Abstract: An associative-memory-storage unit, and to an associative-memory-storage method are provided. The associative-memory-storage unit includes a first subset of at least memory sub-units over w bits, and a second memory sub-unit over v bits. The associative-memory-storage sub-unit may be used to associate messages with labels, and vice versa.

Abstract: The embodiments provide a method for reading and writing and a memory device. The method includes: applying a read command to the memory device, the read command pointing to address information; reading data to be read out from a memory cell corresponding to the address information pointed to by the read command; storing the address information pointed to by the read command into a memory bit of a preset memory space if an error occurs in the data to be read out, wherein the preset memory space is provided with a plurality of the memory bits, each of the plurality of memory bits being associated with a spare memory cell; and backing up the address information stored in the preset memory space into a non-volatile memory cell according to a preset rule.

Abstract: A method, apparatus, and system for level dependent error correction code protection in multi-level non-volatile memory. A write command to write data to a non-volatile memory array may be received. At least one multi-level page of multi-level storage cells may be determined for the write data. A coding rate for the write data of the at least one multi-level page may be determined based on an attribute of the at least one multi-level page. An ECC codeword may be generated that satisfies the coding rate and includes the write data. The ECC codeword may then be stored on the at least one multi-level page.

Abstract: A first scan operation of a set of memory pages of a data block is performed using a first reliability threshold level to identify a set of scan results. A workload type associated with the data block is determined based on the set of scan results. The first reliability threshold level is adjusted to a second reliability threshold level based on the workload type. A second scan operation of the set of memory pages of the data block is performed using the second reliability threshold level.

Abstract: The disclosure provides methods of synthesizing DNA using topoisomerase-mediated ligation, by adding single nucleotides or oligomers to a DNA strand in the 3? to 5? direction.

Abstract: A semiconductor memory device includes a plurality of memory cell transistors arranged along a common semiconductor layer. Each of the plurality of memory cell transistors comprises a first source/drain region and a second source/drain region formed in the common semiconductor layer; a gate stack formed on a portion of the common semiconductor layer between the first source/drain region and the second source/drain region; and an electrical floating portion in the portion of the common semiconductor layer, a charge state of the electrical floating portion being adapted to adjust a threshold voltage and a channel conductance of the memory cell transistor. The plurality of memory cell transistors connected in series with each other along the common semiconductor layer provide a memory string.

Abstract: A semiconductor device is provided, which contains a memory bank including M primary word lines and R replacement word lines, a row/column decoder, and an array of redundancy fuse elements. A sorted primary failed bit count list is generated in a descending order for the bit fail counts per word line. A sorted replacement failed bit count list is generated in an ascending order of the M primary word lines in an ascending order. The primary word lines are replaced with the replacement word lines from top to bottom on the lists until a primary failed bit count equals a replacement failed bit count or until all of the replacement word lines are used up. Optionally, the sorted primary failed bit count list may be re-sorted in an ascending or descending order of the word line address prior to the replacement process.

Abstract: Apparatuses and techniques for compensating for noise, such as a leakage current, in a memory array are described. Leakage currents may, for example, be introduced onto a digit line from unselected memory cells. In some cases, a compensation component may be coupled with the digit line during a first phase of a read operation, before the target memory cell has been coupled with the digit line. The compensation component may sample a current on the digit line and store a representation of the sampled current. During a second phase of the read operation, the target memory cell may be coupled with the digit line. During the second phase, the compensation component may compensate for leakage or other parasitic effects by outputting a current on the digit line during the read operation based on the stored representation of the sampled current.

Abstract: Disclosed in some examples are methods, systems, devices, memory devices, and machine-readable mediums for using a non-defective portion of a block of memory on which there is a defect on a different portion. Rather than disable the entire block, the system may disable only a portion of the block (e.g., a first deck of the block) and salvage a different portion of the block (e.g., a second deck of the block).

Abstract: A memory component comprises a memory unit including an array of memory cells, a controller of the memory unit, and a JTAG test interface including a plurality of contact pads adapted to connect the memory component with a host device and/or a test machine, wherein the test interface further comprises a plurality of test registers, which are configured to store the operating instructions for performing the test of the memory component, and wherein those test registers are organized in a matrix configuration, each row of the matrix being associated with a specific address. A related System-On-Chip device and a related method are further disclosed.

Abstract: A method for operating a memory includes: activating a first row, and sensing and amplifying, by a first bit line sense amplifier array, data of memory cells of the first row; transferring data of first columns of the first row from the first bit line sense amplifier array to global input/output lines through first input/output sense amplifiers; storing data of the global input/output lines in the first columns of a dummy bit line sense amplifier array through dummy write drivers; transferring data of second columns of the first row from the first bit line sense amplifier array to the global input/output lines through the first input/output sense amplifiers; and storing the data of the global input/output lines in the second columns of the dummy bit line sense amplifier array through the dummy write drivers.

Abstract: A semiconductor memory device includes a plurality of memory cell transistors arranged along a common semiconductor layer. Each of the plurality of memory cell transistors comprises a first source/drain region and a second source/drain region formed in the common semiconductor layer; a gate stack formed on a portion of the common semiconductor layer between the first source/drain region and the second source/drain region; and an electrical floating portion in the portion of the common semiconductor layer, a charge state of the electrical floating portion being adapted to adjust a threshold voltage and a channel conductance of the memory cell transistor. The plurality of memory cell transistors connected in series with each other along the common semiconductor layer provide a memory string.

Abstract: A memory device includes an at least one first normal mat and an at least one second normal mat, a first redundancy mat configured to provide one or more first redundancy column lines for repairing one or more column lines disposed in the at least one first normal mat, a second redundancy mat configured to provide one or more second redundancy column lines for repairing one or more column lines disposed in the at least one second normal mat, and a redundancy segmented input/output (I/O) line coupled to both of the first redundancy mat and the second redundancy mat.

Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.

Abstract: A memory system includes a nonvolatile semiconductor memory and a memory controller. The memory controller is configured to schedule plural types of reliability countermeasure processes to be executed for the nonvolatile semiconductor memory. The plural types of reliability countermeasure processes includes at least a first reliability countermeasure process. The memory controller is configured to skip the first reliability countermeasure process to be executed when the first reliability countermeasure process is not necessary to be executed by executing an access process other than the first reliability countermeasure process to the nonvolatile semiconductor memory.

Abstract: Disclosed herein is an apparatus that includes a first address generator generating a first address in response to a clock signal; a second address generator generating a second address corresponding to the first address; a first detection circuit activating a first signal when the second address matches with a third address; a second detection circuit activating a second signal when the second address indicates a predetermined state; a first latch circuit latching the first address in response to the first signal; a second latch circuit latching the first address in response to the second signal; a third detection circuit activating a third signal when the first address matches with an address stored in the first latch circuit; a fourth detection circuit activating a fourth signal when the first address matches with an address stored in the second latch circuit; and a first selector selecting the third or fourth signal.

Abstract: Embodiments of three-dimensional memory device architectures and fabrication methods therefor are disclosed. In an example, the memory device includes a substrate and one or more peripheral devices on the substrate. The memory device also includes one or more interconnect layers and a semiconductor layer disposed over the one or more interconnect layers. A layer stack having alternating conductor and insulator layers is disposed above the semiconductor layer. A plurality of structures extend vertically through the layer stack. A first set of conductive lines are electrically coupled with a first set of the plurality of structures and a second set of conductive lines are electrically coupled with a second set of the plurality of structures different from the first set. The first and second sets of conductive lines are vertically distanced from opposite ends of the plurality of structures.

Abstract: A storage device is provided. The storage device includes a nonvolatile memory device including a first block and a second block, and a controller including processing circuitry configured to, predict a number of writes to be performed on the nonvolatile memory device using a machine learning model, determine a type of reclaim command based on the predicted number of writes, the reclaim command for reclaiming data of the first block to the second block, and issue the reclaim command.

Abstract: Some examples described herein relate to multi-chip devices. In an example, a multi-chip device includes first and second chips. The first chip includes a power supply circuit and a logic circuit. The first and second chips are coupled together. The second chip is configured to receive power from the power supply circuit. The second chip includes a programmable circuit, a pull-up circuit, and a detector circuit. The detector circuit is configured to detect a presence of a power voltage on the second chip and responsively output a presence signal. The power voltage on the second chip is based on the power from the power supply circuit. The logic circuit is configured to generate a pull-up signal based on the presence signal. The pull-up circuit is configured to receive the pull-up signal and configured to pull up a voltage of a node of the programmable circuit responsive to the pull-up signal.

Abstract: In a particular implementation, a method includes: providing a first voltage to a word-line coupled to a first transistor device; providing a second voltage to a bit-line coupled to the first transistor device; providing a third voltage to a source-line coupled between a programmable resistive device and a voltage control element. Also, the first transistor device is coupled to the programmable resistive device and the voltage control element, where the programmable resistive device is configured to replace a first data value by writing a second data value in the programmable resistive device. Moreover, in response to a voltage difference across the programmable resistive device exceeding a particular threshold, limiting the voltage difference by one of reducing the second voltage on the bit-line or increasing the third voltage on the source-line.