systems with automatic background precondition upon powerup, and associated methods, are disclosed herein. In one embodiment, a memory device includes a memory array having a plurality of memory cells and a fuse array configured to store precondition data. The precondition data can identify a portion of the memory array, specify a predetermined precondition state, or a combination thereof. When the memory device powers on, the memory device can be configured to automatically retrieve the precondition data from the fuse array and/or to write memory cells in the portion of the memory array to the predetermined precondition state before executing an access command.