Abstract: Computer memory systems employing localized generation of a global bit line (GBL) clock signal to reduce clock signal read path divergence for improved signal tracking, and related methods. The memory system includes one or more memory banks that each include a memory array comprised memory bit cells organized in respective memory row and memory column circuits. A global bit line (GBL) keeper circuit in a GBL control path in the memory system is coupled to the GBLs to latch output read data from a word line path in a selected memory row circuit of a selected memory bank in a read operation. To improve tracking of timing of the GBL control path with the word line paths in the memory row circuits, a GBL clock signal and local WL clock signal in a given memory bank are separately sourced from a source clock locally within the selected memory bank.

Abstract: A command control system is provided which is configured to optimally set an output timing of a RAS command and an output timing of a CAS command for access requests different from each other. The command control system is configured to, when an output timing of a second RAS command is set in a first cycle time period which is a cycle starting from the reference time point, determine whether or not the second RAS command is output to a storage device in the first cycle time period in accordance with whether or not an output timing of a first CAS command is set in a second cycle time period constituted by a prescribed number of the cycles subsequent to the reference time point.

Abstract: A system includes a memory device and a processing device operatively coupled to the memory device. The processing device is to receive a programming command with respect to a set of memory cells coupled to one or more wordlines of the memory device. The processing device is further to determine a value of a metric reflecting reliability of a subset of the set of memory cells. The processing device is further to determine a delay based on the value of the metric. The processing device is further to perform a programming operation with respect to the subset of memory cells. The programming operation includes the delay between a first pass of the programming operation and a second pass of the programming operation.

Abstract: The application relates to an architecture that allows for less precision of demarcation read voltages by combining two physical memory cells into a single logical bit. Reciprocal binary values may be written into the two memory cells that make up a memory pair. When activated using bias circuitry and address decoders the memory cell pair creates current paths having currents that may be compared to detect a differential signal. The application is also directed to writing and reading memory cell pairs.

Abstract: Disclosed is a method for accessing memory cells arranged in rows and columns. The method includes activating a specific row of the rows of the memory cells, and flipping data bits stored in memory cells of the specific row in response to determining that concentrated activation occurs at the specific row.

Abstract: A memory device includes a memory cell array connected to a plurality of wordlines and a plurality of bitlines; a row decoder configured to select a wordline, among the plurality of wordlines, in response to a row address; a column decoder configured to corresponding bitlines, among the plurality of bitlines, in response to a column address; a sense amplification circuit having a plurality of amplifiers connected to the selected corresponding bitlines; a row hammer detector configured to generate a refresh row address when the number of accesses to a row corresponding to the row address is a multiple of a predetermined value; and a refresh controller configured to perform a refresh operation on a row corresponding to the refresh row address. The row corresponding to the refresh row address is disposed adjacent to the row corresponding to the row address.

Abstract: A method includes applying a first voltage pulse across a memory cell, wherein the memory cell includes a selector, wherein the first voltage pulse switches the selector into an on-state; after applying the first voltage pulse, applying a second voltage pulse across the memory cell, wherein before applying the second voltage pulse the selector has a first voltage threshold, wherein after applying the second voltage pulse the selector has a second voltage threshold that is less than the first voltage threshold; and after applying the second voltage pulse, applying a third voltage pulse across the memory cell, wherein the third voltage pulse switches the selector into an on-state; wherein the selector remains continuously in an off-state between the first voltage pulse and the third voltage pulse.

Abstract: An N+ layer connects to the bottom portion of a Si pillar standing on a substrate 1 and an N+ layer connects to the top portion of the Si pillar. Of the N+ layer and the N+ layer, one serves as the source and the other serves as the drain. A region of the Si pillar between the N+ layer and the N+ layer serves as a channel region. A first gate insulating layer surrounds the lower portion of the Si pillar and a second gate insulating layer surrounds the upper portion of the Si pillar. The first gate insulating layer and the second gate insulating layer are respectively disposed in contact with or near the N+ layers serving as the source and the drain. A first gate conductor layer and a second gate conductor layer surround the first gate insulating layer. The first gate conductor layer and the second gate conductor layer are formed so as to surround the first gate insulating layer and to be isolated from each other. A third gate conductor layer surrounds the second gate insulating layer.

Abstract: In certain aspects, a memory device includes memory strings each including a drain select gate (DSG) transistor and memory cells, and a peripheral circuit coupled to the memory strings. The peripheral circuit is configured to, in a program/verify cycle, program a target memory cell of the memory cells in a select memory string of the memory strings, and after programming the target memory cell, verify the target memory cell using one or more verify voltages including an initial verify voltage. The peripheral circuit is also configured to compare the initial verify voltage with a threshold verify voltage so as to obtain a comparing result, and control, at least based on the comparing result, the DSG transistor in an unselect memory string of the memory strings between programming and verifying the targe memory cell.

Abstract: Some embodiments include an integrated assembly having a memory array over a base. The memory array includes a three-dimensional arrangement of memory cells. Sense amplifiers are associated with the base and are directly under the memory array. Vertically-extending digit lines pass through the arrangement of the memory cells and are coupled with the sense amplifiers. Some embodiments include an integrated assembly having a memory bank containing 64 memory chunks arranged in a 16×4 configuration. Some embodiments include an integrated assembly having a memory bank which contains 512 megabytes divided amongst 64 memory chunks which each have 8 megabytes. The 64 memory chunks are arranged in a configuration having multiple rows which each contain a two or more of the memory chunks.

Abstract: A memory device includes a memory block, peripheral circuit, and control logic. The memory block includes a plurality of pages coupled to a plurality of word lines, respectively. The peripheral circuit is configured to perform a program loop including a program pulse operation of applying a program voltage to a selected word line, and a verify operation of applying at least one verify voltage corresponding to the program voltage to the selected word line and applying a verify pass voltage to unselected word lines. The control logic is configured to increase a level of the verify pass voltage applied to at least one unselected word line among the unselected word lines whenever the peripheral circuit performs the next program loop when threshold voltages of memory cells included in a page coupled to the selected word line are greater than a reference level.

Abstract: A controller of a memory device may determine that an endurance parameter associated with a wear leveling pool of a memory of the memory device satisfies a threshold. The wear leveling pool includes a plurality of memory blocks of the memory. The controller may divide, based on determining that the endurance parameter satisfies the threshold, the plurality of memory blocks of the wear leveling pool into a first wear leveling pool subset that includes a first subset of the plurality of memory blocks and a second wear leveling pool subset that includes a second subset of the plurality of memory blocks. A first subset of a plurality of data partitions is stored in the first subset of the plurality of memory blocks, and a second subset of the plurality of data partitions is stored in the second subset of the plurality of memory blocks.

Abstract: A circuit includes a memory cell column coupled to a bit line pair and a write circuit that alternately biases a first end of the bit lines toward power supply and reference voltage levels in a write operation. Each of first and second switching circuits at second ends of the bit lines includes first and second logic circuits, each including an input terminal coupled to a corresponding bit line, and first and second switching devices, each including a gate coupled to the corresponding logic circuit. The first logic circuit and switching device couple the corresponding bit line to a power supply node simultaneously with the write circuit biasing the corresponding bit line toward the power supply voltage level, and the second logic circuit and switching device couple the corresponding bit line to a reference node simultaneously with the write circuit biasing the corresponding bit line toward the reference voltage level.

Abstract: A semiconductor integrated circuit has a reception circuit configured to receive a strobe signal of which a logic is intermittently switched in synchronization with a data signal, an output circuit configured to extract a low frequency component including at least a DC component of the strobe signal received by the reception circuit and to output a first signal, and a comparison circuit configured to compare a signal level of the first signal with a threshold level. The reception circuit is configured to change a boost amount of a high frequency component different from the low frequency component of the strobe signal based on a comparison result obtained by the comparison circuit.

Abstract: The address of victim rows may be determined based on rows that are accessed in a memory. The victim addresses may be stored and associated with a count for every time a victim row is “victimized.” When the count for a victim row reaches a threshold, the victim row may be refreshed to preserve data stored in the row. After the victim row has been refreshed, the count may be reset. When a victim row is accessed, the count may also be reset. The counts may be adjusted for closer victim rows (e.g., +/?1) at a faster rate than counts for more distant victim rows (e.g., +/?2). This may cause closer victim rows to be refreshed at a higher rate than more distant victim rows.

Abstract: Disclosed herein is an integrated circuit including multiple magnetic tunneling junction (MTJ) cells coupled to a static random access memory (SRAM). In one aspect, the integrated circuit includes a SRAM having a first port and a second port, and a set of pass transistors coupled to the first port of the SRAM. In one aspect, the integrated circuit includes a set of MTJ cells, where each of the set of MTJ cells is coupled between a select line and a corresponding one of the set of pass transistors.

Abstract: Disclosed is a DDR SDRAM signal calibration device capable of adapting to the variation of voltage and/or temperature. The device includes: an enablement signal setting circuit configured to generate data strobe (DQS) enablement setting; a signal gating circuit configured to generate a DQS enablement setting signal and a DQS enablement signal according to the DQS enablement setting and then output a gated DQS signal according to the DQS enablement signal and a DQS signal; and a calibration circuit configured to generate a first delay signal according to the DQS enablement setting signal and generate a second delay signal according to the first delay signal, the calibration circuit further configured to generate a calibration signal according to the first and second delay signals and the DQS signal. The enablement signal setting circuit maintains or adjusts the DQS enablement setting according to the calibration signal.

Abstract: The present disclosure provides a counter circuit and a memory. The counter circuit includes: a counting circuit configured to output a count value when the count value exceeds a predetermined threshold; a decoding circuit coupled to the counting circuit, and configured to decode the count value to obtain decoding information corresponding to the count value, where the decoding information represents a numerical interval in which the count value is located; and a comparison circuit coupled to the decoding circuit, and configured to compare the decoding information with historical maximum decoding information and latch and output current maximum decoding information.

Abstract: A memory device according to an embodiment includes a first interconnect, a second interconnect, a first variable resistance member, a third interconnect, a second variable resistance member, a fourth interconnect, a fifth interconnect and a third variable resistance member. The first interconnect, the third interconnect and the fourth interconnect extend in a first direction. The second interconnect and the fifth interconnect extend in a second direction crossing the first direction. The first variable resistance member is connected between the first interconnect and the second interconnect. The second variable resistance member is connected between the second interconnect and the third interconnect. The third variable resistance member is connected between the fourth interconnect and the fifth interconnect. The fourth interconnect is insulated from the third interconnect.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to word lines and disposed in memory holes organized in rows grouped in strings and configured to retain a threshold voltage. The memory cells are connected in series between a drain-side select gate transistor on a drain-side of each of the memory holes and a source-side select gate transistor on a source-side of each of the memory holes. A control means determines whether a downshift recovery trigger event has occurred in memory operations. In response to determining the downshift recovery trigger event has occurred, the control means inserts at least one of a predetermined idle time in the memory operations and a recovery pulse of a negative voltage to the drain-side select gate transistor of the memory holes of the strings for a predetermined pulse period of time during one of the memory operations.