Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

Abstract: Provided is a cooling system for a power conversion device that includes a radiator, a radiator fan supplying air to the radiator, and a power conversion device including a plurality of electric components and a casing housing the plurality of electric components inside. The casing includes a base portion which is formed of a non-metallic material and on which the plurality of electric components is placed and a cover portion formed of a metallic material, fixed to the base portion, and covering a periphery of the plurality of electric components. A refrigerant channel through which a refrigerant cooling the plurality of electric components flows is formed in the base portion of the casing, and the casing is disposed at a position where an airflow of the radiator fan is applied to the cover portion.

Abstract: Disclosed are a display module and a method for manufacturing the same, and a display device. The display module includes: a display panel, a heat dissipation layer, a heat conduction assembly, and a driving chip, wherein the display panel includes a first part and a second part opposite to each other, and a bending part connecting the first part and the second part; the heat dissipation layer is disposed on a side, proximal to the second part, of the first part; the heat conduction assembly is disposed between the heat dissipation layer and the second part; an area of an orthographic projection of the heat conduction assembly on the first part is smaller than an area of an orthographic projection of the heat dissipation layer on the first part; and the driving chip is disposed on a side, distal from the heat conduction assembly, of the second part distal.

Abstract: An electronic apparatus with convenient airflow-reversing function includes a chassis, a rotation mechanism, a fan device, a connection rod, and a handle. The chassis includes a bottom plate. The rotation mechanism is pivoted on the bottom plate. The fan device is disposed on the rotation mechanism. The connection rod is pivoted on the rotation mechanism. The handle is pivoted on the chassis, and is rotatably connected to the connection rod. When the handle is rotated, the connection rod drives the rotation mechanism and the fan device to rotate to change the airflow direction.

Abstract: An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

Abstract: A liquid cooling system can be installed to an information technology (IT) rack. The liquid cooling system can include a cooling assembly that has a cooling chassis and cold plates fixed at a bottom portion of the cooling chassis. Fluid lines are arranged in an interior of the cooling chassis to fluidly connect the cold plates to a supply line and a return line. The cooling chassis includes an outlet port that provides a path for a leaked fluid to flow out of the cooling chassis. The outlet port is inserted into an opening of a detection channel that has one or more fluid sensors within the detection channel. The floor of the cooling chassis may have a shape or other features to assist flow of leaked fluid towards the outlet port to assist in depositing the leaked fluid in the detection channel.

Abstract: A mounting rail is provided that includes a DIN rail and one or more heating cable channels. A channel defined by the DIN rail may include one of the heating cable channels. Heating cables may be installed in the heating cable channels using adhesive and/or heat transfer material to form an electronics heating module. The heating cables may be self-regulating heating cables. The mounting rail may include multiple heat transfer fins that transfer heat generated by the heating cables to environment surrounding the mounting rail. A terminal block may be mounted on the DIN rail and may supply electric power to the heating cables.

Abstract: The disclosure provides an electronic control apparatus including a printed circuit board with a first surface side and a second surface side and with at least one electronic component that is arranged on at least one of the surface sides of the printed circuit board. At least one heat sink is arranged on the printed circuit board on the opposite surface side from the electronic component for the purpose of heat dissipation. The printed circuit board with the electronic component and the heat sink are surrounded by a casing made from a thermosetting plastic material such that at least one outer side of the heat sink is free of thermosetting plastic material.

Abstract: The present invention relates to a cooling system and method for regulating environmental conditions of a racked server unit having a plurality of server modules. The system comprises of an inlet line connected to a plurality of circulation conduits, wherein the plurality of circulation conduits receive a cooling medium from the inlet line, and the circulation conduits circulates the cooling medium through the racked server unit. A plurality of cold plates are positioned within the racked server unit, wherein one or more of the plurality of cold plates are thermally coupled to each of the plurality of server modules, and the plurality of cold plates are connected to one or more of the plurality of circulation conduits. An outlet line is connected to the plurality of circulation conduits, wherein the outlet line receives the cooling medium circulated through the racked server unit from the plurality of circulation conduits.

Abstract: Embodiments are disclosed of an apparatus including a utility section adapted to be positioned in a server chassis and coupled to an electronics section in the server chassis. The utility section includes a power board, a fluid handling module, a fan module electrically coupled to the power board, or both the fluid handling module and the fan module. An external power interface is adapted to electrically couple the power board to a rack power source and an internal power interface is adapted to electrically coupled the power board to one or more servers in an electronic section within the chassis. An external fluid interface is adapted to fluidly couple the fluid handling module to a rack fluid recirculation loops, and an internal fluid interface is adapted to fluidly couple the fluid handling module to a server fluid inlet and a server fluid outlet of each of the one or more electronics sections.

Abstract: A fanless cooling system for particularly fail-safe and efficient cooling of electronic modular systems in vehicles, more particularly in rail vehicles, includes a preferably frame-shaped rack or assembly carrier for holding at least one module or assembly, more particularly a processor module having high-performance multi-core processors. A heat transport body can be mounted in a heat-transferring manner on a part or component of the module. The rack has at least one heat distribution body, to which the heat transport body can be fastened in a heat-transferring manner, preferably detachably, when the module having the part coupled to the heat transfer body is held in the rack. At least one heat tube is connected to the heat distribution body in a heat-transferring manner. An electronic modular system with a fanless cooling system is also provided.

Abstract: A heat transfer device, including a sealed container defining an internal chamber having a first internal surface positioned opposite to a second internal surface, the sealed container including a first end and a second end positioned opposite to the first end; internal fins extending from the first internal surface of the internal chamber towards the second internal surface of the internal chamber, the internal fins positioned at the second end of the sealed container; a wicking structure positioned along the internal surfaces, and positioned between adjacent fins along the first internal surface such that the internal fins are in thermal communication with the wicking structure; a remote heat exchanger positioned along an external surface of the sealed container at the second end of the sealed container, the remote heat exchanger adjacent to the internal fins such that the remote heat exchanger is in thermal communication with the internal fins.

Abstract: An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.

Abstract: The present invention provides a heat dissipation conductive flexible board, which is assembled from: at least a single layer thin board, the structure of which includes a first conductive thin layer and a first functional thin layer, and at least a double layer thin board, the structure of which includes a second conductive thin layer, a second functional thin layer, and a third functional thin layer. A spraying, coating, or printing method is used to manufacture the single layer thin board and the double layer thin board; after which the single layer thin board and the double layer thin board are laminated together to form the heat dissipation conductive flexible board having a multi-layer conductive structure.

Abstract: In various embodiments, a wearable component configured to be worn on a head of a user is disclosed. The wearable component can comprise a wearable support and an electronic component coupled to or disposed within the wearable support. A thermal management structure can be provided in thermal communication with the electronic component. The thermal management structure can be configured to transfer heat from the electronic component away from the head of the user when the wearable support is disposed on the head of the user.

Abstract: An information technology (IT) enclosure may have a hybrid architecture. Such an enclosure may include an immersion tank that holds a single-phase coolant fluid. One or more servers may be immersed in the tank. The server chassis may have electronics that are thermally coupled to a two-phase fluid via a thermosiphon loop. The server chassis includes a condensing unit forming the thermosiphon loop and the condensing unit is submerged in the single phase fluid.

Abstract: A seismic shim for electronic equipment comprises a base comprising at least a first hole through the base, wherein the first hole is configured to receive a first fastener, and an extension portion extending from the base. The extension portion is perpendicular to the base and comprises at least a second hole through the extension portion, wherein the second hole is configured to receive a second fastener. The seismic shim also comprises a first gusset and a second gusset disposed between the base and the extension portion. The second gusset is spaced apart from the first gusset. The seismic shim is configured for anchoring to an underlying floor structure via the first fastener inserted through the first hole, and is configured for attachment to a surface of the electronic equipment via the second fastener inserted through the second hole.

Abstract: Embodiments relate to a system, an apparatus, and a method that involve a plurality of stackable enclosure units that include inter-unit or inter-module passages for facilitating cooling of interior compartments of the units, especially server units.

Abstract: Several transportable datacenters are described. The transportable datacenters include transport systems allowing them to be transported between an assembly location and an operating location. The transportable datacenters also include a ventilation system for cooling processors positioned in racks in the datacenters. The ventilation system draws cold air from the environment, through processor bays containing the processors and then exhausts the air back to the environment.

Abstract: Provided are a housing and an electronic device. The housing comprises a middle frame, a heat-conducting element and a protective member. The middle frame is provided with a first receiving area configured to receive an electronic component of an electronic device. The middle frame is further provided with an accommodating groove. The accommodating groove penetrates the middle frame and is communicated with the first receiving area. The heat-conducting element is accommodated in the accommodating groove. The protective member is at least partially accommodated in the accommodating groove, and is arranged at a side of the heat-conducting element that faces towards the first receiving area. In the embodiments, the protective member is opposite to or in contact with the electronic component arranged in the first receiving area, and separates the heat-conducting element accommodated in the accommodating groove from the electronic component arranged in the first receiving area.