Abstract: A conveyor system for conveying of piece goods has frame profiles and an energy supply bus disposed along the frame profile. The conveyor system includes a first connection box for electrical connection of a first actuator, and a second connection box for connection of a second actuator, which differs from the first actuator with regard to its nominal voltage. Furthermore, a modular system includes a first connection box and a second connection box of the type. In particular, a voltage converter is disposed in the second connection box, which converter makes available an output alternating voltage of 110 VAC and/or 230 VAC and/or 400 VAC.

Abstract: According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

Abstract: An apparatus and method relating to a cooling adapter having a housing with at least one mounting aperture and including at least one cooling manifold comprising an inlet plenum having at least one inlet for entry of a cooling fluid, an outlet plenum having at least one outlet for exhausting the cooling fluid, and a plurality of channels disposed between the inlet channel and the outlet channel for allowing the cooling fluid to move therebetween.

Abstract: An electronic device includes a casing, a fan base, a fan side wall and an impeller. The casing has a fan top wall. The fan top wall has an airflow inlet. The fan base is provided in the casing. The fan side wall extends from the casing or the fan base. The fan top wall, the fan base and the fan side wall define a fan space communicated with the airflow inlet and a first airflow outlet communicated with the fan space. The impeller is mounted at the fan base and is located in the fan space.

Abstract: A display system, such as a wearable display device, includes a system housing including a cavity having a linear axis extending generally in parallel with first and second side walls enclosing the cavity and a display stack enclosed within the cavity and movable along the linear axis. The display stack includes a display panel and a support chassis configured to support a first side of the display panel and thermally couple the display panel to the first side wall to facilitate heat transfer from the display panel, across the support chassis, and to the system housing The display stack includes a heat sink configured for support by a second side of the display panel and to thermally couple the display panel to the second side wall to facilitate heat transfer from the display panel, across the heat sink, and to the system housing.

Abstract: A cooling system for cooling a set of components on a circuit board includes a vapor chamber for distributing heat over a larger surface area, a fan in a housing configured to direct a first airflow in a first direction to a first heatsink and direct a second airflow in a second direction opposite the first direction to a second heatsink. The heatsinks can have different sizes and the fan can be located relative to a midpoint of the vapor chamber or the circuit board or positioned relative to a component on the circuit board.

Abstract: A dissipating device applied to an electronic device and configured to absorb the heat source generated by the electronic device. A thermal conductive fluid is filled in the dissipating device of the present disclosure. The thermal conductive fluid is a mixture of two immiscible fluid mediums. When the thermal conductive fluid contacts the heat source of the electronic device, the thermal conductive fluid will continuously undergo a phase transition cycle to speed up the heat dissipation effect of the dissipating device on the electronic device and achieve an excellent heat dissipation effect.

Abstract: A portable electronic device is disclosed. The portable electronic device may include a laptop computing device that includes a base portion and a display housing rotationally coupled to the base portion. The base portion includes a fan designed to drive heated air out of the base portion, thus cooling the portable electronic device. A dynamic (movable) air diverter is integrated into the base portion near the fan's outlet. The air diverter is designed to direct airflow from the fan outlet. Moreover, the air diverter can be repositioned by, for example, rotating the display housing relative to the base portion. As a result of the repositioned air diverter, the airflow from the fan outlet is redirected out of the portable electronic device through a different location. The air diverter can be positioned in different discrete locations, or alternatively, can move continuously with the rotational movement of the display housing.

Abstract: A system, method, and apparatus for a heat riser having stackable blocks of thermally conductive material that include an upper block and a lower block, wherein the lower block has a lower surface that is configured to be engaged in thermal communication with a heat source. The lower block also having an inclined upper surface, that is configured to be in thermal communication with a block directly above, having a complemental inclined surface, wherein the blocks are elastically coupled with elastic components. The upper block may slide along the lower block allowing for vertical and horizontal axial elastic adjustment while providing consistent pressure to both the heat source and a cooling source to provide for heat dispersion along a thermal pathway from the heating source through the lower block, upper block and to a cooling source.

Abstract: A high-efficiency electronic thermal management system and method providing a heat riser having stackable blocks of thermally conductive material that include an upper block and a lower block, wherein the lower block has a lower surface mounted in thermal communication with a heat source. The lower block having an inclined upper surface configured to be in thermal communication with a block directly above, having a complemental inclined surface. These blocks are elastically coupled. The upper block may slide along the lower block allowing for vertical and horizontal axial elastic adjustment while providing consistent pressure to both the heat source and a cooling source to provide for heat dispersion along a thermal pathway from the heating source through the lower block, upper block, and to a cold plate cooling source. The cold plate also has internal fins and flowing liquid for heat dispersion.

Abstract: Embodiments are disclosed of an apparatus including a room manifold comprising at least one fluid loop. A plurality of rack manifolds is fluidly coupled to, and projects from, the room manifold. Each rack manifold includes one or more connectors to couple the rack manifold to one or more components within an electronics rack. A plurality of valves is fluidly coupled in the room manifold, and each rack manifold is fluidly coupled to the room manifold between a pair of valves. The pair of valves can be used to terminate flow between the room manifold and each rack manifold.

Abstract: A cooling system for an electronic rack of a data center, such as an IT rack or PoD, is disclosed. The system includes a coolant distribution unit (CDU) coupled to a rack manifold of the electronic rack through a fluid cooling loop. The CDU supplies cooling fluid that is distributed to the IT rack or PoD, and receives returning warm/hot fluid from the IT rack or PoD. The system further includes an enhancing cooling unit to receive a first part of a first distributed portion of the cooling fluid and to further cool the first part of the first distributed portion of the cooling fluid to a lower temperature value than the one of the supplied cooling fluid through an enhancing cooling loop. The system further includes a first external cooling unit connected to the CDU through a cooling fluid loop to supply the cooling fluid to the CDU.

Abstract: The inductance of a noise filter circuit is reduced, and an output is increased, whereby positive and negative electrode power supply side conductors each include a first and second conductor portions having a side surface and a main surface having an area larger than an area of the side surface. The first conductor portions are arranged on one surface of a base portion with an insulating member interposed therebetween. The second conductor portions penetrate through a core member in a state in which the main surfaces face each other. A width of a portion of the first conductor portion which is in contact with the insulating member in a direction perpendicular to current flow direction is larger than a width of a portion of the second conductor portion which is disposed within the core member in the direction perpendicular to current flow direction.

Abstract: This disclosure describes systems for cooling one or more data halls of a data center that include one or more sections of a cooling spine. Each section of the cooling spine includes a riser module, a manifold module, and one or more arrays of cooling units. The riser module includes riser piping configured to fluidically couple to a liquid cooling system. The manifold module includes manifold piping fluidically coupled to the riser piping. Each array of cooling units is positioned toward a data hall of the one or more data halls of the data center and includes a heat exchanger assembly and a circulation assembly. The heat exchanger assembly is fluidically coupled to the manifold piping and configured to cool return air from a hot aisle adjacent a row of cabinets. The circulation assembly is configured to discharge supply air to a cold aisle adjacent the row of cabinets.

Abstract: A flap for a cage for holding electronic devices in a computing system is disclosed. The flap includes a main segment, a first vertical extension, a second vertical extension, a lateral ledge, and a tapered ledge. The first vertical extension and the second vertical extension extend from a first side of the main segment. The lateral ledge extends from a third side of the main segment. The tapered extensions extend from a second side of the main segment and include a flat section and an angled section. The flap has a deployed position and a stored position in the cage. The flap engages with at least two sides of the cage in the deployed or the stored position. The flap may be in the stored position when an electronic component is present. The flap blocks airflow through the cage in the deployed position.

Abstract: A power electronic module having reduced mass and/or reduced package size as compared with conventional modules employing die cast materials, secondary machining, and/or welding operations includes a housing, a discrete cooling channel positioned in the housing and having opposing cooling surfaces, and first and second printed circuit board assemblies disposed on opposite sides of the cooling channel.

Abstract: An apparatus, such as a power routing apparatus, includes an enclosure having first and second compartments having respective first and second opposing walls. A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow in a direction parallel to the first and second opposing walls. First and second semiconductor switches (e.g., static switches) are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow.

Abstract: A power conversion device includes a housing, a power conversion unit, a fan, and a flexible shutter. The shutter is in a sheet shape. The shutter includes an end portion and a movable portion, the end portion being fixed to at least one of the housing and a frame body, the movable portion being movable with respect to the housing. The shutter is configured to be deformed by wind from the fan in a case where the fan is driven and to form a gap through which the wind passes between the shutter and at least one of the housing and the frame body.

Abstract: A circuit device 1 includes: a circuit assembly including a circuit board; a heat sink; and heat dissipation grease. The heat sink includes a main plate portion disposed to face the circuit board, and boss portions protruding from the main plate portion toward the circuit board and abutting the circuit board, and is a member fixed to the circuit board by screwing. The heat dissipation grease is a heat transfer material that is interposed between the circuit board and the main plate portion, and has fluidity. The main plate portion includes, on a heat transfer surface facing the circuit board, a first grease application region to which the heat dissipation grease is applied. The circuit board includes a shielding wall extending from a heat dissipation surface facing the main plate portion toward an intermediate region between the first boss portion and the first grease application region in the main plate portion.

Abstract: A ventilation device of an embodiment includes a housing, a shutter case, a fan, and a shutter. The shutter case has an opening. The fan is configured to exhaust air inside the housing to outside through the opening. The shutter partitions inside of the shutter case into a first chamber communicating with the opening and a second chamber different from the first chamber, and opens and closes the opening by a rotating operation. The fan is arranged on a first chamber side of the shutter case in the housing. The first chamber is a positive pressure region of the fan. The second chamber is a negative pressure region of the fan. The second chamber of the shutter case communicates only with the negative pressure region in the housing. The shutter is provided so that a pressure received from the second chamber is smaller than a pressure received from the first chamber.