Abstract: Examples herein describe memory lifecycle state sensors. A memory lifecycle state sensor includes a memory and a processor. The processor is configured to write a first value to a cell of the memory at a first voltage, and the cell is storing a second value written to the cell at a second voltage that is greater than the first voltage. A value is read from the cell and compared with the first value. An indication of a lifecycle state for the cell is generated based on comparing the value with the first value, the first voltage, and the second voltage.

Abstract: To program MRAM memory cells current must flow from the memory cell's corresponding bit line to its corresponding word line or from the word line to bit line. To accomplish this, the bit line and word line decoders must be capable of sourcing current (when driving a line positive) and sinking current (when pulling the line negative) to account the memory cell's bipolar nature. Consequently, the decoders must be bipolar. For the negative select switches NMOS devices are used and for the positive select switches PMOS switches are used. To reduce layout area and routing, the negative select switches and positive select switches are separately grouped, with a subset of the positive select switches located between subsets of the negative select switches and vice-versa. The connection for the decoder switches are routed to a central hook-up region for connection to the control lines of the cross-point array.

Abstract: One-time programmable (OTP) bit-cell for an integrated circuit (IC) that includes an OTP element, such as a fuse or antifuse, coupled in electrical series with a selector that comprises a Schottky junction. The selector may comprise a metal-semiconductor-metal (MSM) material stack operable as transient voltage suppression (TVS) device that experiences electrical breakdown at a voltage below a programming voltage of the OTP element. In response to a programming voltage, the MSM stack may breakdown and pass a transient current sufficient for programming the OTP element. In response to a lower (e.g., read) voltage, the MSM stack may breakdown and pass a transient current insufficient for programming, but sufficient to sense a state of the OTP element. In response to an even lower (e.g., half-read) voltage, the MSM stack may present a very high OTP bit-cell input impedance, reducing leakage and/or sneak path currents within an array of such bit-cells.

Abstract: Described herein is a memory bit-cell that results in lower leakage and higher sensing margin. In at least one embodiment, a memory bit-cell comprises a plurality of capacitors, wherein an individual capacitor is coupled to a node and an individual plate-line. In at least one embodiment, memory bit-cell comprises a first transistor coupled to the node. In at least one embodiment, memory bit-cell comprises a second transistor coupled in series with the first transistor, wherein the second transistor is coupled to a bit-line, wherein the first transistor or the second transistor is controllable by a word-line, and wherein the word-line is parallel to the individual plate-line.

Abstract: Multiple guard rows are included in a region of memory. Accesses to the region of memory are monitored and a revolver technique using the guard rows is enabled in response to the number of accesses to the region of memory equaling or exceeding a threshold amount within a given interval of time. The guard rows are moved around the region of memory with one or more non-guard rows being situated between the guard rows. A guard row refers to a row of the region of memory that stores invalid data, whereas the one or more non-guard rows store valid data. After being moved, accesses to the region of memory are monitored and after another threshold number of accesses to the region of memory the guard rows are moved again. This process continues with the guard rows being moved, e.g., in a circular manner, through the region of memory.

Abstract: A device includes a memory cell including a first transistor and a second transistor disposed on a frontside of a substrate, the substrate having a first area and a second area. The memory device includes a first interconnect structure disposed on a backside of the substrate. One S/D terminal of the first transistor is coupled to one S/D terminal of the second transistor, with the other S/D terminal of the second transistor coupled to the first interconnect structure through a first via structure in the first area. The memory device includes second via structures and a third via structure both disposed in the second area and each coupled to the first interconnect structure. The first via structure and the second via structures each have a cross-sectional area that is different from that of the third via structure.

Abstract: Examples of the present disclosure provide a memory device, memory system, memory controller and operating method thereof. The memory device includes a memory cell with multiple storage bits, a preset number of the memory cells form one code word, and the multiple storage bits correspond to multiple pages respectively. The multiple stages include a first stage and a second stage. The peripheral circuit of the memory device is configured to: obtain a predicted valley voltage in the first stage in accordance with the corresponding first result at the target read voltage in the first stage; obtain the predicted valley voltage in the second stage in accordance with the predicted valley voltage in the first stage; and perform a first read operation on at least one code word with the predicted valley voltage in the first stage and the predicted valley voltage in the second stage.

Abstract: A memory device includes several computing memory cells each storing a weight value and comprising a first and a second switch elements and a first and a second resistors. The first switch element receives a sensing current and a first input signal related to the input value. The first resistor selectively receives the sensing current through the first switch element in response to the first input signal. The second switch element receives the sensing current and a second input signal related to the input value. The second resistor selectively receives the sensing current through the second switch element in response to the second input signal. When the sensing current flows through the first resistor or the second resistor, the computing memory cell generates a first voltage difference or a second voltage difference corresponding to an output value equal to product of an input value and a weight value.

Abstract: In an apparatus, a memory controller, a memory device, and a method for switching frequencies of clock signals to reduce power consumption, when the memory device performs an internal operation according to a command of the memory controller, a frequency of a clock signal of the memory controller is changed. The memory controller switches the frequency of the clock signal to a low frequency according to assertion of a status signal that indicates a busy operation status of the memory device according to the command, and switches the frequency of the clock signal to a high frequency according to de-assertion of the status signal that indicates a ready operation status of the memory device.

Abstract: Embodiments of the present disclosure relate to a SRAM (static random access memory) bit cell. More particularly, embodiments of the present disclosure relate to a single port, 8T SRAM cell with write enhance pass gate transistors. Particularly, two write enhance pass gate transistors are parallelly connected with the pass gate transistors in a standard 6T SRAM cell. The write enhance pass gate transistors are independently controlled from the pass gate transistor using a write enhance word line. In some embodiments, the single port, 8T SRAM cell according to the present disclosure may be implemented by stacked complementary FETs. Empty or dummy PMOS transistors in a standard 6T stacked CFET SRAM cell are used as pass gate transistors or write enhance pass gate transistors.

Abstract: Described herein is a memory bit-cell that results in lower leakage and higher sensing margin. In at least one embodiment, a memory bit-cell comprises a plurality of capacitors, wherein an individual capacitor is coupled to a node and an individual plate-line. In at least one embodiment, memory bit-cell comprises a first transistor coupled to the node. In at least one embodiment, memory bit-cell comprises a second transistor coupled in series with the first transistor, wherein the second transistor is coupled to a bit-line, wherein the first transistor or the second transistor is controllable by a word-line, and wherein the word-line is parallel to the individual plate-line.

Abstract: Processing logic in a memory device receives a calibration scan command associated with the memory device. In response to the calibration scan command, execution of a set of read operations at a plurality of read voltage levels on the memory device is caused. In response to the calibration scan command, a set of bit counts is identified, where each bit count of the set of bit counts corresponds to a respective bin of a set of bins associated with the plurality of read voltage levels. Based on the bit count corresponding to each bin of the set of bins, a bin having a lowest bit count is identified.

Abstract: A memory device includes a memory cell array including a plurality of memory cells, a temperature sensor configured to measure an internal temperature and generate a temperature compensation code corresponding to the internal temperature, a voltage control circuit configured to generate a conversion temperature code converted from the temperature compensation code, and a voltage generation circuit configured to output a compensation voltage obtained by compensating for a level of a voltage used in an operation on the memory cell array responsive to the conversion temperature code. The temperature sensor and the voltage control circuit are may be located at different positions relative to the memory cell array.

Abstract: A stacked memory device (e.g., a high-bandwidth memory (HBM) device) having a storage component is disclosed. The stacked memory device can include a first logic die, one or more memory dies, a second logic die, and one or more storage dies. The first logic die is coupled with the one or more memory dies and the second logic die through TSVs. The second logic die is coupled with the one or more storage dies through additional TSVs. The first logic die can issue commands to the one or more memory dies that cause the one or more memory dies to perform operations (e.g., read/write operations). The first logic die can also issue commands to the second logic die that cause the second logic die to issue commands to the one or more storage dies to perform operations.

Abstract: The present disclosure configures a system component, such as memory sub-system controller, to perform empty page scan operations. The controller, in response to a request to perform an empty page scan operation, identifies a portion of a set of memory components that is empty and ready to be programmed. The controller generates an order in which to perform the empty page scan operation for a plurality of regions of the identified portion of the set of memory components. The controller determines whether a first region of the plurality of regions in the order fails the empty page scan operation before a second region of the plurality of regions is scanned. The controller terminates the empty page scan operation early to prevent performing the empty page scan operation for one or more remaining regions of the plurality of regions of the identified portion.

Abstract: Memory devices may be assigned enumeration values that uniquely identify the memory devices in a multi-memory device system. In some examples, the enumeration value is assigned by programming one or more fuses in the memory device. In some examples, a post-package repair operation may be used to program the fuses.

Abstract: A semiconductor device may include: a cell area in which a plurality of memory cells arranged in a first direction, a second direction and a third direction are disposed, the first direction and the second direction being parallel to an upper surface of a substrate and intersecting, and the third direction being perpendicular to the upper surface of the substrate; and a peripheral circuit area in which a word line driver connected to the plurality of memory cells through a plurality of word lines, a sense amplifier circuit connected to the plurality of memory cells through a plurality of bit lines, and a source line driver connected to the plurality of memory cells through a plurality of source lines, are disposed.

Abstract: A method for calibrating a read circuit of a magnetic memory device comprising the steps of setting resistances of first and second target resistors to a same value; setting resistances of first and second calibration resistors to a same minimum value; flowing a reference current through the first target resistor, the first calibration resistor, and a first input terminal of a sense amplifier in series; flowing a calibration current through the second target resistor, the second calibration resistor, and a second input terminal of the sense amplifier in series; determining a potential difference between the first and second input terminals; and if the second input terminal has a higher potential, incrementally increasing the resistance of the second calibration resistor until the first input terminal has a higher potential, or else incrementally increasing the resistance of the first calibration resistor until the second input terminal has a higher potential.

Abstract: In one embodiment, a semiconductor storage device includes a plurality of memory chips, at least one of the memory chips including a first controller configured to be shifted to a wait state of generating a peak current, before generating the peak current in accordance with a command. The device further includes a control chip including a second controller configured to search a state of the first controller and control, based on a result of searching the state of the first controller, whether or not to issue a cancel instruction for the wait state to the first controller that has been shifted to the wait state.

Abstract: An example non-transitory computer readable medium includes stored instructions which, when executed by a processor, cause the processor to convert an input clockwide pulse received from an upstream circuit running in a first clock domain into an output clockwide pulse that is synchronized to a second clock domain. The instructions further cause the processor to advance a count in response to the output clockwide pulse that is synchronized to the second clock domain.