Abstract: An apparatus includes a housing, at least one heat-generating electrical module, and at least one fan. The housing includes a floor and at least one sidewall extending around the floor's perimeter. A first sidewall end section defines an air intake port and a second sidewall end section defines a first air exhaust port. The floor includes two noncoplanar floor portions and a transition portion interconnecting them. The transition portion defines a second air exhaust port. The heat-generating module(s) are positioned over the floor portions. Inside surfaces of the floor portions together with external surfaces of the heat-generating module(s) define at least one air flow channel therebetween. The fan or fans are positioned proximate the air intake port and operable to draw air into the housing through the intake port. The fan or fans force the indrawn air through the air flow channel(s) and out the air exhaust ports.

Abstract: A server drawer comprising a plurality of Printed Circuit Boards (PCBs) respectively containing heat-generating electronic devices. The server drawer further comprises a plurality of fans configured to convectively dissipate heat from the heat-generating electronic devices. The server drawer further comprises internal partitions isolating airflow between respective PCBs of the plurality of PCBs.

Abstract: A cooling system for a capacitor may include a housing for the capacitor, the housing comprising of a bottom surface, a top surface, and at least one side surface connecting the bottom surface and the top surface, the housing further including: a bottom inlet manifold and a bottom outlet manifold extending along the bottom surface; an inlet side channel extending along the side surface, the inlet side channel being in fluid communication with the bottom inlet manifold; an outlet side channel extending along the side surface, the outlet side channel being in fluid communication with the bottom outlet manifold; a top inlet manifold extending along the top surface, the top inlet manifold being in fluid communication with the inlet side channel; and a top outlet manifold extending along the top surface, the top outlet manifold being in fluid communication with the outlet side channel.

Abstract: A fan tray for an enclosure containing devices to be cooled is provided. The fan tray includes a top cover having a top surface and a bottom surface facing opposite the top surface, wherein, when the fan tray is mated to the enclosure, (i) the top surface is exposed relative to outside the enclosure and (ii) the bottom surface is contained within the enclosure, a fan-receiving portion extending from the bottom surface of the top cover and configured to receive one or more fans, and one or more electrical connectors configured to provide electrical power to the one or more fans.

Abstract: Presented herein is a cold plate assembly including a sub-plate and a vapor chamber for use as part of a remote fin cooling system for an electronic device. The sub-plate includes a first surface, a second surface, and a plurality of pipes. The vapor chamber includes a first wall and a second wall opposite the first wall. The first wall and the second wall define an interior cavity having a first depth for one or more first portions of the vapor chamber and a second depth for one or more second portions of the vapor chamber. The second surface of the sub-plate is attached to the first wall of the vapor chamber.

Abstract: The invention relates to a switch cabinet arrangement with at least one IT rack or switch cabinet housing and with at least one cooling device, which has an air-liquid heat exchanger for cooling components accommodated in the IT rack or switch cabinet housing with cooled air, wherein the air-liquid heat exchanger comprises a first flow for cooled liquid and a first return for heated liquid, wherein the cooling device comprises a liquid-liquid heat exchanger, to the second flow of which the first return of the air-liquid heat exchanger is connected. A corresponding method is further described.

Abstract: A liquid cooling static synchronous series compensator (SSSC) system has inverter valve modules, inverter valve units and liquid cooling blocks. Liquid cooling blocks may be configured to provide a jetted flow, a parallel flow or an individualized flow, within an enclosed fluid chamber, for cooling inverter valve units. Liquid cooling blocks may have voltage isolation.

Abstract: An electrical connector cage assembly includes a connector casing, a heat sink, and an attaching part. The heat sink includes a base and a plurality of fins extending from a top surface of the base. The fins extend above a marginal area of the top surface to form an open slot with the marginal area. The open slot has two end openings and a side opening extending to the end openings. The attaching part passes through the open slot and protrudes from the end openings to be detachably engaged with the connector casing to detachably fix the base onto the connector casing. Therein, the attaching part is separable from the heat sink from the side opening. An electrical connector includes a circuit board, an electrical connector base, and the electrical connector cage assembly. The electrical connector base is electrically connected onto the circuit board and exposed from the connector casing.

Abstract: According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

Abstract: An apparatus including a heat sink having two or more sections of parallel fins that define colinear channels is disclosed herein. The colinear channels are configured to direct flow of air or coolant across the heat sink and have wider channel widths closer to an inlet for the air or coolant and narrower widths closer to an outlet for the air or coolant.

Abstract: A component for a vehicle electric drive is described, which includes at least one connecting lug pair projecting from the component for electrically connecting the component. Here, a first connecting lug and a second connecting lug of the connecting lug pair each have a joining zone for electrically connecting the component. Furthermore, an assembly for a vehicle electric drive is presented, which has at least two such components. Further presented is a method of electrically conductively connecting two components.

Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.

Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

Abstract: Provided is a cooling system for a power conversion device that includes a radiator, a radiator fan supplying air to the radiator, and a power conversion device including a plurality of electric components and a casing housing the plurality of electric components inside. The casing includes a base portion which is formed of a non-metallic material and on which the plurality of electric components is placed and a cover portion formed of a metallic material, fixed to the base portion, and covering a periphery of the plurality of electric components. A refrigerant channel through which a refrigerant cooling the plurality of electric components flows is formed in the base portion of the casing, and the casing is disposed at a position where an airflow of the radiator fan is applied to the cover portion.

Abstract: Disclosed are a display module and a method for manufacturing the same, and a display device. The display module includes: a display panel, a heat dissipation layer, a heat conduction assembly, and a driving chip, wherein the display panel includes a first part and a second part opposite to each other, and a bending part connecting the first part and the second part; the heat dissipation layer is disposed on a side, proximal to the second part, of the first part; the heat conduction assembly is disposed between the heat dissipation layer and the second part; an area of an orthographic projection of the heat conduction assembly on the first part is smaller than an area of an orthographic projection of the heat dissipation layer on the first part; and the driving chip is disposed on a side, distal from the heat conduction assembly, of the second part distal.

Abstract: An electronic apparatus with convenient airflow-reversing function includes a chassis, a rotation mechanism, a fan device, a connection rod, and a handle. The chassis includes a bottom plate. The rotation mechanism is pivoted on the bottom plate. The fan device is disposed on the rotation mechanism. The connection rod is pivoted on the rotation mechanism. The handle is pivoted on the chassis, and is rotatably connected to the connection rod. When the handle is rotated, the connection rod drives the rotation mechanism and the fan device to rotate to change the airflow direction.

Abstract: An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

Abstract: A liquid cooling system can be installed to an information technology (IT) rack. The liquid cooling system can include a cooling assembly that has a cooling chassis and cold plates fixed at a bottom portion of the cooling chassis. Fluid lines are arranged in an interior of the cooling chassis to fluidly connect the cold plates to a supply line and a return line. The cooling chassis includes an outlet port that provides a path for a leaked fluid to flow out of the cooling chassis. The outlet port is inserted into an opening of a detection channel that has one or more fluid sensors within the detection channel. The floor of the cooling chassis may have a shape or other features to assist flow of leaked fluid towards the outlet port to assist in depositing the leaked fluid in the detection channel.

Abstract: A mounting rail is provided that includes a DIN rail and one or more heating cable channels. A channel defined by the DIN rail may include one of the heating cable channels. Heating cables may be installed in the heating cable channels using adhesive and/or heat transfer material to form an electronics heating module. The heating cables may be self-regulating heating cables. The mounting rail may include multiple heat transfer fins that transfer heat generated by the heating cables to environment surrounding the mounting rail. A terminal block may be mounted on the DIN rail and may supply electric power to the heating cables.

Abstract: The disclosure provides an electronic control apparatus including a printed circuit board with a first surface side and a second surface side and with at least one electronic component that is arranged on at least one of the surface sides of the printed circuit board. At least one heat sink is arranged on the printed circuit board on the opposite surface side from the electronic component for the purpose of heat dissipation. The printed circuit board with the electronic component and the heat sink are surrounded by a casing made from a thermosetting plastic material such that at least one outer side of the heat sink is free of thermosetting plastic material.