Abstract: Control logic in a memory device initiates a read operation on a memory array of the memory device and performs a calibration operation to detect a change in string resistance in the memory array. The control logic determines whether the change in string resistance is attributable to charge loss in the memory array, and responsive to determining that the change in string resistance is attributable to charge loss in the memory array, preforms the read operation using calibrated read voltage levels to read data from the memory array.

Abstract: Apparatuses, systems, and methods for single-ended sense amplifiers. A memory device may include a number of sense amplifiers used to read the voltage of memory cells along digit lines. Double-ended sense amplifiers are coupled to two digit lines. Single-ended sense amplifiers are coupled to a single digit line. The memory cells of an edge word line of a memory array may alternately be coupled to a single-ended sense amplifier or a double-ended sense amplifier. The use of single-ended sense amplifiers may reduce a footprint for a given number of memory cells in the array.

Abstract: A semiconductor structure includes an SRAM cell that includes first and second pull-up (PU) transistors, first and second pull-down (PD) transistors, and first and second pass-gate (PG) transistors. A source, a drain, and a channel of the first PU transistor and a source, a drain, and a channel of the second PU transistor are collinear. A source, a drain, and a channel of the first PD transistor, a source, a drain, and a channel of the second PD transistor, a source, a drain, and a channel of the first PG transistor, and a source, a drain, and a channel of the second PG transistor are collinear.

Abstract: A memory device and a method for operating selective erase scheme are provided. In an erase operation, a switch voltage is applied to at least one of a string select line or a ground select line of a selected sub-block of a selected block, a gate control voltage is applied to selected word lines of the selected sub-block, and an erase voltage is applied to bit lines and a common source line of the selected sub-block. The switch voltage is smaller than the erase voltage. The gate control voltage is smaller than the switch voltage and the erase voltage.

Abstract: A cryogenic magnetic device includes a free layer having a free magnetisation and a magnetic anisotropy favouring the orientation of the free magnetisation according to a first orientation or a second orientation, the magnetic anisotropy being defined by an energy barrier separating the first orientation and the second orientation, the amplitude of the energy barrier being less than 6300 kB, the free layer having a Gilbert damping factor comprised between 0.02 and 0.4; a tunnel barrier extending in contact with the free layer; and a system configured to apply a voltage pulse through the tunnel barrier so as to reduce the amplitude of the energy barrier and switch the free magnetisation.

Abstract: A clock system and a memory are disclosed. The clock system includes a system on chip (SoC) configured to generate a first oscillation signal, a second oscillation signal, a third oscillation signal and a fourth oscillation signal of a same frequency and amplitude. Further, the clock system includes a memory chip configured to output a data signal based on signal edges of the first oscillation signal, the second oscillation signal, the third oscillation signal and the fourth oscillation signal, and output a command/address signal based on the signal edges of the first oscillation signal and the third oscillation signal. The signal edges are rising edges or falling edges.

Abstract: A controller is configured to program the memory cells to a first set of data states in a first programming pass and to a greater second set of data states in a second programming pass. The controller performs the first programming pass on the first word line. The controller then repeats the process of programming a portion of another word line and then comparing an upper tail of an erased data state of the first word line to a critical voltage until the upper tail of the erased data state of the first word line exceeds the critical voltage by a threshold. In response to the upper tail of the erased data state exceeding the critical voltage by the threshold, the controller then alternates between the first and second programming passes until the first programming pass is completed on the remaining word lines of the memory block.

Abstract: An anti-fuse memory: an inverting input terminal of an operational amplifier is connected to a feedback terminal of a bias voltage generation module. A voltage across a second input terminal may be obtained according to a voltage across the feedback terminal. The second input terminal is electrically connected to an output terminal of the operational amplifier. The voltage across the second input terminal serves as a bias voltage across a read module. A circuit between a second power supply terminal and the feedback terminal is equivalent to a circuit between a monitoring terminal and a first power supply terminal, and a circuit between the feedback terminal and an adjustable resistor is equivalent to a circuit between the monitoring terminal and an anti-fuse memory cell.

Abstract: Computer memory systems employing localized generation of a global bit line (GBL) clock signal to reduce clock signal read path divergence for improved signal tracking, and related methods. The memory system includes one or more memory banks that each include a memory array comprised memory bit cells organized in respective memory row and memory column circuits. A global bit line (GBL) keeper circuit in a GBL control path in the memory system is coupled to the GBLs to latch output read data from a word line path in a selected memory row circuit of a selected memory bank in a read operation. To improve tracking of timing of the GBL control path with the word line paths in the memory row circuits, a GBL clock signal and local WL clock signal in a given memory bank are separately sourced from a source clock locally within the selected memory bank.

Abstract: A system includes a memory device and a processing device operatively coupled to the memory device. The processing device is to receive a programming command with respect to a set of memory cells coupled to one or more wordlines of the memory device. The processing device is further to determine a value of a metric reflecting reliability of a subset of the set of memory cells. The processing device is further to determine a delay based on the value of the metric. The processing device is further to perform a programming operation with respect to the subset of memory cells. The programming operation includes the delay between a first pass of the programming operation and a second pass of the programming operation.

Abstract: A command control system is provided which is configured to optimally set an output timing of a RAS command and an output timing of a CAS command for access requests different from each other. The command control system is configured to, when an output timing of a second RAS command is set in a first cycle time period which is a cycle starting from the reference time point, determine whether or not the second RAS command is output to a storage device in the first cycle time period in accordance with whether or not an output timing of a first CAS command is set in a second cycle time period constituted by a prescribed number of the cycles subsequent to the reference time point.

Abstract: Disclosed is a method for accessing memory cells arranged in rows and columns. The method includes activating a specific row of the rows of the memory cells, and flipping data bits stored in memory cells of the specific row in response to determining that concentrated activation occurs at the specific row.

Abstract: The application relates to an architecture that allows for less precision of demarcation read voltages by combining two physical memory cells into a single logical bit. Reciprocal binary values may be written into the two memory cells that make up a memory pair. When activated using bias circuitry and address decoders the memory cell pair creates current paths having currents that may be compared to detect a differential signal. The application is also directed to writing and reading memory cell pairs.

Abstract: A memory device includes a memory cell array connected to a plurality of wordlines and a plurality of bitlines; a row decoder configured to select a wordline, among the plurality of wordlines, in response to a row address; a column decoder configured to corresponding bitlines, among the plurality of bitlines, in response to a column address; a sense amplification circuit having a plurality of amplifiers connected to the selected corresponding bitlines; a row hammer detector configured to generate a refresh row address when the number of accesses to a row corresponding to the row address is a multiple of a predetermined value; and a refresh controller configured to perform a refresh operation on a row corresponding to the refresh row address. The row corresponding to the refresh row address is disposed adjacent to the row corresponding to the row address.

Abstract: A method includes applying a first voltage pulse across a memory cell, wherein the memory cell includes a selector, wherein the first voltage pulse switches the selector into an on-state; after applying the first voltage pulse, applying a second voltage pulse across the memory cell, wherein before applying the second voltage pulse the selector has a first voltage threshold, wherein after applying the second voltage pulse the selector has a second voltage threshold that is less than the first voltage threshold; and after applying the second voltage pulse, applying a third voltage pulse across the memory cell, wherein the third voltage pulse switches the selector into an on-state; wherein the selector remains continuously in an off-state between the first voltage pulse and the third voltage pulse.

Abstract: An N+ layer connects to the bottom portion of a Si pillar standing on a substrate 1 and an N+ layer connects to the top portion of the Si pillar. Of the N+ layer and the N+ layer, one serves as the source and the other serves as the drain. A region of the Si pillar between the N+ layer and the N+ layer serves as a channel region. A first gate insulating layer surrounds the lower portion of the Si pillar and a second gate insulating layer surrounds the upper portion of the Si pillar. The first gate insulating layer and the second gate insulating layer are respectively disposed in contact with or near the N+ layers serving as the source and the drain. A first gate conductor layer and a second gate conductor layer surround the first gate insulating layer. The first gate conductor layer and the second gate conductor layer are formed so as to surround the first gate insulating layer and to be isolated from each other. A third gate conductor layer surrounds the second gate insulating layer.

Abstract: In certain aspects, a memory device includes memory strings each including a drain select gate (DSG) transistor and memory cells, and a peripheral circuit coupled to the memory strings. The peripheral circuit is configured to, in a program/verify cycle, program a target memory cell of the memory cells in a select memory string of the memory strings, and after programming the target memory cell, verify the target memory cell using one or more verify voltages including an initial verify voltage. The peripheral circuit is also configured to compare the initial verify voltage with a threshold verify voltage so as to obtain a comparing result, and control, at least based on the comparing result, the DSG transistor in an unselect memory string of the memory strings between programming and verifying the targe memory cell.

Abstract: A controller of a memory device may determine that an endurance parameter associated with a wear leveling pool of a memory of the memory device satisfies a threshold. The wear leveling pool includes a plurality of memory blocks of the memory. The controller may divide, based on determining that the endurance parameter satisfies the threshold, the plurality of memory blocks of the wear leveling pool into a first wear leveling pool subset that includes a first subset of the plurality of memory blocks and a second wear leveling pool subset that includes a second subset of the plurality of memory blocks. A first subset of a plurality of data partitions is stored in the first subset of the plurality of memory blocks, and a second subset of the plurality of data partitions is stored in the second subset of the plurality of memory blocks.

Abstract: Some embodiments include an integrated assembly having a memory array over a base. The memory array includes a three-dimensional arrangement of memory cells. Sense amplifiers are associated with the base and are directly under the memory array. Vertically-extending digit lines pass through the arrangement of the memory cells and are coupled with the sense amplifiers. Some embodiments include an integrated assembly having a memory bank containing 64 memory chunks arranged in a 16×4 configuration. Some embodiments include an integrated assembly having a memory bank which contains 512 megabytes divided amongst 64 memory chunks which each have 8 megabytes. The 64 memory chunks are arranged in a configuration having multiple rows which each contain a two or more of the memory chunks.

Abstract: A memory device includes a memory block, peripheral circuit, and control logic. The memory block includes a plurality of pages coupled to a plurality of word lines, respectively. The peripheral circuit is configured to perform a program loop including a program pulse operation of applying a program voltage to a selected word line, and a verify operation of applying at least one verify voltage corresponding to the program voltage to the selected word line and applying a verify pass voltage to unselected word lines. The control logic is configured to increase a level of the verify pass voltage applied to at least one unselected word line among the unselected word lines whenever the peripheral circuit performs the next program loop when threshold voltages of memory cells included in a page coupled to the selected word line are greater than a reference level.