Abstract: The present invention relates to a cooling system and method for regulating environmental conditions of a racked server unit having a plurality of server modules. The system comprises of an inlet line connected to a plurality of circulation conduits, wherein the plurality of circulation conduits receive a cooling medium from the inlet line, and the circulation conduits circulates the cooling medium through the racked server unit. A plurality of cold plates are positioned within the racked server unit, wherein one or more of the plurality of cold plates are thermally coupled to each of the plurality of server modules, and the plurality of cold plates are connected to one or more of the plurality of circulation conduits. An outlet line is connected to the plurality of circulation conduits, wherein the outlet line receives the cooling medium circulated through the racked server unit from the plurality of circulation conduits.

Abstract: Embodiments are disclosed of an apparatus including a utility section adapted to be positioned in a server chassis and coupled to an electronics section in the server chassis. The utility section includes a power board, a fluid handling module, a fan module electrically coupled to the power board, or both the fluid handling module and the fan module. An external power interface is adapted to electrically couple the power board to a rack power source and an internal power interface is adapted to electrically coupled the power board to one or more servers in an electronic section within the chassis. An external fluid interface is adapted to fluidly couple the fluid handling module to a rack fluid recirculation loops, and an internal fluid interface is adapted to fluidly couple the fluid handling module to a server fluid inlet and a server fluid outlet of each of the one or more electronics sections.

Abstract: A fanless cooling system for particularly fail-safe and efficient cooling of electronic modular systems in vehicles, more particularly in rail vehicles, includes a preferably frame-shaped rack or assembly carrier for holding at least one module or assembly, more particularly a processor module having high-performance multi-core processors. A heat transport body can be mounted in a heat-transferring manner on a part or component of the module. The rack has at least one heat distribution body, to which the heat transport body can be fastened in a heat-transferring manner, preferably detachably, when the module having the part coupled to the heat transfer body is held in the rack. At least one heat tube is connected to the heat distribution body in a heat-transferring manner. An electronic modular system with a fanless cooling system is also provided.

Abstract: A heat transfer device, including a sealed container defining an internal chamber having a first internal surface positioned opposite to a second internal surface, the sealed container including a first end and a second end positioned opposite to the first end; internal fins extending from the first internal surface of the internal chamber towards the second internal surface of the internal chamber, the internal fins positioned at the second end of the sealed container; a wicking structure positioned along the internal surfaces, and positioned between adjacent fins along the first internal surface such that the internal fins are in thermal communication with the wicking structure; a remote heat exchanger positioned along an external surface of the sealed container at the second end of the sealed container, the remote heat exchanger adjacent to the internal fins such that the remote heat exchanger is in thermal communication with the internal fins.

Abstract: An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.

Abstract: The present invention provides a heat dissipation conductive flexible board, which is assembled from: at least a single layer thin board, the structure of which includes a first conductive thin layer and a first functional thin layer, and at least a double layer thin board, the structure of which includes a second conductive thin layer, a second functional thin layer, and a third functional thin layer. A spraying, coating, or printing method is used to manufacture the single layer thin board and the double layer thin board; after which the single layer thin board and the double layer thin board are laminated together to form the heat dissipation conductive flexible board having a multi-layer conductive structure.

Abstract: A seismic shim for electronic equipment comprises a base comprising at least a first hole through the base, wherein the first hole is configured to receive a first fastener, and an extension portion extending from the base. The extension portion is perpendicular to the base and comprises at least a second hole through the extension portion, wherein the second hole is configured to receive a second fastener. The seismic shim also comprises a first gusset and a second gusset disposed between the base and the extension portion. The second gusset is spaced apart from the first gusset. The seismic shim is configured for anchoring to an underlying floor structure via the first fastener inserted through the first hole, and is configured for attachment to a surface of the electronic equipment via the second fastener inserted through the second hole.

Abstract: An information technology (IT) enclosure may have a hybrid architecture. Such an enclosure may include an immersion tank that holds a single-phase coolant fluid. One or more servers may be immersed in the tank. The server chassis may have electronics that are thermally coupled to a two-phase fluid via a thermosiphon loop. The server chassis includes a condensing unit forming the thermosiphon loop and the condensing unit is submerged in the single phase fluid.

Abstract: In various embodiments, a wearable component configured to be worn on a head of a user is disclosed. The wearable component can comprise a wearable support and an electronic component coupled to or disposed within the wearable support. A thermal management structure can be provided in thermal communication with the electronic component. The thermal management structure can be configured to transfer heat from the electronic component away from the head of the user when the wearable support is disposed on the head of the user.

Abstract: Embodiments relate to a system, an apparatus, and a method that involve a plurality of stackable enclosure units that include inter-unit or inter-module passages for facilitating cooling of interior compartments of the units, especially server units.

Abstract: Several transportable datacenters are described. The transportable datacenters include transport systems allowing them to be transported between an assembly location and an operating location. The transportable datacenters also include a ventilation system for cooling processors positioned in racks in the datacenters. The ventilation system draws cold air from the environment, through processor bays containing the processors and then exhausts the air back to the environment.

Abstract: Provided are a housing and an electronic device. The housing comprises a middle frame, a heat-conducting element and a protective member. The middle frame is provided with a first receiving area configured to receive an electronic component of an electronic device. The middle frame is further provided with an accommodating groove. The accommodating groove penetrates the middle frame and is communicated with the first receiving area. The heat-conducting element is accommodated in the accommodating groove. The protective member is at least partially accommodated in the accommodating groove, and is arranged at a side of the heat-conducting element that faces towards the first receiving area. In the embodiments, the protective member is opposite to or in contact with the electronic component arranged in the first receiving area, and separates the heat-conducting element accommodated in the accommodating groove from the electronic component arranged in the first receiving area.

Abstract: A fan tray, for a fan module of a network device chassis, may include an inner assembly that includes an inner cassette, one or more fans connected to the inner cassette, a first latch connected to the inner cassette and configured to removably connect to an outer assembly of the fan tray, and a fan controller connected to the inner cassette and configured to control operation of the one or more fans. The outer assembly may be configured to receive and retain the inner assembly, and may include an outer cassette with one or more openings configured to communicate with the one or more fans, a second latch connected to the outer cassette and configured to removably connect to a rear portion of the network device chassis, and an adaptor connected to the outer cassette and configured to connect and provide power to the fan controller.

Abstract: Embodiments of this application disclose a housing structure and a terminal device. The housing structure includes a bottom shell and a lifting shell. A first end of the bottom shell is connected to a first end of the lifting shell, a second end of the bottom shell and a second end of the lifting shell are spaced by a first distance, and space between the bottom shell and the lifting shell forms a heat dissipation channel. A heat dissipation panel is disposed on the bottom shell, a first surface of the heat dissipation panel is in contact with a heat emitting component, and a second surface of the heat dissipation panel is located in the heat dissipation channel. Therefore, the housing structure provided in the embodiments of this application can better dissipate heat for the heat emitting component in the bottom shell.

Abstract: The disclosure relates to a wireless charging device including a cooling fan, and the wireless charging device according to an embodiment of the disclosure includes: a housing including a holding portion configured to hold an external electronic device; a first bracket positioned in the holding portion; a conductive coil disposed in the first bracket; a second bracket positioned in the holding portion and including a penetrating hole; a first cooling fan positioned in the penetrating hole; a second cooling fan positioned in the penetrating hole and spaced apart from the first cooling fan; and a partition formed in the penetrating hole to isolate the first cooling fan and the second cooling fan from each other, the penetrating hole being divided into a first area having the first cooling fan disposed therein and a second area having the second cooling fan positioned therein, at least one protrusion having a volute shape formed on at least a portion of the second bracket or at least a portion of the partition,

Abstract: An assembly is provided for an electronic system. This electronic system includes a base and an electronic component. The base includes a base connector, a bay and a first guide. The first guide is arranged along a first side of the bay. The electronic component is configured to mate with the first guide and to move along the first guide within the bay to an installed position. The electronic component includes a component connector and a brake. The component connector is configured to couple with the base connector when the electronic component is at the installed position. The brake is engageable as the electronic component moves along the first guide to the installed position.

Abstract: An outdoor, hardened telecommunications clamshell platform includes a base half and a top cover half. The platform also includes a Printed Circuit Board (PCB) disposed between two cooling plates within the platform, and a heat distributing mechanism surrounding the PCB within the platform and configured to distribute heat substantially evenly between the base half and the top cover half.

Abstract: A heat dissipation module includes: a heat dissipation base material layer, provided with a first accommodating slot for accommodating a fingerprint sensor and a second accommodating slot for accommodating a flexible printed circuit, the fingerprint sensor being electrically connected to the flexible printed circuit, the first accommodating slot penetrating through the heat dissipation base material layer; and a light shielding buffer layer, on a side of the heat dissipation base material layer away from an opening of the second accommodating slot and provided with a hollowed-out area, an orthographic projection of the hollowed-out area on the heat dissipation base material layer being in the first accommodating slot, the hollowed-out area being configured to expose a photosensitive area of the fingerprint sensor, and the impedance of a surface of a side of the light shielding buffer layer away from the heat dissipation base material layer being 106?-1010?.

Abstract: A fan carrier includes a fan mounting section, a connector mounting section, and a connecting section. The fan mounting section is placed in physical communication with a fan of an information handling system. The fan mounting section has both structural rigidity and vibration rigidity. The connector mounting section is placed in physical communication with a fan-side connector of the information handling system. The connector mounting section has structural rigidity to properly align the fan-side connector with a motherboard-side connector of the information handling system. The connecting section is in physical communication with and located in between the fan mounting section and the connector mounting section. The connecting section has structural rigidity and vibration flexibility, and the vibration flexibility reduces vibrations from the fan before the vibrations are transmitted to the fan-side connector.

Abstract: A leak detection system for a server rack can include a detection channel that has a top region and a bottom region. The detection channel includes one or more openings at the top region. Each opening is to receive an outlet port of a server chassis installed in the IT rack. A cover for each of the one or more openings is arranged over the one or more openings when the outlet port is not present in the one or more openings and moves to allow entrance of the outlet port when the outlet port is inserted into the one or more openings. A fluid sensor for each of the one or more openings is arranged within the detection channel to detect a fluid that is deposited from the outlet port. Each fluid sensor is positioned within the detection channel to optimally detect presence of the fluid.